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Test TWG Noordwijk 2012. Attendees Roger Barth, Stefan Eichenberger,Shawn Fetterolf, Dave Armstrong, Hermann Obermeir, Hirokazu Hirayama, Bill Eklow. Highlights and Challenges. Session Highlights “TSV clarifications ” 2.5D: present focus, interposers
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Test TWG Noordwijk 2012 Attendees Roger Barth, Stefan Eichenberger,Shawn Fetterolf, Dave Armstrong, Hermann Obermeir, Hirokazu Hirayama, Bill Eklow
Highlights and Challenges • Session Highlights • “TSV clarifications” • 2.5D: present focus, interposers • 3D: TSV financial model??, viable production always 3 years out • Common: die-die performance matching for packaged product tuning, cooling, yield?, reliability?, TSV clusters & stresses, test recipe under development • Integrated or interconnect optical still too far out for actions • Highly Homogeneous Multi Core / Accelerator Engines fit discussion • MEMs and RF test requirements • Characterization, sampling and production test requirements • Adaptive test future directions • 2012 / 2013 Challenges • 2.5 / 3D devices • DFT / BISx via new methods • 3rd party review of test chapter by users and universities • Cost, adaptive test, probing table updates,logic table refinement • Concurrent test table addition?