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Rui de Oliveira TS-DEM

Large size detectors CERN TS-DEM-PMT Capabilities. Rui de Oliveira TS-DEM. Contents. Large size GEM Process and present limitations at CERN Quality control Bulk Micromegas Process and existing equipment possibilities at CERN Quality control THGEM Process and present limitation at CERN

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Rui de Oliveira TS-DEM

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  1. Large size detectorsCERN TS-DEM-PMTCapabilities Rui de Oliveira TS-DEM

  2. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  3. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  4. Raw material Chemical conical single mask Single side Copper patterning Chemical Polyimide etching Chemical Copper reduction

  5. Raw material Resist lamination UV exposure GEM production 100 meter x 500mm 100 meter x 600mm 2 meter x 600mm Drying GEM Resist development 2 meter x 600mm 2 meter x 450mm 2 meter x 600mm Micro-etch Polyimide etch Copper etch 2 meter x 600mm 2 meter x 600mm 2 meter x 600mm

  6. Biggest GEM produced this year2 GEMs glued together 650mm 650mm

  7. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  8. Quality control • Microscope optical measurement • on several points on the GEM • Copper hole : 70 ± 2 μm • Polyimide hole : 55 ± 5 μm • High voltage test • < 10nA @ 600V for 100mm x 100mm • @ 35%HR max And… *new* Light Transmission measurement

  9. Light transmission measurement Good quality GEM A: 70 μm copper hole, 47 μm polyimide hole Transmission = 9.5% ± 0.5% max over all surface Bad quality GEM B: 83 μm copper hole, 55 μm polyimide hole Transmission = 13.5% ± 4% max over the all surface

  10. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  11. Micromegas Bulk Read-out board Laminated photoimageable coverlay Stretched mesh on frame Laminated photoimageable coverlay Frame Exposure, development and curing

  12. Stretched mesh 1500 x 500 Laminator 600 x 1500 Exposure 2000 x 600 With present equipment Development 600 x1500 Detector 1500 x 500 Milling 1500 x 600 Oven 1500 x 500

  13. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  14. QUALITY CONTROLBed of nails Probe needles Detector Locating pins Test: current < 20 nA @ 800V @ 35% HR max No standard tool for test!

  15. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  16. Copper THGEM production description Raw material CNC drilling Small rim if needed Electrodes etching

  17. Practical limits ThGEMs at CERN • Raw material : 2000mm x 1000mm • Drilling area : 700mm x 600mm • Drilling cadence : 1 hole per second • Tool life : 10000 holes with 2 sharpenings • Small rim etching : 1500mm x 800mm • Electrode patterning : 2000mm x 600mm • Possible Detector size : 700mm x 600mm • 116 hour drilling time for 1mm pitch with 1 head drilling machine

  18. Contents • Large size GEM • Process and present limitations at CERN • Quality control • Bulk Micromegas • Process and existing equipment possibilities at CERN • Quality control • THGEM • Process and present limitation at CERN • Read out boards • Structure and limitation at CERN • Conclusions

  19. Read-out board Single sided: 2000mm x 600mm Double sided: 1500mm x 400mm Multi-layer: 600mm x 500mm!

  20. ConclusionCERN capabilities (2008) • GEM : 2.0 meter x 450 mm • Micromegas Bulk : 1.5 meter x 500 mm • ThGEM : 0.7 meter x 600 mm • Read-out board : 0.6 meter x 500 mm for multi-layer!

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