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Integration in pots Testing (incl. cooling) beam ?

Test Results Thermo- mechanical prototype. Consolidate design Consolidate design produce drawings. Xmas closure. Mechanical components order CE07 parts fabricate special parts prepare pipework / feedthroughs (incl. leak test) fabricate interface card flanges fabricate pot hats

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Integration in pots Testing (incl. cooling) beam ?

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  1. Test Results Thermo- mechanical prototype Consolidate design Consolidate design produce drawings Xmas closure • Mechanical • components • order CE07 parts • fabricate special parts • prepare pipework / • feedthroughs • (incl. leak test) • fabricate interface • card flanges • fabricate pot hats • (Vacuum Praha) • follow-up / reception conceptual tests Geometrical precision test Temperature Cycling of thermomechanical prototype Internal Review • Tooling • gluing tools • bonding tools • detector assembly tools • pipework bending/testing tools availability sensors (tested) availability interface card (tested) availability hybrid PCB/VFAT (tested) Full Integrated Module (10 planes + complete electronics). Extended lab tests. Beam test ? Preparation work area holiday period • Hybrid • lamination • Chip • mounting/ • bonding • Testing detectorpot insertion tool • Sensor • mounting/ • bonding • Testing • Detector • assembly • Metrology • Integration • in pots • Testing • (incl. cooling) • beam ? end of installation in tunnel • Installation • in zone

  2. DT2 D Test Results Thermo- mechanical prototype Consolidate design Consolidate design produce drawings X-mas closure DT2 D DT2 D/T • Mechanical • components • order CE07 parts • fabricate special parts • prepare pipework / • feedthroughs • (incl. leak test) • fabricate interface • card flanges • fabricate pot hats • (Vacuum Praha) • follow-up / reception conceptual tests Geometrical precision test Temperature Cycling of thermomechanical prototype TOTEM Internal Review TOTEM DT2 D/T TOTEM • Tooling • gluing tools • bonding tools • detector assembly tools • pipework bending/testing tools availability sensors (tested) availability interface card (tested) availability hybrid PCB/VFAT (tested) DT2 2T Full Integrated Module (10 planes + complete electronics). Extended lab tests. Beam test ? TOTEM Preparation work area Bondlab TOTEM holiday period DT2 T • Hybrid • lamination • Chip • mounting/ • bonding • Testing detectorpot insertion tool • Sensor • mounting/ • bonding • Testing 1D, 1T • Detector • assembly • Metrology • Integration • in pots • Testing • (incl. cooling) • beam ? end of access to underground areas TS/DEM • Installation • in zone Bondlab Bondlab TOTEM 2T TOTEM TOTEM 2T TOTEM 2T

  3. Consolidate design produce drawings Internal Review • optimize alignment pins • optimize detector mounting • optimize guidance blades • optimize cooling pipe routing • interface card flange • Kapton cable, connectors • drawings for tooling (gluing, bonding, assembly)

  4. conceptual tests • insertion procedure of detector assembly into pot • (requires to build a transparent dummy pot)

  5. Geometrical precision test • provide components • n x CE07 parts • n x Kapton PCB • n x Si sensors • finalize tooling • laminate Kapton on substrate  PCB • glue Si sensor  decide on glue ! • glue PCB on side bars using 3D-CMM • assemble planes to module • perform metrology test • perform temperature cycling (-30 / + 50ºC, env. test chamber) • redo metrology

  6. Full Integrated Module (10 planes + complete electronics). Extended lab tests. Beam test ? • provide components • 10 x CE07 parts • 10 x Kapton PCB • 10 x VFAT chip set • 10 x Si sensors • motherboard • readout system • dummy pot • DAQ system • test under vacuum ?  cooling required ! • assemble full module, with maximum precision (to be defined in detail) • Lab tests (source ?) • Beam test ? • temperature cycling (env. test chamber)

  7. Preparation work area • semi clean area SCA (~50 m2) • temp. / humidity restrictions ? Not severe. • safe storage compartments • safe transport boxes • protective and other equipment (gloves, masks, coats, alcohol, tools, …) • test benches (VFAT, IV-curve, Roman Pot, cooling) • organize logistics: TS-DEM  Bondlab  SCA  Bondlab  SCA …

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