Particles and Fields Package Monthly Status Review (MSR) March 20, 2012

1. Particles and Fields Package Monthly Status Review (MSR) March 20, 2012 Dave Curtis, PFP PM

2. Schedule Status 6 weeks margin to delivery to LM Most recent delays due to slow progress at JPL Competing in-house work Critical Path still runs through STATIC electronics fab & test Only SWEA retains any significant slack to package I&T in May After Package I&T (component environmental qualifications) STATIC is critical path due to deferred calibrations and extra qualification steps (acoustics) If we deliver STATIC late we regain some additional slack for the rest.

3. EVM (January report) This is the first report showing the new estimate to completion, which is higher based on increased costs for supplies and materials over original estimates and higher manpower levels being used to improve schedule. PWB coupon failures have continued to eat into schedule margin, but most boards have now passed and moved into assembly and test. Costs are particularly high this month, mostly due to paying down outstanding unfilled orders which were planned to be spread over a longer interval.

4. Accomplishments FM Electronic Progress: All 28 PFP flight PWB types fabricated & past coupons (or waived) 24 of 40 PWB loaded and in test 13 PWB being loaded at JPL and/or SSL Only remaining boards not yet being loaded are 3 FPGA daughter boards (pending testing of the FM DCB and STATIC Digital with EM FPGA) SWEA integrated and in instrument-level test/cal FM Mechanical Some delays is paint/coat of parts LPW booms in deployment tests Black SEP units in assembly, White being painted SWEA assembled Operational FSW Build 2 progress All modules fully specified 90% written, 40% tested HFS delivered to LM and successfully integrated to STL More in instrument sections…

5. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SIT working groups Get FM PWBs loaded, through test Get final mechanical parts through painting into assembly Assemble instruments

6. PFP RFA Status • One more peer review action to go (No change).

7. Trades, Issues PFDPU Thermal PFDPU gets too hot at peak operating power dissipation during early cruise LM Believes they have the problem fixed (radiator on deck) STATIC, SWIA Thermal Too hot in early cruise, even with white radiators LM looking into coupling STATIC to APP to help dissipate heat SWIA might be able to stay cool with a bigger radiator, but costs power later in the mission Alternative is not to power on SWIA/STATIC till later in cruise.

8. Top Risks • Retired PWB Coupon Rejection • Reduced ICD (HFS) • Increased STATIC Schedule probability

9. Risks List

10. PFP Mass No change this month

11. Mass Tracking Chart

12. PFP Power Measured FM SWEA, SWIA power converter efficiency Small change

13. PFP Power Trend

14. PFP Data Rate Latest allocations per TRAS

15. Requirements Verification Status ICD Requirements updated per 2/20/2012 Where there are Payload and Spacecraft verifications for a requirement, count as complete below when Payload side is done ERD Requirements updated per Rev M ERD FRD requirements updating in work

16. MAVEN PFP MAG Status March 2012 Jack Connerney, MAG Lead

17. GSFC MAVEN MAG – Status FM1 and FM2 MAD (Magnetometer Analog & Digital) circuit boards completed; tuning completed; scale factors and zero offsets set. FM1 and FM2 MAD boards, ACHE boards VTFMT testing completed. Resolved high temperature noise issue (MAD) boards. FM1 & FM2 ACHE boards have > 200 incident free hours run time; FM1 & FM2 coated, staked, awaiting analysis thermal balance test. Initial calibration completed on FM1 & FM2 MAD boards (facility thin shell, MAGSAT calibrations). Resolved FM1 sensor axis orthogonality issue – sensor assembly origin. Calibration vector accuracy ~2 nT in 20,000 nT field. FM2 MAD board in to coat and stake this week. FM1 to follow. Completed sensor thermal balance test (using EM sensor). Completed sensor mechanical (static load) tests (examples to follow). GSE (UCB emulator) development completed. FM carbon composite sensor bracket(s), adapter plate(s) and EMI cover(s) fabrication completed. MAG schedule for delivery to UCB (PFP integration) end-of-April.

