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Test Results of Assembled Type 1 Modules

Test Results of Assembled Type 1 Modules. Carla M. Vale Phobos Coll. Meeting, 31 Jul 1998. Tests Performed on the Modules. Calibration Chips’ status Gain Dead channels Source Test Noise Hit Distribution Pad Signal Distribution Signal/Noise. Settings 1 V fp = -350 mV

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Test Results of Assembled Type 1 Modules

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  1. Test Results of AssembledType 1 Modules Carla M. Vale Phobos Coll. Meeting, 31 Jul 1998

  2. Tests Performed on the Modules • Calibration • Chips’ status • Gain • Dead channels • Source Test • Noise • Hit Distribution • Pad Signal Distribution • Signal/Noise

  3. Settings 1 Vfp = -350 mV Vfs = 700 mV Ipre = 6.0 mA Isha = 168 mA Ibuf = 140 mA tpeak = 1.6ms Average gain: ~ 3.5 mV/fC VA analog current/line (*) =1.1mA/fC Settings 2 Vfp = -550 mV Vfs = 700 mV Ipre = 6.0 mA Isha = 168 mA Ibuf = 280 mA tpeak = 1.6ms Average gain: ~ 5.2 mV/fC VA analog current/line (*) =1.6mA/fC CalibrationTests (*) =gain/3.235 mV/mA By using “Settings 2”, we eliminate undershoot in the signal, improving gain and signal/noise.

  4. Calibration on Module1-0005 Set-up effects Dead channels Calibration done using“Settings 2”

  5. Calibration on Module1-0005 Calibration done using“Settings 1”

  6. Noise: with C.M.N. correction dead channels: shorted lines <Noise> = 0.23 fC = 1440 e-

  7. Noise: without C.M.N. correction  C.M.N = 0.9 mV ~ random noise

  8. Source Test on Module1-0005 “gaps”  pad geometry

  9. SourceTest: Signal Peak Signal = 20 mV Peak signal (mV) / Gain (mV/fC)= 20 / 5.2 = 3.8 fC ~ 1 MIP

  10. Source Test: S/ N Peak S/N = 16.5

  11. Test Results on Assembled Modules

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