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Status of the Tracker Outer Barrel

Status of the Tracker Outer Barrel. J. Incandela University of California Santa Barbara for the illustrious TOB Group Tracker General Meeting October 26, 2005

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Status of the Tracker Outer Barrel

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  1. Status of the Tracker Outer Barrel J. Incandela University of California Santa Barbara for the illustrious TOB Group Tracker General Meeting October 26, 2005 Slides courtesy of D. Abbaneo,A. Affolder, P. Baht, C. Campagnari, Y. Gotra, J. Lamb, S. Kyre, A. Onnela, A. Satpathy, L. Shabalina, J. Spalding, L. Spiegel, D. White, and others…

  2. US Module Assembly • Current inventory of components sufficient for > 2-3 weeks production • 1.3% F grade modules are mostly very near to spec. (usually the angle between sensors exceeds spec slightly)

  3. Module Assembly Planning • FNAL: • Last week increased to 15 TOB modules/day. • Storage capacity is very tight • Summary tables can be viewed at http://cmsdb.fnal.gov. • November: ramp to 18 TOB modules/day. • Goal: Finish TOB modules end of January • Need to understand quantity of spares to be built. • Then: Transition to TEC R7 • Rod assembly will continue through April. • UCSB • Last week 18 modules/day • This week 21 modules/day • Also to do: bias connections on some 1,400 modules. • Wire bonding and ARCS operations (but not LT).

  4. FNAL Plans for TEC Production • FNAL preparing to build ~700 TEC R7 modules • Beginning early next year. • The UCSB R7 Gantry assembly plate design has been modified for use on the FNAL Gantry • expect first of 6 assembly plates by end of year. • Other fixtures and plates – for hybrid testing, hybrid and module bonding, storage and shipping – will be constructed from existing designs. • Once established, production will take about 10 weeks. • FNAL plans closer contact with the TEC community. • At some point it would be helpful to receive some non-qualified or spare sensors, hybrids, and frames for R7 modules.

  5. Module Bias Connections • Solder gold-kapton extension tabs to unused vias on TOB frames. • Glued down with TRD 1100 (Ag Epoxy following (during) Gantry assembly at FNAL (UCSB) • Then wirebond to backplanes (15 bonds per sensor) • Bonds encapsulated with Sylgard 186 • The application of silver epoxy (single drop) and scratching of sensor backplanes as part of the traditional Gantry assembly is unchanged.

  6. Existing Module Bias Connections • Plan to use an insulated wire for some already fabricated modules. • Wire is connected to a gold-kapton tab that spans the two sensors. • Some 1400 modules may require this modification • FNAL expanding work force to retrofit 24 modules/day.

  7. Bias bond encapsulation • For the detailed procedure see: http://hep.ucsb.edu/cms/cms_procedures/tec-encapsulation-procedure.pdf • For the drawings of UCSB designed tools see: http://hep.ucsb.edu/cms/mechanical.html • A talk describing the procedures is available from the bonding working group agenda this week,.

  8. Delays in rod and pedal assembly have made module storage a critical issue and UCSB and FNAL. TEC modules: 4 more boxes are being built at UCSB to help alleviate the problem. (~20 are available for shipping currently) It is critical that boxes received in Europe are unloaded and returned to UCSB. TOB modules: ~2800 modules currently in storage at UCSB and FNAL New storage capacity for roughly 1000 more by the end of the month. This includes building module storage plates. (Recently built 1300). More may have to be fabricated. US Module Storage

  9. US Hybrid Testing Status

  10. Hybrid Testing • Both sites now have a fast PC working, run time is shortened by another 10 minutes. • FNAL Tested/Thermal cycled 171 hybrids this week…A US Record • With present conditions we can test 444 hybrids a day. • Best day was 10/21 with 48 hybrids tested.

