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Faradaic™ Process Technology Estate. Edge & Surface Finishing. Robust Control. Enhanced Performance. Industrial Coatings. Electronics MEMS Photonics Industries. Faradaic ™ Process. Cost Effective. Environmentally Benign. Environmental Countermeasures. Patent Estate. Patent Estate.
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Faradaic™ Process Technology Estate Edge & Surface Finishing Robust Control Enhanced Performance Industrial Coatings Electronics MEMS Photonics Industries Faradaic™ Process Cost Effective EnvironmentallyBenign Environmental Countermeasures
Patent Estate Leveling: Electronics, MEMS, Photonics 1. “Pulse Reverse Electrodeposition for Metallization and Planarization of Semiconductor Substrates”, U.S. Patent No. 6,203,684 March 20, 2001 (application #09/172,299 October 14, 1998.) 2. “Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Modulated Electric Fields”, U.S. Patent No. 6,210,555 April 3, 2001 (application #09/239,811 January 29, 1999.) 3. “Electrodeposition of Metals in Small Recesses Using Modulated Electric Fields”, International Patent Pending (United States designated) – application #PCT/US99/23654– filing date 14 October, 1999. 4/5. “Sequential Electrodeposition of Metals Using Modulated Electric Fields for Manufacture of Circuit Boards Having Features of Different Sizes” (includes provisional application for “Electrochemical Metallization for Multiple Feature Sizes”) – U.S. Patent Pending – application number 09/419,881 – filing date 18 October, 1999. 6. “Electrodeposition of Metals in Small Recesses for Manufacture of High Density Interconnects Using Modulated Electric Fields”, U.S. Patent Pending – CIP of application #09/239,811– application #09/553,622 - filing date 20 April, 2000. 7. “Pulse Reverse Electrodeposition for Metallization and Planarization of Semiconductor Substrates”, U.S. Patent Pending – CIP of application #09/172,299 – application #09/553,623 - filing date 20 April, 2000. 8. “Electrodeposition of Metals in Small Recesses Using Modulated Electric Fields”, U.S. Patent Pending – CIP of application #PCT/US99/23654 – application #09/553,616 - filing date 20 April 2000. 9. “Electrodeposition of Metals for Forming Three Dimensional Microstructures” U.S. Patent Pending 09/688,377 – filing date 17 October 2000. 10. “Sequential Electromachining and Electropolishing of Metals and the Like Using Modulated Electric Fields” 09/688,378 – filing date 17 October 2000.
Patent Estate Industrial Coatings 1. “Electroplating of Metals Using Pulse Reverse Current for Control of Hydrogen Evolution”, U.S. Patent Pending – application #08/871,599 – filing date 9 June, 1997. NO FOREIGN FILED 2.“Electrodeposition of Catalytic Metals Using Pulsed Electric Fields”, U.S. Patent #6,080,504 June 27, 2000 (application #09/184,247 November 2, 1998). FOREIGN FILED 3. “Electrodeposition of Catalytic Metals Using Pulsed Electric Fields”, International Patent Pending – application #PCT/US99/25611 – filing date 2 November, 1999.
Patent Estate Edge & Surface Finishing 1. “Electrochemical Machining Using Modulated Reverse Electric Fields”, U.S. Patent Pending – application #09/080,264 – filing date 18 May, 1998. NO FOREIGN 2. “Removal of Sacrificial Cores by Electrochemical Machining”, U.S. Patent Pending – application #09/200,959 – filing date 30 November, 1998. ALLOWED FOREIGN FILED 3. “Removal of Sacrificial Cores by Electrochemical Machining” (includes CIP claims for near-net shape applications), International Patent Pending (United States designated) – application #PCT/US99/28176 – filing date 30 November, 1999.
Patent Estate Environmental Countermeasures 1. “Electrolysis of Electroactive Species Using Modulated Current”, U.S. Patent #5,599,437 February, 4 1997 (application # June 20, 1995). NO FOREIGN 2. “Method of Removing Metal Salts from Solution by Electrolysis Using an Electrode Closely Associated with Ion- Exchange Resin”, U.S. Patent #5,804,057 September, 8 1998 (application # 09/659,926 June 7, 1996). NO FOREIGN 3. “Electrokinetic Removal of Heavy Metal Contaminants from Solid Porous Materials”, U.S. Patent Pending – application #08/928,585 – filing date 12 September, 1997. ABANDONED DUE TO LACK OF FUNDING 4. “Sealing Ring with Electrochemical Sensing Electrode”, U.S. Patent #5,865,971February, 2 1999 (application # 09/822,706 March 21, 1997). NO FOREIGN