18. X-axis Shear Testing (Test 9) DIC overlay for Test 9 at 53.2 lb Mag position returns to start (within .001”) after load test

19. Y-axis Compression Testing (Test 13) DIC overlay for Test 13 at -53.2 lb Mag position returns to start after load test

20. MAVEN PFP SWEA Status February 2012 Dave Mitchell, SWEA Lead

21. SWEA Status • Functional testing of FM Digital and LVPS boards complete. • Digital and LVPS boards mounted in the pedestal, and a functional test of the FM pedestal with the FM analyzer on the bench was successful. • Pedestal mated to analyzer and mounted to the manipulator. • Manipulator tested successfully over full range with SWEA mounted. • SWEA ready for calibrations. SWEA FM in the vacuum chamber

22. SWEA Issues • HV intermittents observed when SWEA was tested under vacuum (PFR 024): • Analyzer voltage and NR +28 V supply drooped several times for a few seconds when the analyzer was initially commanded to 600 V. • ~1-Hz ripple in the Analyzer HV housekeeping with an amplitude of ~20 V peak-to-peak. • Near the end of the MCP ramp-up to 2750 V, the instrument draws excessive current (up to 60 mA), and there is evidence for arcing or shorting in the IRAP electronics (high count rates). • Pedestal demated from analyzer, and HV and Preamp boards extracted from analyzer base. Found that staking compound on Anode board has numerous bubbles. • FRB on March 20 to determine best course of action regarding staking compound. • Bench testing continues to investigate the cause of the 1-Hz ripple (microphonics?)

23. MAVEN PFP SWIA Status March 2012 Jasper Halekas, SWIA Lead

24. SWIA Progress • Electrical Progress • FM board loading nearly complete, most boards in test • Digital and LVPS loaded and in test • LVPS test complete, LVPS/Digital integration once Digital test complete • Sweep and Preamp/MCP getting last HV parts loaded at SSL • Ludlam to help out Robinson/Tiu with HV testing workload • Anode finishing loading (waiting for HV cables), cleaning/coating next • Mechanical Progress • All FM parts fabricated but delays in plating • Ebanol-C delayed, Black Nickel complete, fasteners in cleaning • Most assembly procedures complete, few still in progress • Calibration/Testing Progress • Finished testing out new chamber and manipulator with SWIA EM • New ion gun behind schedule • SWIA calibrations can use old gun (in either chamber) if new gun delayed • Need new chamber at least once to verify high angle deflection • Rest of SWIA calibrations could be in old chamber if needed • Plan to use SWIA EM for software test bed next

25. SWIA Issues • Technician time currently a precious commodity • Choke point on loading remaining components on boards (HV supply components, HV cables) due to limited tech time • Fastener cleaning and parts plating delayed • Last items holding up mechanical assembly • Assembly should proceed rapidly as soon as these complete • MCP current monitor re-tuning • MCP current monitor capable of saturating housekeeping MUX when instrument hot and MCP current increases by factor of ~2 • Plan to tune IMon resistor values to ensure no saturation occurs • A121 part handling issue • Two preamps damaged before installation at JPL • Not installed, will load replacement parts here at SSL • 30 screened parts acceptable for flight, so plenty of spares • Already selected best available replacement parts

26. SWIA FM LVPS and Digital Boards

27. MAVEN PFP STATIC Status March 2012 Jim McFadden, STATIC Lead

28. STATIC Accomplishments FM Anode passed coupons, loaded at UCB, ready for test. FM Preamp passed coupons, being loaded at JPL. FM TDC passed coupons and being loaded at JPL. FM ACC-MCP passed coupons, being loaded at JPL. FM HV SWP LV parts loaded at JPL, HV parts being loaded at UCB. FM Digital board loaded except for connectors, in test. FM LVPS passed coupons, being loaded at JPL. FPGA modified/tested - corrected problems with data messages Part testing and selection for Anode, Preamp and TDC completed FM carbon foils scanned and selected. EM Sensor continues vacuum testing – EM SWP raw-HV current instability identified as due to micro-phonics, solved by proper staking. Unexpected efficiency rates for event processing identified, stems from marginal timing for TDC reset, to be solved by increasing pulse length. FM TOF mechanical parts ready for assembly FM MCP mechanical parts ready for assembly

