Pb-Free Electronics Risk Management (PERM)

1. Pb-Free Electronics Risk Management (PERM)

2. What PERM is: • A Consortium sponsored by the Aerospace Industries Association (AIA) • Includes industry and government organizations with a common interest • in managing the risks of Pb-free electronics in Aerospace, Defense, and • other High Performance (ADHP) industries • Evolved from merger of GEIA’s Lead-free Electronics in Aerospace Project • (LEAP) WG and the DoD Executive Lead-free Integrated Process Team (ELF • IPT) • Purpose • Provide a long-term overall ADHP strategy to deal effectively with Pb-free • electronics issues • Resulting in a coordinated approach to manage the evolving risks from • the global electronics industry transition to Pb-free electronics • Strategy • Technical knowledge: Identify sources of information, including research • projects, to understand the issues and risks associated with Pb-free • electronics, and establish the knowledge base to manage and mitigate • them • Requirements: Develop common requirements to manage ADHP use of • Pb-free electronics • Implementation: Implement the requirements across the links of the • supply chain that are within ADHP control • Verification: Develop and implement criteria and processes to verify that • the requirements are being verified

3. Deliverables: • GEIA-HB-0005-1: Program Management/Systems Engineering Guidelines For • Managing The Transition To Lead-Free Electronics • GEIA-HB-0005-2: Technical Guidelines for Aerospace and High Performance • Electronic Systems Containing Lead-free Solder and Finishes • GEIA-HB-0005-3: Rework/Repair Handbook to Address the Implications of Lead-Free • Electronics and Mixed Assemblies in Aerospace and High • Performance Electronic Systems • GEIA-STD-0005-1: Performance Standard for Aerospace and High Performance • Electronic Systems Containing Lead-free Solder • GEIA-STD-0005-2: Standard for Mitigating the Effects of Tin Whiskers in Aerospace • and High Performance Electronic Systems • GEIA-STD-0005-3: Performance Testing for Aerospace and High Performance • Electronic Interconnects Containing Pb-free Solder and Finishes • GEIA-STD-6: Requirements for Using Solder Dip to Replace the Finish on Electronic • Piece Parts • AIA Issue Paper: Reliability Assessment of Lead-free Electronics in the Aerospace, • Defense and High Performance Electronics Industries • Pb-Free Electronics “Manhattan Project” • Captured current “Best Practices” • Identified issues and short-comings needing resolution • Established a 3 year Roadmap for research & development projects

4. Current Efforts: • Performing maintenance of previously released GEIA HBs & STDs • GEIA-HB-0005-4: Guidelines for Performing Reliability Assessment for Pb Free • Assemblies used in Aerospace and High-Performance Electronic • Applications (Currently in DRAFT) • Pb-free Electronics Risk Reduction Project • Follow-on effort to “Manhattan Project” • Working with OSD to identify / prioritize projects for funding • Coordination efforts: • OSD Technology Focus Team • Identify/prioritize projects • Encourage release of policy • DSPO LSA For Soldering Technologies • DoD Soldering Technologies WG • AIA Supplier Management Council (SMC) • Engaging piece/part manufacturers to address platform integration and • system development concerns • Beneficiaries Advisory Council • Represent the US Departments of Defense, Energy, and Transportation, • NASA, FAA and relevant industry organizations • International Advisory Group (International Beneficiaries) • Non-U.S. Governments, Agencies, Companies, and Academia