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Mistral Christine Hu-Guo on behalf of the IPHC (Strasbourg) PICSEL team

Mistral Christine Hu-Guo on behalf of the IPHC (Strasbourg) PICSEL team. Outline MISTRAL (inner layers) Circuit proposal Work plan Sensor variant for larger radii. MISTRAL-in (Inner layers). Running conditions: 30-35 °C, 2 MRad, 2x10^13 Neq/cm² Proposal: a ctive area: ~10 x 30 mm²

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Mistral Christine Hu-Guo on behalf of the IPHC (Strasbourg) PICSEL team

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  1. MistralChristine Hu-Guoon behalf of the IPHC (Strasbourg) PICSEL team Outline • MISTRAL (inner layers) • Circuit proposal • Work plan • Sensor variant for larger radii

  2. MISTRAL-in (Inner layers) • Running conditions: • 30-35 °C, 2 MRad, 2x10^13 Neq/cm² • Proposal: active area: ~10 x 30 mm² • Double Sided Readout (DSR) • Power consumption: ~1200 mW/sensor • ~400 (~250) mW/cm² • Single Sided Readout (SSR) • Power consumption: ~600 mW/sensor • ~200 (~160) mW/cm²  1 common digital development for both versions, only doubled for DSR IPHC christine.hu@ires.in2p3.fr

  3. ~1 cm ~1 cm 512x256 512x256 512x256 Discriminators Discriminators Discriminators SUZE SUZE SUZE MUX MUX MUX Memory 1 Memory 1 Memory 1 Memory 2 Memory 2 Memory 2 MISTRAL-in (e.g. Single-Sided Readout  SSR) • Proposal for a modulo design: • Overcome design complexity (frequency, readout time, layout) over 3 cm long sensor • Reuse the basic block for other applications • Easy for prototype evaluation, the basic block should incorporate all pads needed for tests Independent blocks Serial read out IPHC christine.hu@ires.in2p3.fr

  4. SUZE-02 • Based on MIMOSA26 and ULTIMATE design principle • Occupancy 5.2 x10^5 hits/cm²/s (Costanza, 20 June 2011) • Parallel search in 8 banks (64 columns/bank) • No. of states per bank • Combine the outputs of the 8 banks • No. of states per raw • Safety factor x 4 • Safety factor x 5 Assume each hit activates 3 contiguous rows State: Up to 4 contiguous pixels with output above threshold • Readout time 200 ns/row (based on 0.35 µm process, perhaps shorter in 0.18 µm) • Fraction of noisy pixels 10^(-4) • Overflows per bank & per raw < 0.1% • Calculation for worst case, 2 memories in pipeline mode, 16 bits / word IPHC christine.hu@ires.in2p3.fr

  5. SUZE-02 • Accounting for the effect of long term irradiation (Noise , Signal ): • 6 states per bank • 12 states (or more, up to 16?  4-bit encoding) per group of 512 columns • Memory: 16-bit/word  not yet optimised • Silicon surface  & data flow  • Output bit rate for whole, 3 cm long, sensor : ~ 800 Mbits/s (safety factor = 5, SSR, memory: 16-bit/word) • In case of fake rate ~10^(-3), foresee ~1Gbit/s • In case of single output (SSR), a digital modulation seems mandatory • Within 1 clock cycle, more than 1 bit can be sent IPHC christine.hu@ires.in2p3.fr

  6. Work Plan: MISTRAL-in (1) • RAMSES (INMAPS 0.18 µm) tested in April/May 2011 at IPHC • ENC~20-50 e-, wide noise dispersion, • Contact with designer, investigation on going • MIMOSA30 (0.35 µm) design on going, submission: Sept. 2011 • Evaluate elongated pixel (16x64 µm²) and readout from both sides • MIMOSA32  1st prototype in Tower CIS 0.18 µm technology • Motivation for CIS 0.18 µm: • Small technology feature allows: • Radiation tolerance , • Read-out speed , • Power consumption , • Si surface (periphery)  • 6 metal levels  may suppress dead zone (steering logic control part) • Optimised sensing systems available and tunable enhanced SNR • High-resistivity epitaxy (1 - 5 kΩ · cm) enhanced SNR • … • Deep P well  PMOS transistors permitted (radiation tolerance detection efficiency?) • Improve pixel performance, integration of intelligence within pixel IPHC christine.hu@ires.in2p3.fr

  7. STAR collaboration Work Plan: MISTRAL-in (2) • MIMOSA32 submission: end of Oct. 2011: Chip dimension: ~3x8 mm² • Technology exploration & evaluation • Sensing device optimisation • Pixel optimisation: in pixel amplifier (PMOS?) • Basic pixel size: 20x20 µm², but also 20x40 and 20x80 µm² • Develop building blocks: amplifier, column-level discriminators, LVDS, … • Evaluate digital circuit w.r.t. latch up! • SUZE, Mimosa22 and Phase-1 are more susceptible to latch up than Mimostar2. • SUZE is more susceptible to latch up by a factor of ~5. IPHC christine.hu@ires.in2p3.fr

