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Update on Simulation and Sensor procurement for CLICPix prototypes

Update on Simulation and Sensor procurement for CLICPix prototypes. Mathieu Benoit. Outline. Possible prototype HV-CMOS with Ivan Peric VTT Active edges sensors Microns/MPI HLL sensor Sensor processing ( Thinning ) Simulation CLICpix model Deployement to lxbatch

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Update on Simulation and Sensor procurement for CLICPix prototypes

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  1. Update on Simulation and Sensorprocurement for CLICPix prototypes Mathieu Benoit

  2. Outline • Possible prototype • HV-CMOS with Ivan Peric • VTT Active edgessensors • Microns/MPI HLL sensor • Sensorprocessing (Thinning) • Simulation • CLICpix model • Deployement to lxbatch • Digitizationstrategy • Someresults

  3. Prototypes • Timepix3 not availablebefore the end of nextyear • Wecantakeadvantage of the commonfootprint for medipix1,2,3 and timepix1,3 to beginthinking about producingsensors to studyvariousproperties • Variousthickness • Implant size

  4. Varying implant width • Pulse risetime, charge sharing canvaryaccording to E Field distribution in pixel cell

  5. VTT Sensor production

  6. Edgeprocessing

  7. VTT Summary

  8. HV-CMOS Active diodes • Pros • Thindepleteddepthallows for thinningwithoutpaying in Signal to noise ratio • Capacitive coupling (no bumpbonding) • Some intelligence canbe put on sensor • ATLAS is planning a MPR in 180nm process for HV-CMOS sensors • Total runcost : 157k€ • 28 masks (6 Metallayers, MiMCapacitor, deep-nwell) : 126k€ • 8x 8’’ wafers 19.8k€ • Die size 21 x 21 mm • Ivan has agreedthat a medipix-like structure couldbeplanned in the production, but wouldonlycover part of the timepix chip • Detection diode + Preamplifier • Capacitive coupling (glue) • Possibility to do sub-pixelisation (ATLAS like) • Sub-pixels withdifferent gain and pedestal • Pixel ID isdeterminefromToT Value • Cons • Gluingprocedureneed test withthin structure, withsensorsmallerthan chip (UMB bumpspresent?) • Preamp power need to beprovided to sensor • New PCB, double sidedwire bonds • Glue might not bemechanicallyreliable, or radiatino hard

  9. Timepixbalcony Active area HV-CMOS Timepix : 14.08x14.08mm active area 16.120mm x 14.111mm total area HV-CMOS : 4x2mm chip, bonding 1mm from chip edge

  10. Microns Semiconductors • Possibility to do dedicatedrun or to participatewith UK partners in MPR • ExperiencewithMicrostrips for D0, PHENIX, BRAHMS, HERMES, LHCb VELO • Experiencewith ATLAS FE-I3 and FE-I4 pixel sensors

  11. MICRONS Summary

  12. MPI HLL • MPI HLL developped a process to producethinsensor (75um) produced in house. • First experiencewiththinstripsensorencouraginghttps://indico.cern.ch/getFile.py/access?contribId=14&sessionId=4&resId=0&materialId=slides&confId=114255 • SLID interconnecttechnologyalsoavailable • Possibility of MPR unknown, but feasablewithadequate input of money

  13. Thinning (Chip)

  14. Thinning (Chip)

  15. Thinning (Chip)

  16. Thinning (Sensor) • Sensorthinningis more delicate • Eachsideneed a mirrorpolish finish • (grinding, then 9um grain, 3um grain, 1 um grain, colloidal solution (Nalco) ) • 3 possible approaches • Withjunction • Backside implantation doneprior to thinning (Ohmic contact) • Thinning and polishing do outsidefab (Rockwood) • Wafer get back to fab for frontsideprocessing • Epi wafers (ALICE) • Wafer front processed • Epi layer etchedexcept for the last few microns forming a ohmic contact with a depositedmetal layer • SOI wafers • Wafer front processed • Oxideetchedaway and backsideprocessed (afterbumpbonding)

  17. Timepixavailability • Not clear if timepix chips are stillavailable • Michael Campbell wascontacted to inquire on possibilities, waiting for the answer back

  18. Simulation

  19. GEANT4 simulation + digitization • The software wasported to lxbatch system allowing large scale production • Python script to generatesimtemplate and launchprod and analysis • Possibilitynow to scan pixel size, thickness, incident angles, beam type and energy • Producedsomepreliminaryanalysiswith 20x20um pixel, 50 umthickness • SomeGeometryhandling bugs to besolved , timing needs to beadded in the digitizer/ handled in the framework

  20. Digitization for HV-CMOS • I started to look at how to include in the simulation for a digitizer for HV-CMOs type sensor but information islimited • Reiterated emails around to getaccess to TCAD software (IT Dept, RD50, ElectronicsDepth)

  21. Full detector Simulation dE/dX ? Digitizer Clustering + Hit reconstruction ILCsoft reconstruction etc. Residuals, efficiency

  22. Conclusion • Manypossibilities to produce CLIC like prototypes for nextyear • Availability of readout chips an issue • Simulation ongoing, some bug need to befixed in clustering, geometry, but the machineryisthere to produce large scalestudies, TB simulation

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