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Learn about LHCb Silicon Tracker Readout Electronics production process, evaluation, integration with hardware, and performance analysis. Includes details of preproduction, digitizer board, Beetle chip, and radiation qualification.
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Production of the LHCb Silicon Tracker Readout Electronics A. Vollhardt, EPF Lausanne/Switzerland
Outline • Overview of the Readout Electronics • 1st preproduction of Digitizer Board • Evaluation of performance • Integration with LHCb hardware • 2nd preproduction • Conclusion A. Vollhardt, EPF Lausanne/Switzerland
LHCb Silicon Tracker principle • Two distinct tracking systems based on silicon strip detectors, read out via the BEETLE chip • TT: full acceptance angle covered upstream of magnet • IT: only area of highest track densities around beampipe A. Vollhardt, EPF Lausanne/Switzerland
Beetle readout chip • 128 channel charge integrator • polyimide readout hybrid carries 3 (IT) or 4 (TT) Beetle chips for sensors of 384 (IT) or 512 (TT) strips See also: • Talk of F. Lehner: Hybrid Design, Procurement and Testing for the LHCb Silicon Tracker A. Vollhardt, EPF Lausanne/Switzerland
ST Readout electronics A. Vollhardt, EPF Lausanne/Switzerland
low-voltage power Service Box Overview sensor + readouthybrids 5m copper cable Optical fibres for physics data Digitizer Board up to 16 hybrids/boards Digitizer Board Control Card backplane TTC ECS A. Vollhardt, EPF Lausanne/Switzerland
Digitizer Board characteristics • 6 layer PCB, halogen-free, 1.6 mm thickness, symmetric stack • single side mounting, no buried/blind vias • smallest feature size 6 mil, smallest package 0603 • 5 BGA devices: 1x CS49 (0.8 mm pitch), 3-4x BGA144(1.0 mm pitch) • no JTAG chain , no boundary scan • differential traces have controlled impedance/length • standard commercial connectors • NO tuning points • layout optimized for low-cost, high-yield, easy testing 2 versions: Trigger Tracker (4-chip readout), Inner Tracker (3-chip readout) A. Vollhardt, EPF Lausanne/Switzerland
1. Preproduction run • 17 boards produced and electrically tested in late 2004(TT version) • after assembly, all BGAs X-rayed: all solder joints ok! • 2 bugfixes:wrong reference voltage for line receiverAuto-Sync FPGA: shift register one cycle (25ns) too short • all boards except one immediately working:board #10 had ripped via under BGA (fixed) changes for IT version preproduction (and final production): • changed VCSEL biasing • added QPLL RC-network for improved jitter stability A. Vollhardt, EPF Lausanne/Switzerland
Digitizer Board • Power <5 W • Only positive voltages: 2.5 V, 5.0 V A. Vollhardt, EPF Lausanne/Switzerland
Beetle signal at ADC • Flat top 15 nsec wide (of 25 nsec max.) • measured with 5m twisted pair cable • plenty of ‘space’ to set ADC sampling point A. Vollhardt, EPF Lausanne/Switzerland
Linearity A. Vollhardt, EPF Lausanne/Switzerland
Sampling synchronicity I • supply all 16 inputs with ‘synchronous’ testpulse:testpulse generator sourcing 16 LVDS drivers • move sampling time by using TTCrx clock phase shifters (just like in experiment..) • transmit data via GOL+ optical fibres to DACs and scope • record pulseheight of sampled edge vs. programmed delay A. Vollhardt, EPF Lausanne/Switzerland
Sampling synchronicity II A. Vollhardt, EPF Lausanne/Switzerland
GOL VCSEL connection • VCSEL forward voltage with 2.5V anode voltage results in too low GOL current driver voltage level • only 2.5V and 5V available • reduced to 3.3V by low-impedance divider • blocked at VCSEL with 100nF||100pF A. Vollhardt, EPF Lausanne/Switzerland
Eye diagram after 100m • Thanks to Paolo Ciambrone/LHCb Muon A. Vollhardt, EPF Lausanne/Switzerland
Auto-sync Beetle analogue output • Beetle DataValid signal (almost) in parallel to analogue data to frame a triggered event • done via shift register in Actel antifuse FPGA (small version of rad-hard AX54SX32) incl. TMR+ majority voting • Results in at least one IDLE frame per event Beetle DataValid Beetle data after digitization DataValid after 200 ns delay A. Vollhardt, EPF Lausanne/Switzerland
