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A 0.18µm High Dynamic Range NTSC/PAL Imaging SOC with Embedded Frame Buffer. Adopted from paper in ISSCC2003 by: W. Bidermann, A. El Gamal*, S. Ewedemi, J. Reyneri, H. Tian, D. Wile, D. Yang ASIC Class presentation By: Mehdi Salmani 810182062 Spring 2004. Agenda. Introduction Definitions
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A 0.18µm High Dynamic RangeNTSC/PAL Imaging SOC withEmbedded Frame Buffer Adopted from paper in ISSCC2003 by: W. Bidermann, A. El Gamal*, S. Ewedemi, J. Reyneri, H. Tian, D. Wile, D. Yang ASIC Class presentation By: Mehdi Salmani 810182062 Spring 2004
Agenda • Introduction • Definitions • References
Introduction • The CMOS imaging system-on-chip includes an embedded frame buffer and operates at 100 MHz. The programmable chip produces color video at up to 500 frames/s with over 100 dB dynamic range using multi-capture. The sensor utilizes a 0.18 um 1 P 4 M CMOS process and dissipates 600 mW including I/O.
Definitions • Dynamic Range • LVDS
Dynamic Range • Some scenes contain very wide range of illumination with intensities varying over 100dB range or more • Biological vision systems and silver halide film can image such high dynamic range scenes with little loss of contrast information • Dynamic range of solid-state image sensors varies over wide range: • high end CCDs > 78dB • consumer grade CCDs 66dB • consumer grade CMOS imagers 54dB • So, except for high end CCDs, image sensor dynamic range is not high enough to capture high dynamic range scenes
Dynamic Range 2 • Dynamic range quantifies the ability of a sensor to adequately image both high lights and dark shadows in a scene • It is defined as the ratio of the largest nonsaturating input signal to the smallest detectable input signal
Multiple Capture Issue • Dual capture implementation not too difficult (plenty of time between the two captures to readout the first capture • Multiple capture implementation is quite difficult, needs: • Very high speed non-destructive readout • On-chip memory and some logic to perform reconstruction of HDR image during capture
LVDS • Low-voltage differential signaling (LVDS) as the name suggests is a differential Interconnectivity standard: • low voltage swing of approximately 350 mV to communicate over a pair of traces on a PCB or cable. • superior immunity to noise • low power • low cost
References • http://www.national.com/analogu/lvds, 4-June-2004. • “An Overview of LVDS Technology”, National Semiconductor, Application Note 971, Syed B. Huq, John Goldie, July 1998. • http://www.xilinx.com/esp/networks_telecom/optical/xlnx_net/lvds.htm, 4-June-2004. • http://www-isl.stanford.edu/~abbas/group/, 4-June-2004.