29. STATIC Open Issues Clearance problems with FM Digital board connectors and components. Recent modifications to FPGA need testing Ion gun testing begun – need to replace the turbo-pump. FM Mechanical part plating in process Mechanical procedure development and FM part inspection continuing Vacuum testing and calibration script writing continuing on EM sensor

30. MAVEN PFP SEP Status March, 2012 Davin Larson, SEP Lead David Glaser, SEP ME Miles Robinson, SEP EE

31. SEP Accomplishments DFE 4 DFE boards loaded with preamps. Initial testing revealed preamps were saturated at positive rail. Cause determined due to leakage current in protection diodes – (poor choice of diodes) Resolves issue of variable DC offsets (open issue from last month) Diodes removed from flight boards. Low leakage diodes on order DAP 1st board loaded at JPL. Flight Actel #39 burned and installed. Returned to SSL on 3-16. Awaiting go ahead on cap 722 issue [closed 3/19] Detectors Diced and awaiting delivery. Sensors Flight spares (black paint) assembled (except attenuator covers and collimators) Attenuator and Voltage tests performed on both flight spares on 3/16 Minor anomaly in attenuator testing shown to be due to GSE equipment. Awaiting delivery of white painted sensors (prime flight) (due 3/23)

32. SEP Open issues Bureaucracy associated with rework/ repair issues (especially 722 Cap issue) is slowing progress.

33. MAVEN PFP DCB, Power Converter & GSE Status March 2012 Dorothy Gordon Timothy Quinn Peter Berg Chris Tiu Tony Mercer

34. DCB Status – DCB Board/FPGA Data Controller Board Two Flight DCBs received from JPL Initial Ohmmeter checks passed Electrical test pending installation of connectors and Flight PROM These parts are loaded at SSL (the process is underway, expected completion by March 19th) DCB FPGA Rev D released (minor change to default actuator timeout duration) and installed on both SSL Resident DCBs AX (for DCB ETU Daughter board) fuse file sent to JPL

35. DCB Status – FPGA Daughter Board Daughter Board Fabrication Second set of boards received from Streamline Coupon testing failed Minimum spacing between layers is slightly too small Measured is 2.87, requirement is 3.54 mils Layer dielectric requirement, we may be able to adjust this requirement since the maximum voltage present on this board is 3.3V. We have submitted a waiver request Third set of boards in manufacturing process at Streamline Slightly thicker stackup for this build Flight FPGA Dummy Board (624 Pin CCGA) Prototype FPGA Daughter Board (ProASIC FLASH BGA) Daughter Board Population • Dummy Board received from JPL • Fit check passed for both DCB and STATIC Digital board • DCB EM (AX Part) kit at JPL

36. GSE Status GSEOS Spacecraft Simulator GSE software was updated to introduce jitter in the Time Update and Zone Alert messages GSEOS version created that supported HFS integration at LM. This GSEOS connects to the Front End Data System (FEDS) in the LM Satellite test Lab (STL) and receives and decodes PFDPU telemetry for display and verification. HFS HFS Delivered to Lockheed Martin and is currently in use by the S/C Flight Software development team PFDPU ETU In process – reassembly of the MAVEN ETU PF ETU Instruments are being attached as they become available in order to provide a flexible testbed for system test and FSW development/verification MISG (in instrument mode) is patched in to send simulated data when instruments are disconnected

37. Power Converter Status - REG EM3 is being used to develop the final power transformer and power inductor.  EM2 has been integrated into the MAVEN ETU PFDPU Pending EM2 rework will be done when EM3 test is complete Tester A new REG tester was designed and built (awaiting checkout) Front panel silkscreening in process The initial REG Acceptance Test Procedure was written In the review process Several minor manufacturing issues (solder masked vias, floating copper text, part changes/rework) have been identified These issues have been discussed with QA and solutions are in place. (PFR is in process.) The FM boards were kitted and sent out to JPL for the first phase of the assembly.

