1 / 12

IB stave assembly

IB stave assembly. A. Di Mauro, C. Gargiulo , J. Van Beelen ITS-MFT mini-week 12.03.2014. TDR procedure. Main steps: HIC assembly + HIC gluing on C-fibre support . TDR procedure. B. A. HIC assembly by laser ball soldering

mick
Download Presentation

IB stave assembly

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. IB stave assembly A. Di Mauro, C. Gargiulo, J. Van Beelen ITS-MFT mini-week 12.03.2014

  2. TDR procedure Main steps: HIC assembly + HIC gluing on C-fibre support ITS-MFT mini-week - IB stave - A. Di Mauro

  3. TDR procedure B A • HIC assembly by laser ball soldering • Tooling: vacuum table (A) to hold chips (with x,y,z micrometric adjsutment), vacuum table (B) to hold FPC, soldering macor grid with conical holes (0.4-0.9), ball pick-up A B INFN BARI ITS-MFT mini-week - IB stave - A. Di Mauro

  4. TDR procedure • HIC assembly by laser ball soldering • Nine chips are placed above the vacuum table A and precisely aligned with respect to each other • The FPC is placed above the vacuum table B and held in a position defined by reference pinholes • The FPC is aligned with respect to the subjacent array of chips by matching the holes with the connection pads on the chip surface • The soldering grid, aiming to gently press the FPC against the chip, is placed above the stack-up and aligned with respect to the holes in the FPC • The loaded ball pick-up tool is aligned above the stack-up corresponding to the first chip and overlapped to the soldering grid; then the balls are released • The laser soldering of each connection is performed in sequence • The last four steps are repeated to connect all remaining chips and complete the HIC • Electrical tests and metrology of chips positions ITS-MFT mini-week - IB stave - A. Di Mauro

  5. TDR procedure • HIC gluing on C-fibre support • No details were provided ITS-MFT mini-week - IB stave - A. Di Mauro

  6. Procedure update • Optimization of laser soldering • Insulation of chips from aluminium vacuum table (acting as heat sink) using a thin macor plate • Soldering under N2/H2 (95/5) mixture + gas exhaust holes • Soldering under vacuum ITS-MFT mini-week - IB stave - A. Di Mauro

  7. Procedure update gas exhaust hole FPC antipad Ø 600 µm + (10 to 15 µm) FPC pad Ø 400 µm + (10 to 16 µm) Hole Ø 200 µm ± 10 µm 10 µm Solder mask Ball Ø 200 µm +/- 8 µm 25 µm Copper Polyimide Polyimide 50 µm 25 µm Copper 10 µm Solder mask Chip 50 µm ITS-MFT mini-week - IB stave - A. Di Mauro

  8. Procedure update • Soldering under vacuum • Advantages wrt to N2/H2: • No exhaust holes • Environmental conditions for soldering: faster and reproducible ITS-MFT mini-week - IB stave - A. Di Mauro

  9. Procedure update Further considerations (apparently not inter-correlated): • Al sputtering done in batches of 50x150 cm: try to maximize no. of FPCs fitting in such a surface • Safe handling of HIC during all phases • Ensure repeatability of chips alignment • FPC holes’ position accurate “enough”, spread compensated by larger chip pads (to be verified) ITS-MFT mini-week - IB stave - A. Di Mauro

  10. Al-FPC layout under study • Double no. of FPCs in each foil • Easier cutting of extra material (wings) at the end of stave assembly ITS-MFT mini-week - IB stave - A. Di Mauro

  11. FPC/HIC frame • Frame holding FPC from soldering until stave assembly: • easier handling • possible protection with additional lids • The frame (FPC) has pinholes (targets) to be used as reference for placement/alignment during the various phases • The same pinholes (or additional ones) match pinhole in the C-fibre connectors

  12. Reviewed procedure • Mount FPC on frame using reference pinholes • Place chips on vacuum table and align with respect to reference pinholes (on table) matching those of the frame • Overlap soldering grid to FPC • Release soldering balls inside the grid using the pick-up tool (for all chips) • Fix lid and start vacuum • Laser soldering of 9 chips • Electrical test + metrology of HIC (final position of chips wrt to frame pinholes) • Glue HIC on C-fibre support using jig with pinholes in connectors • Final metrology to transfer chips position to external target (details to be worked out) ITS-MFT mini-week - IB stave - A. Di Mauro

More Related