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Visual inspection results on ASI Timepix wafers

Visual inspection results on ASI Timepix wafers. 3 rd August, 2012 Hannele Heikkinen VTT Technical Research Centre of Finland. Visual inspection summary 1/3. Visual inspection done for four ASI Timepix wafers arrived at VTT on 29 th June 2012: # KUNXNXT # KSNXTET # KGNXY5T # K4NXNMT

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Visual inspection results on ASI Timepix wafers

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  1. Visual inspection results on ASI Timepix wafers 3rd August, 2012Hannele Heikkinen VTT Technical Research Centre of Finland

  2. Visual inspection summary 1/3 • Visual inspection done for four ASI Timepix wafers arrived at VTT on 29th June 2012: • # KUNXNXT • # KSNXTET • # KGNXY5T • # K4NXNMT • The wafers were not probed at ASI, but some chips on all wafers were probed at IBM.

  3. Visual inspection summary 2/3 • Results: • A lot of residues and dirt. The wafers have always particles, resist residues etc. but this time the wafers were particularly dirty. • Most of the residues have a size of one or few pixels, but also larger residues. • Number of dirty and/or damaged areas per chip: 0…4. • Number of dirty and/or damaged areas per wafer: 27…98. • # KUNXNXT worst with 98 reported dirty and/or damaged points. • The origin of the impurities and damages unknown. Also the composition of the impurities unknown.

  4. Visual inspection summary 3/3 • At least some damages originate from the IBM processing (see slides 5 and 6) • Possible sources for the dirt and residues: handling of the wafers at any stage and the shipping packages. • Dirt may also originate from the probing at IBM. • The visual inspection is the first step at VTT; most probably the dirt has already been on the wafers when arriving to VTT. • The wafers have been cleaned by oxygen plasma and solvents after the visual inspection at VTT. The cleaning didn’t help much. Either extra cleaning with plasma didn’t help the situation. • Pictures on the dirt and damages on following slides.

  5. Damages from IBM processing 1/2

  6. Damages from IBM processing 2/2

  7. Dirt and residues 1/3

  8. Dirt and residues 2/3

  9. Dirt and residues 3/3

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