  11. US ARCS Testing Status

  12. UCSB ARCS Testing Results

  13. US ARCS Testing Status

  14. US ARCS Testing Status

  15. US ARCS Testing Status

  16. US ARCS Backplane Testing

  17. US LT Testing

  18. Riverside Repair Center • Test modules with fully functional ARCS and LT test stand • Visually check modules with shorts / pinholes etc. • Sometimes I2C FEC error occurs during LT run - possibly due to inadequate shielding of the cables. To be sorted out soon • Developing a probe station that can troubleshoot bad hybrids at low Temps • Received some bad modules/hybrids from Fermilab & UCSB to test and understand problems. Troubleshooting them now. Work Done Work in Progress Future plans

  19. Rod Status - UCSB and FNAL • In the past couple of weeks, while waiting for ICC cards to start production, the two sites have focused on slightly different issues • FNAL: testing of new SW (FEC V3, Scientific Linux, Lt V30) • UCSB: production exercise to shake down remaining operational issues • Fine-tuned scenario to match 4 rods/day rate • Freezer takes max 8 SS4, 6 SS6, 4 DS  need one day scenario (so much for long term  ) • Only two thermal cycles WCWCW • CalProfRuns only with inverter-on to save time • Added HV cycling at each temperature • This is not working reliably, may have to ditch

  20. General • 4 sets (2/site) of OFECs in transit from CERN • FNAL will "commission" this system first; UCSB will follow when it works  • First batch of ICC cards for 25 rods also in transit • ½ FNAL, ½ UCSB • Will mount on existing rods, then put modules on rods, then test, then ship. ASAP

  21. FNAL Status (1) • Over 30 production scenarios run on MRT since July 2005 • 50 SS6 rods and four DS4 rods were assembled (using jumpers on pre-production ICC cards), tested and burned-in • Migration of rod test software running on Red Hat Linux 7.3 with FEC Software V1 to Scientific Linux 3.0.5 with FEC software V3 was successful • Long term testing with latest release of the FEC Software showed good stability of software and the control ring (1 upload/download error in 24 hours with 4 DS4 rods) • Latest release of the LtStruct (v30) was extensively tested with a number of production scenarios with Single Sided and Double Sided rods

  22. FNAL Status (2) • First batch of 12 new (production grade) ICC cards were shipped from CERN to FNAL and are expected to arrive this week • Plan for assembling of the first 12 production rods has been prepared • Optical FECs are expected to arrive this week. Test stands will be upgraded and tested with new hardware while the first production rods are assembled • We will need new rod frames to arrive not later than the second shipment of production ICC cards

  23. UCSB Production Exercise: Mechanical • Built 24 rods last week (22 SS6, 2 DS) • Warmup 1st two days, then built 4 rods/day • Bottom line: OK • Some Issues: • Dirty rod boxes, Al dust • Will tape lips of boxes with kapton tape, avoid friction, dust • All boxes will be in plastic sleeve for shipping • Need to understand desiccants • Tail bending a la FNAL: OK. • ICC cards swap: adds 20-30 minutes/rod • DS rods: worry about exposed non-encapsulated bonds • Now designing a cover with cutouts for ICC cards. Will enable handling of connectors and cables with minimal risk of smashing bonds

  24. UCSB Production Exercise: Testing • 20/24 rods through SRT • Mounted some modules with known pinholes • Flagged them without a problem  • 1st MRT scenario OK, 2nd failed • Failure in newly introduced HV cycle. • CAEN got stuck. Not a new problem. • A couple of laser failures (?) – Very worrisome… • Some noise oddities to be investigated • Some ICC/header errors. • Hopefully will be better with new SW, new OFEC • (Almost) successful 1st upload of rod XML file to DB • Need some small name changes

  25. UCSB Production Exercise: Short Term Plans • Stop making rods • We learned what we needed to learn • Continue exercising testing cycle

  26. TOB Integration • Procedure  being tested with pilot cooling segment • Rod insertion: ~30-60 min x N rods • Functional test per control loop [could be dropped at some point?] • Solder cooling connections per rod: ~30-60 min x N rods • He leak test per cooling loop • Dress cables, Dbase entries etc…: ~30-60 min x N rods • DAQ test per control loop • Initially: N = 1 cooling segment. Once confident: N = 1 layer. • Organization • Ramp up to 7-day 24-hour operation • Two 3-person tech shifts per day (3 crews of 3 for 7-day coverage) • Two testing crews covering night shifts • 1st Tech crew now in place, 2nd one identified for Dec, will need 3rd in Jan • Once operation is smooth may be able to add 1 tech per crew and work on both ends of TOB • Schedule: Ramp up Dec+Jan, complete by May • estimate should improve after experience with pilot segment