Radiation qualification • Expected radiation levels for Service Box location for 10 years:TID 15 krad, NIEL 2E12 n/cm2 • all commercial devices individually radiation qualified (TID, NIEL and SEE) with proton and neutron irradiation according to LHCb radiation policy • System test: TT Digitizer Board + backplane re-tested in June 2005 with 60 MeV protons to 60 krad (PSI, Switzerland): • analogue test pattern injected • verification of function and performance • no variations in module operation observed A. Vollhardt, EPF Lausanne/Switzerland
Full Readout test A. Vollhardt, EPF Lausanne/Switzerland
Full Readout test • LHCb-style readout (except LHCb Readout Supervisor + CPU farm) A. Vollhardt, EPF Lausanne/Switzerland
Control Card • Under development by Universidade de Santiago de Compostela • Provides TTC signals and slow control interface to each Service Box and its associated frontend electronics • First prototype functional (still being tested) A. Vollhardt, EPF Lausanne/Switzerland
Breaking News: IT version • 10 Digitizer Boards (IT version preproduction) were delivered last Wednesday • initial testing confirm out-of-the-box functionality • important step: re-validate eye diagram with new VCSEL bias! A. Vollhardt, EPF Lausanne/Switzerland
Next steps • detailed testing of IT prototypes: last design verification • launch production order after: • production+assembly time for all boards: ca. 8-10 weeks • all parts available except for VCSELs (LHCb common order placed, expected in November) • ‘bird-food’ supplied by company, special components by us • start setting up test bench during production:basic functionality test (go-nogo)burn-in test (catch infant mortality) A. Vollhardt, EPF Lausanne/Switzerland
Conclusion + Outlook • The preseries production for both versions of the ST Digitizer Board has been completed. • Bugfixes and lessons learned in the TT version were successfully included in the IT version. • Required functionality was verified and system compatibility with common LHCb hardware has been shown. • Preseries hardware is used to form teststands for the TT sensor module production (Zuerich) and the IT sensor production (CERN) • Final qualification pending, design will be released for full production in Q4/05. A. Vollhardt, EPF Lausanne/Switzerland
SPARE SLIDES A. Vollhardt, EPF Lausanne/Switzerland
2.5 V 3x 1 kW differential signal from Beetle Vref (ca. 1 V) Output to GOL serializer 10 kW 39 W Vcm out + 22 W TSA0801 2x 100 nF AD8129 8 bits out - 100 nF 39 W gain: 11 gain: 0.22impedance: 100 Ohm Digitizer Board input stage • Bandwidth: 1.6 kHz (AC-Coupling) to 170 MHz (AD8129) • Amplifier output range matches ADC input range A. Vollhardt, EPF Lausanne/Switzerland
Clock tree A. Vollhardt, EPF Lausanne/Switzerland
TFC distribution • Impedance controlled traces for LVDS signals • TTL traces only used for short (~ 2 cm) for fanning out • equal trace lengths to minimize ch-ch skew A. Vollhardt, EPF Lausanne/Switzerland
Service Box: frame • Fully loaded weight: ca. 10 kg • Power disipation: ca. 150 W (70 W into mixed water cooled heatsink) A. Vollhardt, EPF Lausanne/Switzerland
Service Box cooling • all linear regulators located close to each other • use common copper heatsink (mixed water) to cool all at once • isolate ground slug of regulator package (local ground!) • used for testing: CPU water cooling system: no active cooler, but fan-blown heat-exchanger • Test at full load results in 35 degC case temperature for 25 degC water (=ambient temperature) A. Vollhardt, EPF Lausanne/Switzerland
IT mounting • Service Boxes outside acceptance • Mounted on common IT station frame • ‘5m copper cables’ no not move • cables from Service Box away from detector move (cable chains) A. Vollhardt, EPF Lausanne/Switzerland
TT mounting • Service Boxes mounted outside acceptance to magnet • ‘5m copper cable’ guided in cable chains to station halves • cables away from Service Box fixed in cable trays A. Vollhardt, EPF Lausanne/Switzerland