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“ High Technology for Display Devices ”

COMPANY PROFILE. 2006. 07. “ High Technology for Display Devices ”. I N D E X. 1. OFFICE AND ADDRESS. 2. COMPANY PROFILE. 3. COMPANY HISTORY. 4. ORGANIZATION. 5. CERTIFICATION. 6. DEALING ITEM 6-1. MODULE ASS’Y 6-2. LCD ASS’Y MACHINE. 7. FACTORY APPEARANCE. 8. LOCATION.

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“ High Technology for Display Devices ”

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  1. COMPANYPROFILE 2006. 07 “ High Technology for Display Devices ”

  2. I N D E X 1. OFFICE AND ADDRESS 2. COMPANY PROFILE 3. COMPANY HISTORY 4. ORGANIZATION 5. CERTIFICATION 6. DEALING ITEM 6-1. MODULE ASS’Y 6-2. LCD ASS’Y MACHINE 7. FACTORY APPEARANCE 8. LOCATION SEKWANG TECHNOLOGIES CO., LTD2p

  3. 1. OFFICE AND ADDRESS SEKWANG TECHNOLOGIES CO., LTD3p

  4. 2. COMPANY PROFILE > COMPANY NAME : Sekwang Technologies Co.,Ltd. > PRESIDENT : D. W. Kim (金東佑) > ESTABLISHMENT : 20.JAN.1995 > CORPORATION REGISTERED No. : 184511-0026557 > EMPLOYEES : 130 >CAPITAL : USD 800,000 > ADDRESS : 351, Bukjung Dong, Yangsan, Kyungnam,Korea TEL) 055-372-3151~3. FAX) 055-372-3154 E-MAIL) sktech@sklcd.co.kr > PLANT SIZE : 1,691 M²/SITE AREA : 3,089 M²(4 FL) / FLOOR AREA > MAIN PRODUCT - LCD MODULE ASS’YEQUIPMENTS / PANEL EQUIPMENTS : Design, Manufacturing & Sales For ACF, FOG, COG, COF, TAB BONDER, AUTO POL ATTACH M/C, END SEAL, COG INSPECTION M/C, FPC CUTTING M/C, INLINE AUTO COG/FOG BONDING M/C - LCD MODULE ASSEMBLYPRODUCTS : Design, Assembling & SalesFor BACK LIGHT MODULE SEKWANG TECHNOLOGIES CO., LTD4p

  5. 3. COMPANY HISTORY 2006. OCT. Developed FPC Cutting M/C OCT. Developed Auto Pol Attach M/C JUL. Developed Auto Trace Tester ( 3.5 SEC) MAY.Start to Develop Middle size(3”~7”) COG+FOG bonding M/C (Tact time 3.9sec) ( Planed to finish within Oct.) Start to Develop auto Pol attach M/C. (3.5sec)( Planed to finish within Sep.) APR.Start to Develop small size(1”~4”) COG+FOG bonding M/C (Tact time 3.5sec) ( Planed to finish within Sep.) MAR.Acquired ISO14001:2004 Certificate for LCD Equipment & LCD BLU assembly. 2005. AUG.Developed Semi Auto COF Bonding M/C. (Tact time 6.5sec) JUL. Developed Loading & Cleaning M/C. JUN. Developed Auto Trace Tester. MAR. Patent Application about In Line type COG+FOG Bonding M/C. Delivered In Line type COG+FOG Bonding M/C. (Tact time 4.5sec) 2004. JUN.Developed IN LINE FOG Bonding M/C. MAY. Acquired ISO-9001 Certificate for LCD Equipment & LCD BLU Assembly. FEB. Developed IN LINE COG Bonding M/C. 2003. JUN. Developed Camera Module Bonding M/C For SAMSUNG TECHWIN. FEB. Establish R & D Center at YANGSAN Factory 2002. JAN. Move to YANGSAN New Factory 1999. JAN. Established Panel Line Equipment manufacturing factory for STN LCD line. (Pol Attach M/C, Scribe M/c. Break M/C, End Seal M/C, LC Cleaning M/C, LC Filling M/C) 1998. AUG. Establish Module Line Equipment manufacturing factory for STN LCD line. (TCP Bonder. ACF M/C, COG M/C, COF M/C, TAB cutting M/C, Hot Bar M/C, Clean booth) SEKWANG TECHNOLOGIES CO., LTD5p

  6. 3. COMPANY HISTORY 1996. MAR. Make a Representative Agreement with PUCKA for FPCB. Start to Assembly Back Light(640*480) for Large size of Colour STN Module. 1995. JUN. Opened the business for Back Line Process Equipments of LCD MAR.Start to make LCD Module OEM for Samsung SDI. MAR.Make a Representative Agreement with ONPRESS PRINTED CIRCUIT LTD(H.K) & MICRO CIRCUIT LTD(H.K) for PCB sales in Korea JAN.Founded to supply the best material for LCD, LCD Module and Equipments in Korea SEKWANG TECHNOLOGIES CO., LTD5p