  27. TOB Cooling Segments

  28. Pilot Integration Test • Purpose • Primary: Test the procedures and fixtures, and guide any improvements • Secondary: Confirm staffing plan and improve schedule estimate • Plan • Use Rods with old IC cards • Install and test 19 rods in the top segment of layer 6- • Remove them again (confirm our ability to replace rods after insertion) • Status • All 19 rods have been inserted (17 by technician crew) • A first round of tweaks were made to the fixturing, further improvements to aid efficiency are under discussion • A test of soldering the cooling line connections using a single rod was successful • Next steps are to connect and test the cooling for the 19 rods this week, and to start electrical testing next week • Expect to be ready to start integration with final rods by end Nov • Need to design/build the work platform for installation of layers 1-5 inside TST – platform is not trivial, will be needed by January

  29. Fixture Installing A Rod in Side Position

  30. Installing At the Top

  31. Summary & Conclusions • Module production back to high levels. • Should complete TOB by February • Rod Production a little dicey still • Have learned numerous critical lessons • Need more experience – will get it very soon • Integration studies underway • Again, many important lessons learned • Generally things appear to be in good shape • Establishing additional qualified manpower will be critical to schedule and quality • These are very critical times • Must maintain high standards and not drop our guards

  32. Tracker Monitoring Workshop • Jointly @ Fermilab and CERN via video • Organizers: Lisa Shabalina (U. Illinois at Chicago), Pushpa Bhat (FNAL), Slawek Tkaczyk (currently at CERN) • Tentative Date/Time: • Tuesday, Nov. 15, 2005 • 8 AM – 12:30 PM (Fermilab); 3-7:30 PM(CERN) • Venue@Fermilab: Sunrise room, WH11 • Venue@CERN: 40-5-A01 in Bldg. 40 • Preliminary Agenda: • 2-3 talks on CDF/DØ experience • 1 talk on CMS Tracker integration/commissioning • 2 Talks -- xDAQ, DQM and visualization tools • 1 talk on HCAL remote data analysis/monitoring

  33. Tracker Monitoring Workshop • Goals: • To find out what CDF and DØ learned during commissioning/tests of 800k channel silicon detectors for Run 2; what tools worked, what wasn’t useful, what would have helped • What xDAQ, DQM software and tools exist for CMS tracker monitoring? • The focus of this workshop is on tools for integration and commissioning of the tracker - to figure out how to help those efforts using existing tools and/or by developing dedicated tools and with remote monitoring/analysis. Pushpa and Lisa will produce a written summary/outcome of the workshop

  34. Additional Information

  35. US Module Assembly Plates We are now setup to process at most15 plates (20 plates) per day (extended day). A much larger number of plates was prepared to allow us to adapt to whatever variations may occur in component deliveries and tracker needs.

  36. US Production Cycle Wire bond Wire bond Quick test hybrids on ARC Thermal cycle hybrids Gantry makes modules. Final pinhole test on ARC Thermal cycled module Modules test on ARC Assemble rods from modules Rods shipped to CERN Rod burn-in

  37. US Production Steps/Status DAQ Component shortages and/or failures can limit production testing capacity in future

  38. UCSB TEC Production • Module Production • R5N, R5S, R6 and R7 • All TEC production equipment is commissioned • General capacity issues • Can (and likely will) saturate our capacity with TEC production • Actual rate depends on need and availability of parts as well as TOB production parts availability and schedule • Bonding and Testing capacity adequate • LT testing : eventually be mostly TEC if necessary (since TOB burn-in will be shifted to rods) AND sampled

  39. (Semi) long term test ~ 2 days 6-8 SS rods/load Thermal cycle Full channel level characterization Multi Rod Test-stand (MRT) FNAL UCSB

  40. Current MRT test cycle Warm Test Cold Warm Cold Test Warm Test Cold Test Warm Test Expected to evolve…

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