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Tunnel Electronics Baseline Issues

Tunnel Electronics Baseline Issues. Snowmass Workshop August 25, 2005 Ray Larsen for SLAC ILC Group. Outline. Motivation: Cost Reduction Risks: Radiation Damage, Lower Availability Fy2000 Study New Developments Proposed R&D Baseline Recommendations. NLC Cost Reduction Study Fy2000.

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Tunnel Electronics Baseline Issues

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  1. Tunnel Electronics Baseline Issues Snowmass Workshop August 25, 2005 Ray Larsen for SLAC ILC Group

  2. Outline • Motivation: Cost Reduction • Risks: Radiation Damage, Lower Availability • Fy2000 Study • New Developments • Proposed R&D • Baseline Recommendations Tunnel Electronics R.S. Larsen

  3. NLC Cost Reduction Study Fy2000 • Lehman cost model: 1 Tunnel - Alcoves every 235m • Electronics near sensors in concrete wall “TEE’s” • Eliminate long-haul cables • Sacrificial short-hauls (pigtails) • Protect COTS electronics against gammas, neutrons • Serial digitized data out on copper, fiber • Consider Wireless for slow data, Robotics servicing • BPMs, LLRF, vacuum pumps-gauges-valves, magnet movers, temperature, MPS-BCS-PPS... • Gigabit links to next level - BW not an issue. Tunnel Electronics R.S. Larsen

  4. TEE Basic Models**Preliminary - S. Rokni & S. Roessler Tunnel Electronics R.S. Larsen

  5. Tunnel Electronics R.S. Larsen

  6. Fy2000 Results • Radiation protection “would likely work” • Concrete wall depth marginal– extra bumps easy if casting. Civil cost not estimated. • Packaging, cooling seems feasible • All connectors on module rear for robotic remove/replace • RF coax plug-in connectors a major issue • Robotic economic study done (J. Cornuelle w/ Stanford ME dept.) – seems feasible. • Significant cost reductions possible Tunnel Electronics R.S. Larsen

  7. Lehman ($253K) vs. CD 0.4 ($118K) TEE Cost Reduction$135M (53%) Tunnel Electronics R.S. Larsen

  8. Two versions for MK Access every n Km Lateral penetrations every ~40 m for short WG or cable feeds Fig. A:Instrumentation in Aux. Tunnel, long cables to sensors Fig. B:Instrumentation in Beam Tunnel, short cables to sensors, data cables to Aux tunnel ILC Proposed Tunnel ModelsDual Shallow or Deep Tunnels Cables I,M (X) KB (A) Cables + WG MK (X) I, B (B) Tunnel Electronics R.S. Larsen

  9. 2-Tunnel Model w/~Penetrations ~6in. Penetration Module Tray Tunnel Electronics R.S. Larsen

  10. ILC Linac Instrumentation (~40m) ~1m ATCA Standard Module Tunnel Electronics R.S. Larsen

  11. Proposed New StudyIn-Tunnel Instrumentation • 2-Tunnel instrument model never estimated. • Radiation modeling for electronics just starting • New state-of-art circuit, packaging models needed • BPMs, LLRF, tuners, movers, cryo temperature, vacuum, etc. • Standard module designs, mezzanine cards, hot swap • Robotic module replacement Tunnel Electronics R.S. Larsen

  12. New Commercial Developments Since Fy2000 • High density plug connectors up to 5 GHz available (ATCA) – interface on rear adapters • High Availability standard architectures (ATCA) • Hot swap modules demonstrated (ATCA) • New cooling options available including liquid leak-less plugs on backplane (Rittal, ATCA) • Gigabit communications w/ embedded processor chips, $5 Wireless chips, high speed 12-14 bit sampler ADC-DAC commodity products, more to come….. • Cannot afford to NOT explore latest technologies. Tunnel Electronics R.S. Larsen

  13. Baseline Recommendation • BCD R&D: • Re-model all systems to state-of-art electronics, HA packaging, communications • Estimate BCD model - all electronics in Auxiliary tunnel, short penetrations to beam tunnel (10m) at ~40m • ACD R&D: • Redefine tunnel packaging, protection scenarios for cold machine, COTS electronics • Study Rad-Hard design for vac-ion pumps • Study Robotics maintenance model • Re-estimate potential cost-availability benefits Tunnel Electronics R.S. Larsen

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