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Environmental, Safety and Health Chapter ITRS 2008

Environmental, Safety and Health Chapter ITRS 2008. Hans-Peter Bipp – Infineon Mark Denome – Applied Materials George Hoshi – TEL Shigehito Ibuka - TEL Jim Jewett – Intel Joey Lu – TSIA Mike Mocella - DuPont Andreas Neuber – Applied Materials Takayuki Ohgoshi – NEC Electronics

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Environmental, Safety and Health Chapter ITRS 2008

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  1. Environmental, Safety and Health ChapterITRS 2008 Hans-Peter Bipp – Infineon Mark Denome – Applied Materials George Hoshi – TEL Shigehito Ibuka - TEL Jim Jewett – Intel Joey Lu – TSIA Mike Mocella - DuPont Andreas Neuber – Applied Materials Takayuki Ohgoshi – NEC Electronics Ron Remke - ISMI Harry Thewissen - NXP Tetsu Tomine – Seiko-Epson Munetsugu Yamanaka - TEL ESH ITWG Jim Jewett

  2. Impact to Technology from ESH Policy ESH Requirements Influence Impact EvolvingTechnology

  3. Prioritization of ESH Requirements Critical - Essential item for the implementation and success of the technology Enabling - Important item for the implementation and success of the technology Improving - Useful item for the implementation and success of the technology

  4. Facility power consumption reduced Delete redundant information Considers Recycling/ reclaim rate Needs review in 2009 Work needed Proposed Changes to TableH2O Site water consumption reduction is the primary target – ensures sustainable growth of the semiconductor industry

  5. 2009 Challenges • Reorganize requirements to topical focus from functional area focus • Table ESH3a Chemicals and Materials Management Technology Requirements • Hazard, POPs, New chemicals, Nano • Table ESH4a Process and Equipment Management Technology Requirements • PFC, Energy, Material utilization • Table ESH5a Facilities Energy and Water Optimization Technology Requirements • Energy, Waste, Emission impact • Table ESH6 Sustainability and Product Stewardship Technology Requirements • Green Fab • Adjust scope on Factory requirements (wafer size vs. functionality) • 450mm, new 300mm and Existing factories with new technology • Additional 2009 Challenges • Supplementary Material (Scope Documents) • ERM/ESH Material Table

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