  7. 4. ORGANIZATION SEKWANG TECHNOLOGIES CO., LTD6p

  8. 5. CERTIFICATION 1) Environment Management System Certificate - KMA Registrations & Assessments Inc. 2) Innovative Technical (INNO-BIZ) Company Certificate - Small and Medium Business Administration 3) Certificate of Registration - TQCS International (Group) Pty Ltd. 4) Export Prospective Company Certificate - The Centre of Supporting Kyoungnam Regional Small and Medium Company 5) Certificate of Venture Business - Kyoungnam Regional Small and Medium Business Administration 6) The R&D Center Certificate - Korea Industrial Technology Association 7) Certificate - Gyeongnam Export Center, SMBA. SEKWANG TECHNOLOGIES CO., LTD13p

  9. 5. CERTIFICATION 1) 1) 3) 2) 4) 5) 6) 7) SEKWANG TECHNOLOGIES CO., LTD13p

  10. 6. DEALING ITEM SEKWANG TECHNOLOGIES CO., LTD7p

  11. 6-1. MODULE ASS’Y PRODUCT > COG (Chip on Glass) > COF (Chip on Flex) • It is most cost effective design. And • it makes a module thinner and lighter. • It can be applied for display driver ICs, • which have more than 100um pad pitch. • It need a larger contact edge of the • LCD glass and protection against • IR-light. • It is useful for PDP and CMOS • image sensor module application • especially. • It is useful for LCD modules • in mobile phone and MP3 • application. > FOG (Film on Glass) > FCOF (Flip Chip on Flex) • It is an effective design for the fine pitch • and high resolution LCD modules. • It is a new advanced technology for • fine pitch and high resolution LCD modules. • It is useful for LCD modules • in mobile phone and PDA application. • It makes an application smallest, thinnest, • lightest and most compact. SEKWANG TECHNOLOGIES CO., LTD8p

  12. 6-2. LCD ASS’Y MACHINE > POL ATTACH M/C > ACF BONDING M/C This machine is used to attach the ACF tape on the TAB film or glass to improve the conductivity. This machine attach the Polarizer Film to the cell automatically. It separates protective tape on polarizer film when ell is put on the vacuum stage and moves the stage to attach the polarizer film correctly to the cell. > COG BONDING M/C > COG BONDING M/C This machine is a COG bonding Machine which bonds panel and IC by manual aligning with keeping determined time, temperature and pressure condition. This machine is Semi Auto COG bonding machine which bonds IC on the LCD Panel by auto aligning with keeping determined time, temperature and pressure condition. SEKWANG TECHNOLOGIES CO., LTD9p

  13. 6-2. LCD ASS’Y MACHINE > COG BONDING M/C > COG BONDING M/C This machine is In Line COG bonding m/c which bonds continuous from ACF process to COG process on LCD panel by auto aligning with keeping determined time, temperature and pressure condition. This machine is In Line type Auto COG Bonding m/c which bonds IC on LCD Panel through ACF bonding, pre bonding, main bonding & unloading by PC and PLC controlled auto operation system. > COF BONDING M/C > COF BONDING M/C This equipment bonds the chip on the FPCB named semi auto COF bonding , the process of COF from loading of FPCB, pre bonding, main bonding and unloading will be performed automatically. Every motion of m/c will be controlled by PC and PLC program. This machine is a semi auto COF bonding machine which bonds IC on the FPC panel by auto aligning with keeping determined time, temperature and pressure condition. SEKWANG TECHNOLOGIES CO., LTD10p

  14. 6-2. LCD ASS’Y MACHINE > AUTO FOG BONDING M/C > FOG BONDING M/C This machine is used for bonding the TAB LSI and FPC to the LCD glass on the ACF attached. Bonding stage shift to the left And right side for bonding by shuttle shifting. This machine is In Line type Auto FOG bonding machine which bonds FPC on the LCD panel through ACF bonding, pre bonding, main bonding & unloading by PC and PLC controlled auto operation system. > AUTO TRACE TESTER > LOADING & CLEANING M/C This machine is used next process of COG and FOG in tracing of pressure on LCD panel. LCD panel from previous is put in inspection stage to be checked whether it’s “OK/NG” by the camera. This machine is used for LCD loading and LCD Cleaning before COG or FOG bonding. LCD panel are supplied automatically from LCD tray and LCD pad are cleaned with API by wiper and air knife unit. SEKWANG TECHNOLOGIES CO., LTD11p

  15. 7. FACTORY APPEARANCE > Busan Factory 1.Site Area :1,691M²(512 PY) 2.Floor Area :3,088M²(936 PY) - 1st FL:(825M²) : Equipment Machining & Assembly Factory. - 2nd FL:(1,005 M²) : Back Light Unit Ass’y Line (10,000 class Clean room/330M²) - 3rd FL:(1,005 M²) : Back Light Unit Ass’y Line (1,000 class Clean booth) - 4th FL:(253 M²) : Facilitys for Clean Room SEKWANG TECHNOLOGIES CO., LTD12p

  16. 8. LOCATION SEKWANG TECHNOLOGIES CO., LTD13p

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