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Post-DAC Towards LOI

Post-DAC Towards LOI. DAC review was very favorable Encouraged to seek DOE construction funds To get on mass-shell for possible DOE FY05 construction $ we need to submit LOI to DOE by March 03 include summary of LOI in BNL FWP, Feb 24 DOE $ may or may not be there

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Post-DAC Towards LOI

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  1. Post-DAC Towards LOI • DAC review was very favorable • Encouraged to seek DOE construction funds • To get on mass-shell for possible DOE FY05 construction $ we need to • submit LOI to DOE by March 03 • include summary of LOI in BNL FWP, Feb 24 • DOE $ may or may not be there • capital expenditure is a possible “replacement” of AEE line

  2. LOI • Physics-case, performance, technology, schedule / budget • Boundary conditions • cost to DOE < $5M, starting FY05 • cost to RIKEN, $3M starting JFY04 (April ’04?) • Key decisions to be made before LOI deadline • what can be built for < $8M • what de-scoping maintains the most physics

  3. Process • Three parallel tracks of work for next weeks • cost estimates for everything (next slides) • which combinations are feasible constrained by costs, boundaries • e.g. barrel largely via RIKEN, endcap via DOE • two staged DOE projects, e.g. first $5M towards barrel, 2nd later $xM for endcaps • commitments from groups to say what they will work on • Weekly Si meetings, weekly reports to Phenix management, finally a DC meeting?

  4. Immediate Task • Estimate costs, valid at LOI level, but these have a long-life…. • Two paths: individual items and scaling from comparable projects • Costs for all construction items • both RIKEN/DOE estimates to figure out how to spend $8M • separate out R&D costs and construction costs • i.e pre FY05 and post FY05 costs • R&D $ and leverage of other $, e.g. LDRD ORNL, LANL • match possible construction plan, e.g. possible application of LANL LDRD towards endcap electronics • First report next Thur 23,7pm • first report due in to Phenix management Fri Jan 24 • list of proposed responsibilities next page

  5. Costs • Mechanical, Dave Lee, Hideto • both HYTEC or in-house engineers (BNL/RIKEN) • Si strips, sensors Yuji • Si strips, readout (SVX4) + FEM->Phenix, Vince • Si pixel barrel ALICE1 sensor+hybrids+bump+thinned via VTT, Yuji • Si pixel barrel LHCBPIX1 sensor+hybrids+bump+thinned via FNAL, Craig O • Si pixel FEM->Phenix, Axel • Si pixel-endcaps, sensor+hybrids non-thinned, Pat/Dave • Beam-pipe, Dave • Systems integration, slow controls, Craig W? • Scaled from comparable systems, Craig O

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