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Muon trigger upgrades, missing since not aimed towards DOE funding

Au-Au. Si-Si ++. Au-Au. p-p 500. p-p 200. PHENIX upgrades: view presented to DOE. R&D $3.5M Construction $16.6M. Muon trigger upgrades, missing since not aimed towards DOE funding. D M Lee 6-17-2003. PHENIX. D M Lee 6-17-2003. PHENIX. D M Lee 6-17-2003.

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Muon trigger upgrades, missing since not aimed towards DOE funding

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  1. Au-Au Si-Si ++ Au-Au p-p 500 p-p 200 PHENIX upgrades: view presented to DOE R&D $3.5M Construction $16.6M Muon trigger upgrades, missing since not aimed towards DOE funding

  2. D M Lee 6-17-2003 PHENIX

  3. D M Lee 6-17-2003 PHENIX

  4. D M Lee 6-17-2003 PHENIXInstitutional Responsibilities

  5. D M Lee 6-17-2003 • Simulations Tasks endcap • Implementation of new geometry in PISA • Continual update of geometry with evolving mechanical design • Ministrip size determination - • Detailed simulation of pp capability • Detailed simulation of Au-Au capability • Vertex tracking code • Detailed track matching • Integration with barrel and HPD/TPC • Overall coordination - • UNM, Doug Fields has expressed an interest in helping with the simulation and has a student. He hasn’t defined the level of effort yet. The simulations to date for the end caps have been done by Pat McGaughey and Dave Lee and the new geometry has been done by Hua Pei. Some interest in simulations has been expressed by Pat,Gerd, and Dave. • Mechanical Tasks endcap and barrel • Overall coordinaton Lee • Ladder prototyping cooling test HYTEC • Overall structure prototype HYTEC • Production liason Lee, HYTEC • Ladder assembly - • Combined endcap/barrel assembly - • Cooling system production • Integration with PHENIX/HBD/TPC - • Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap. They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support.

  6. D M Lee 6-17-2003 • Sensor Tasks endcap • Overall coordination - • Ministrip Design • Prototyping - • Testing • Testing with bump bonded frontend chip • Bump bonding - • Production liason • Electronics endcap • Overall coordination Kunde? • Frontend ministrip chip design Kunde • Prototype Frontend chip fermilab • Testing frontend chip Kunde, fermilab • Production frontend chip Kunde, fermilab • Supporting chip design, pilot chip/chips • Test supporting chip • Slow control • HV design - • Readout cable design • Power plant • DCM liason to Chi • Gerd Kunde has established a collaboration with Ray Yarema of FERMILAB to design the frontend chip to bump bond to the sensors. In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc. • Construction where ? • Coordinator • Integration electrical and mechanical who?

  7. D M Lee 6-17-2003 PHENIXBeginning cost basis FermiLab Electronics Cost Estimate Chip design/testing – 2 man-years - $275K (includes all overhead costs) Prototype chip fabrication- $40K (small chip), or $80K (large chip) Test board $5K Engineering run (10-12 wafers) $200K 9 Extra wafers using same masks - $45K Production wafer level testing –engineering, tech time, circuit board, probe card - $60K Contingency??

  8. D M Lee 6-17-2003 PHENIX Fermilab Electronics Schedule Estimate Design specifications completed 10/03 Start design 12/03 Submit prototype 7/04 Prototype testing completed 12/04 Redesign completed for engineering run 1/05 Engineering run back 3/05

  9. D M Lee 6-17-2003 PHENIX

  10. D M Lee 6-17-2003 PHENIXLANL Manpower Estimate • Physicist- mechanical liason, electronic liason, simulation – 3 FTE • Electronic Engineer – Fermilab – construction Budget – 2 FTE • Electronic Integration Engineer – construction Budget - 0.5 FTE • Tech – construction budget – 2 FTE • Lab space, Q/A,Assembly • Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL • Institutionals • LANL, ISU,Columbia,UofCol,UNM,NMSU?,Ecole Poly?, Saclay?, SUNY-SB,

  11. D M Lee 6-17-2003 PHENIXInitial endcap cost estimate • Construction Project 2 – EndCapsDOE (k$) • Mechanical support and cooling (2 endcaps) 195 • Hybrid pixel layers (2 encaps)4766 • Management100 • Total5061 • Overhead on DOE contribution 1257 • 50% contingency2458 • Total8849

  12. D M Lee 6-17-2003 PHENIXPhysicist Manpower Estimate • Physicist Physics Analysis Silicon Upgrade • Barnes 20 20 • Brooks 75 25 • Burward-Hoy 100 • Kunde 40 40 • Lee 25 50 • Leitch 100 • Liu 75 25 • McGaughey 50 50 • Moss 20 • Silvermyr 100 • Sullivan 40 vanHecke 50 50

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