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Template HTA General Assembly November 12 – 13, 2013. Contact: Christian Bosshard – CSEM cbs@csem.ch. Status Report - I. Platform / Roadmap / Flagship Title: Photonic Sensing and Integration Platform. Short Description:
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Template HTA General Assembly November 12 – 13, 2013
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - I Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Short Description: Photonics is accepted as a EU key enabling technology with components, sensor and systems providing a large potential for the European photonics market. This platform targets solutions for well known complex challenges: • to address all aspects from the device to the architecture • to include the design for assembly • to accommodate different types of devices (light sources, detectors, modulators,…) • to take care of a variety of materials (Si (CMOS), III-V semincoductors (lasers), glass,…) • to take into account the trade-offs in terms of costs, complexity and performance, e.g. optical SiP versus optical SoC.
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - II Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Status & Partners (institutes, departments, contact): CSEM: Christian Bosshard, Jacques Haesler, Jörg Pierer, Rolando Ferrini, Wolfgang Tschanun, Maurizio Tormen, Gilles Buchs VTT: Pentti Karioja, Mikko Juuti, Timo Alto, Mikko Karppinen, Anna Rissanen, Teemu Alajoki, Uula Kantojärvi Fraunhofer: Joachim Pelka, Thomas Otto (ENAS), Christian Motzek (Fraunhofer IIBS), Andreas Erdmann (Fraunhofer IIBS), Michael Scholles (Fraunhofer IPMS), Wladimir Tschekalimskij (Fraunofer IIS), Stephan Junger (Fraunhofer IIS), Alexander Weiss (ENAS), Norbert Weber (Fraunhofer IIS) CEA: Laurent Fulbert, Stephane Bernabe
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - III Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Vision, Mission, Strategy: Provide opportunities and solutions for the European photonics market including • the development of robust, reliable and low cost processes designed for devices/sensors and complete photonic systems • precision robot systems for automation, • manufacturing capabilities through the build up an extension of an infrastructure for process development and pilot and small series. Key devices such as Silicon MEMS and high-brightness light sources will be combined with 3D integration technologies to allow flexible manufacturing.
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - IVa Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Recent Activities (white papers, joint projects, joint PR, …) As a first step, the relevant techologies available within the HTA were categorized: • Light sources (lasers, LEDs, OLEDs,…) • Light processing (fibers, waveguides (Silicon, glass, poylmers), micro-(opto)-electromechanical systems (MOEMS),…) • Light filtering (wavelength filters, polarization filters) • Light detection (CMOS, wavelength range from UV to IR) • Assembly & integration (covering all aspects from flip chip bonding to microoptic and fiber assembly (active alignment), 3D integration, hermetic sealing, thermal management, Silicon photonics, automated assembly solutions, characterization and reliability testing) • The next layer: (sub)systems (optical sensing/diagnostics, spectrometers, atomic clocks,…)
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - IVb Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Recent Activities (white papers, joint projects, joint PR, …) • Successful presentation of the HTA photonic sensing and integration platform at the 8th ESA Round Table on Micro and Nano Technologies for Space Applications. • Data sheets of technologies and devices for internal use are in preparation. Based on these data sheets a simplified version with less details that will be available on the HTA website will be compiled later. • A workshop with the aim to prepare EU proposals for the last FP7 call was carried out: The list of topics were: • Si photonics and polymer waveguides • MEMS/MOEMS • Assembly & Integration • Lasers for industrial processing • Solid state lighting • Atomic clocks
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - IVc Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Recent Activities (white papers, joint projects, joint PR, …) Two successful projects: • ACTION: ACTive Implant for Optoacoustic Natural sound enhancement: CSEM (Christian Bosshard), VTT (Inger Vikholm-Lundin) • Large Area Solid State Intelligent Efficient luminaires: CSEM (Rolando Ferrini), FhG (IIS (Norbert Weber) + IISB (Andreas Erdmann)), VTT (Kimmo Keränen)(from brokerage event) Submitted, but not funded: • QIPC: Quantum Integrated Photonic Circuits: CSEM (Gilles Buchs), IAF (Christoph Nebel), CEA (Eva Monroy) • Remark: Project AGEN (Atomic Gyroscope for Enhanced Navigation) with CEA was accepted
Contact:Christian Bosshard – CSEMcbs@csem.ch Status Report - IV Platform / Roadmap / Flagship Title:Photonic Sensing and Integration Platform Next steps: • Brokerage event (for H2020) focused on the platform • Data sheets • Web page • A workshop with industry to present the capabilities (will be organized at a later stage)