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DAQMB Production Status

DAQMB Production Status. S. Durkin The Ohio State University Florida EMU Meeting 2004. DAQMB Production. EMU Peripheral Crate ESR Nov. 6, 2003 Approved for Production. 8-layer PC Board, 2 Ball-Grid Array FPGAs 718 Components/Board. Production : Numbers.

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DAQMB Production Status

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  1. DAQMB Production Status S. Durkin The Ohio State University Florida EMU Meeting 2004

  2. DAQMB Production EMU Peripheral Crate ESR Nov. 6, 2003 Approved for Production 8-layer PC Board, 2 Ball-Grid Array FPGAs 718 Components/Board

  3. Production : Numbers • 10% of spare boards will be built for anticipated swapping, • 10% spare parts will be ordered for board repair All Parts Ordered, 99% of Parts in Hand

  4. Production PC boards will be etched and stuffed commercially Boards will be measured and debugged on computerized tester before and after burn-in at OSU Each board will have a unique ID Board tracking: Microsoft Access

  5. Production Test and Debugging • Testing Station checks all input and output signals by computer • Exercise 5 CFEB’s and LVMB • CCB,TMB signals mimicked by FPGA on backplane Test Station Built and Working

  6. Production Test Software Production Test Software written and tested.

  7. Production preparation: Burn in Burn In CDF: 50-60 C for 8-24 Hrs Sufficient for tantalums failures No sensitivity to semiconductor failure US Military: 125 C for 320 Hrs Chip Makers recommend against this CFEB: 65 C for 24 Hrs Prove to be effective, not damaging Each DMB: 65C for 24 Hrs Test Before and After

  8. Pre-Production Boards • 11 DAQMB delivered (Nov 19, 2003) • Stuffed commercially, No problems, Work well Costs: PC Board $ 200 Stuffing $ 60 Components $ 750 Mechanical $ 100 Total: $ 1110 DAQMB well within Budget Full Production will begin when a Complete Crate of Electronics is tested

  9. New Crate Controller Development A VMEbus Controller with Gigabit Ethernet • A custom board designed and developed at OSU • Based on XILINX Virtex-II Pro • Customizable firmware. • Optical transceiver (for Gbit Ethernet) • Communicates with stand-alone PC (in USC55) via Ethernet Advantages Over Dynatem • No operating system or software on the controller. All programming done on stand-alone PC in USC55. • Faster, less expensive: ~ $600 each Status • PC board produced and stuffed • Firmware being developed

  10. DDU and DCC Status Peripheral Crates DMB to DDU Gb/s Fibers Myrinet 5Gb/s Fibers SLINK64 CMS DAQ FRL FED Crate (DDU/DCC) CFEB ALCT USC55 AFEB 540 DMB as inputs (160MB/s) 8 SLINK64 as outputs (800MB/s) Detector Expected data rate 1.2 GB/s

  11. FED Crate • Four 9U Crates 9U X 220mm Board • Data Concentration: 15 DMB to 1 DDU 9 DDU to 1 DCC 1 DCC to 2 SLINK64 9 DDU per SLINK (4) 4/5 DDU per SLINK (8) 2/3 DDU per SLINK (16) 1 DDU per SLINK (36) 36 DDU, 4/8 DCC needed D C C DDU DDU Base-line design Optional

  12. DDU/DCC custom backplane DDUs DCC DDUs DDUs DCC DDUs VME P3 spaces, 6.4 Gbps rated connector Data from DDU to DCC TTC control bus (clock, L1A, command/data)

  13. DDU-04 Function • Collect data from 15 DMB (15*160MB/s), Send data to DCC (640MB/s) • Check data, Detect error, send to FMM • Spy data by Gigabit Ethernet • Capable of SLINK64 Improvements over DDU-02: Earlier error detection Better PCB timing More reliable Higher effective data bandwidth DMBs VP20 SLINK64 To FMM Gigabit Ethernet VP20 DCC DMBs

  14. DCC Function • Merge data from 10 DDU (10*640MB/s), send to CMS DAQ SLINK64 (2*800MB/s) • Receive and fan out TTC fast control for the crate • Spy data by two Gigabit Ethernet links • Expected: Constant 800MB/s on SLINK64 >100MHz DDR FIFO extra 1MB buffer for the SLINK64 error detection ability SLINK64 Gigabit Ethernet VP20 TTCrx DDUs VP2 Gigabit Ethernet FIFO SLINK64

  15. Status • DCC PCB Ordered, DDU PCB • FPGA firmware: Being Developed • System will be ready before 2004 slice test We are confident in the design We are working hard on the system

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