38. Power Converter Status - IIB FM assembly is almost complete Magnetics installation pending Test procedure write up completed FM inspection and test is underway Preliminary tests can be done prior to magnetics installation .

39. MAVEN PFP Flight Software Status March 6 2012 Peter Harvey

40. Operational Status • Interface Documents, Meetings • STATIC 2/16/12. Data processing discussion. 13 -> 28 Telemetry Products ! • STATIC FPGA specification Rev L and Rev M during the month • STATIC Requirements (L4) submitted to DWC (Rev J) • General Meeting: “Orbit Mode” concept deleted (LPW FSW specification) • Development • Developed STATIC processing diagrams and sent to McFadden/Curtis for review & comment. No response • STATIC PI has explained he does not want to use Archive telemetry. Cannot get an explanation why there is a FSW requirement. • Modified SWIA, SWEA, STATIC to remove “CDI readbacks” from Tables in the CTM and in the flight code • Removed HV ramp from PWR • Added HV ramps to SWIA, SWEA, STATIC, BKG timing • Simulated SWIA CDI readbacks, LUT loading • Developed process to move RTS to EEPROM • Developed/checked SEP LUT loading • Developed/checked LPW LUT loading, LUT to EEPROM • Developed/checked STATIC LUT loading (12 tables), HV Ramps • Wrote STATIC message handling and accumulation • IV&V • Awaiting Info re. Level 5 Requirements Validation Report • Next Month • Need to get agreement on RTS 0-5 , (Cold and Warm Resets, Safe, Normal, Eng modes) • Need to get FSW limit monitors and actions specified • Working on a packet-level compression specification using DWC’s paper

41. SPRs and SCRs

42. Module Status Chart

43. Metrics Chart

44. Defect Chart

45. Safety and Mission Assurance Monthly Status Report (MSR) March 2012 Jorg Fischer, PFP SMA

46. SMA SUMMARY March 2012 • QA produced FM parts kits • GSFC FM active parts documentation – 90% complete. • One active part could not be matched to the Test data provided by GSFC – SSL needs a PFR/NCR from GSFC • QA supported reviews for PWB fabrication, PWB coupon testing, assembly preparation, and fabrication efforts. • All PWB passed coupon testing (one with waiver) • Updated flight kit status list • Updated flight fastener and fastener kit status list • Performed monthly ESD – no issues • Performed calibration checks – no issues

47. SMA SUMMARY • Alert checks – no new issues, no impact • Updated PFR roster – PFR/SPR summary status list • Performed Procedure and ACI Reviews • Flight assembly and test areas were inspected and approved by SSL and GSFC QA. QA will preform continuous inspections of the areas during flight built. • Acceptance Inspections at JPL - passed • Acceptance Inspections at VMI - passed

48. SMA Details • PWA and Assembly Inspections – no issues • NASA Training of SSL personnel (Re-certifications) • Streamline Circuits coupon documentation - resolved. • All PWA coupons are checked by GSFC • PFR Documentation in progress – summary sheet

49. SMA Details • FLT kit preparations (see next slide) • MAVEN PFR status (see summary slide) • One PWB was granted a coupon waiver, MAVEN_ FLT-FPGA DC REV:B (EC 2A340): the max voltage is 3.3 volts and the measured thickness is 2.87 mils. • SWIA Anode connector GND solder – resolved • MAVEN FLT board Status – updated 3/9/12 • MAVEN PFR roster status – updated by Daniele

50. SMA SUMMARY - MAVEN FLT KITS