40 likes | 195 Views
Stave programme. Staves recently build. Stave#7 I think is at QML Intend was to aggressively thermally cycle and look for structural issues Stave#8 Shield-less tapes , no cut-outs K13C2U/EX1515, 45gsm 2.275mm OD Titanium pipe, no fittings
E N D
Staves recently build • Stave#7 • I think is at QML • Intend was to aggressively thermally cycle and look for structural issues • Stave#8 • Shield-less tapes , no cut-outs • K13C2U/EX1515, 45gsm • 2.275mm OD Titanium pipe, no fittings • Intended to be the 130nm thermo-mechanical prototype • At Sheffield, waiting for fittings? • Then to RAL/Oxford, to be placed in old frame (located at Oxford), for mounting of thermo-mechanical dummies • Stave#9 • Shield-less tape with cut-outs, one side Au-plated, but with delamination problems • K13C2U/EX1515, one side 45gsm, one side probably 100gsm • 3.125mm OD stainless pipe, VCR fittings • Intended for • Wire-bonding trials – in particular along edge to study implications of C-channel • Measuring capacitive coupling between cooling plate and dummy readout strip (not yet done) • Measuring conductivity beteen pipe and core/skins (not yet done) • Currently at Oxford, waiting for locking points and the stave from frame from QML • Then to RAL for plasma cleaning and wire-bonding
What we talked about at one point… • A very thin stave (2-3mm) • This went on the backburner since we are investigating the embedded break • A stave with a multiply cut (and welded) cooling pipe • Local flatness is good, globally there still seems to be a (~200μm) bow • not sure whether this is a problem • Need to see how it works with new jig • Material optimization always to be worked on, but no obvious target at the moment • I don’t thik we have a conclusive answer whether glue application on pipe is sufficient…
What we will need in the future • 1 or 2 stave cores for 130nm electrical staves • Want to do a nice job, as these will be visible • 3 stave cores for insertion trials in mock-up at RAL • Exact design of cylinder mock-up needs to be decided, but 3 is minimal number to study insertion of a stave between two adjacent ones • All these should have the ‘final’ 130nm stave design (13 modules etc.) • Use new set of tooling • I also think we need a stave frame for each of them • Smaller things: • Prototype embedded break (with thermistors + their connections) • Co-cure ground pads into skins (better conductivity measurements) • Have we ever concluded on the core material question (different HC size, corrugations?) • And some procedural questions • Further development of procedures play through a real production schedule (2wks per stave core, 1 stave per wk)? • At what point should we start production at Liverpool?