  8. A trial to suppress dead zone It may be done with 6 ML 128x128 Discriminators 512x256 512x256 512x256 Discriminators Discriminators Discriminators SUZE SUZE SUZE MUX MUX MUX Memory 1 Memory 1 Memory 1 Memory 2 Memory 2 Memory 2 Discriminators Work Plan: MISTRAL-in (3) • MIMOSA22THR (3 circuits?): submission June 2012 • Estimated total chip dimensions ~80 mm² • Integration of pixel array + discriminators • Both have been tested in Mimosa32 • Test the most critical sub-circuits • SEU tolerance design for critical parts • Decision:after irradiation test, make a choice • 1. Pixel 20x20 vs 20x40 µm² 2. DSR vs SSR • SUZE-02: submission June 2012 ? • Evaluate: latch-up tolerance, memory design (IP? who?) • FSBB(~ 1.3 cm²): submission Q2/2013 • Proposal: basic modulo block • MISTRAL (e.g. SSR ~4 cm²): submission Q2/2014 • Synchronisation of three blocks • Clock distribution • Serial transmission (should be studied before) 128x526 Red: (4 signals) PWR_ON, Slct_Row, Slct_Grp, Clp Green: Column line of pixels output FSBB: Full Size Building Block Serial read out IPHC christine.hu@ires.in2p3.fr

  9. IPHC christine.hu@ires.in2p3.fr

  10. Sensor variant for larger radii • Running conditions: • 30-35 °C, less than 50 kRad (estimated), less than 5x10^11 Neq/cm² (estimated) • Active area: ~20 x 30 mm², readout: SSR • Pixel width ~ 20 µm  may be an extension of MISTRAL-in • Discriminators ending each column  Not adapted to dE/dx measurement • Power consumption: ~600 mW/sensor, ~200 (~160) mW/cm²  May benefit from the digital development of MISTRAL • Pixel width ~ 40 µm • n (?) -bit ADC ending each column dE/dx measurement • Power consumption: ~500 (?) mW/sensor • Need new SUZE development & for n>4, need ADC development  FTE • Modulo design proposal should still be valid for both designs IPHC christine.hu@ires.in2p3.fr

  11. 128 x 32 128 x 16 Discriminators Existing Prototype: MIMOSA22AHR (1) • MIMOSA22AHR (0.35 µm)  submitted & tested in 2010 • EPI: ~400 Ω.cm, thickness: 10, 15, 20 µm (Standard EPI: ~10 Ω.cm, thickness: 14 µm) • 16 different sub matrices connected to discriminators • 128 columns: binary output + 8 columns: analogue output • 2 sub-arrays (2/16) featuring elongated pixels • 18.4x36.8 µm² (S15) & 18.4x73.6 µm² (S16) • Low diode density  CCE  • Irradiation  Leakage current   Noise  • Globally: enhanced vulnerability to radiation S11 S15 S16 IPHC christine.hu@ires.in2p3.fr

  12. Existing Prototype: MIMOSA22AHR (2) • Lab test @20 & 35°C, @3x10^12 Neq/cm², @150 kRad • Preliminary beam test results at SPS (T ~20°C, before irradiation): • Analogue readout: region limited  statistics limited • S/N (seed) ~ 30 • Digital output: overall satisfying performances • No significant loss in detection efficiency: eff >~ 99.8% for a 10-5 fake rate • No inefficient region observed (but statistics small) • Spatial resolution satisfactory • S15 ~ 4.7 m ; S16 ~ 6 m (binary charge encoding) A. DOROKHOV IPHC christine.hu@ires.in2p3.fr

  13. Other sensors (0.35 µm process) planned for submission • MIMOSA29: test structure for large pixels to be submitted in June 2011 • 64x16 µm², 64x32 µm², 64x64 µm² • 1, 2 or 4 diodes in a pixel • 80x16 µm², 80x48 µm², 80x80 µm² • 1, 2 or 4 diodes in a pixel • MIMOSA31  design on going, submission: Sept. 2011 • 1st sensor incorporating pixel array with ADC ending each column • Pixel: 35x35 µm² • ADC: "4" bit (4-3-2 bit) • ADC is based on a successive approximation • Architecture requires 4 cycles to complete one conversion • These sensors act as forerunners for possible R&D of sensors adapted to large radii • Translate design from 0.35 to 0.18 µm? • dE/dx measurement may require a dedicated ADC development  SUZE development IPHC christine.hu@ires.in2p3.fr

  14. Summary • A baseline CMOS pixel sensor adapted to the specifications of L0 + ... is likely to be achievable by 2014 • It is based on the ULTIMATE (MIMOSA28) chip realised for the STAR-PXL • 0.18 μm CMOS technology expected to comply with radiation tolerance specifications • DSR or SSR  40-50 or 20-25 μs readout time (NI rad. tolerance vs pitch) • Room temperature operation (air flow) • Work plan (MISTRAL-in): 4 submissions • Oct. 2011 MIMOSA32: technology exploration, pixel optimisation, building blocks, latch-up evaluation for digital part • June 2012 MIMOSA22THR: integration of pixel array + discriminators, test of most critical sub-circuits, SEU tolerance design for critical partsSUZE-02: latch-up tolerance evaluation, memory design • Q2/2013 FSBB: development of the basic modulo block • Q2/2014 MISTRAL: final sensor • MISTRAL-out: 2 possibilities: • Extension of MISTRAL-in: pixel 20x80 µm², discriminators ending each column • Alternative (R&D needed): pixel 40x80 µm², n(?)-bit ADC ending each column  new SUZE IPHC christine.hu@ires.in2p3.fr

  15. Back up IPHC christine.hu@ires.in2p3.fr

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