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Greatest challenges of the 21 st Century:

Greatest challenges of the 21 st Century:. To create computing capability that can operate with THz speed with Terabits/cm 2 information storage, and to apply this technology in biotechnology, business, and education. Speed drives technology Technology drives society.

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Greatest challenges of the 21 st Century:

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  1. Greatest challenges of the 21st Century: To create computing capability that can operate with THz speed with Terabits/cm2 information storage, and to apply this technology in biotechnology, business, and education • Speed drives technology • Technology drives society

  2. “Terascale electronics---endless quest for IC speed” Toh-Ming Lu lut@rpi.edu; www.rpi.edu/~lut Director Center for Advanced Interconnect Science and Technology (RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland) Outline End of scaling Systems technologies: on-chip/off-chip interconnect Nanoelectronics

  3. Information age? Execution, storage, and transmission of massive information What technology drives the information age? Hardware in Computer: Chips, hard drives, display……. -----Microelectronics technology

  4. Technology for Information age--------Microelectronics • Electronics industry: driving force of the information age. largest manufacturing industry in the United States and in the developed world • Over ~14% per year growth in the last 30 years --- continue to grow in the next few decades • Will need a continuing supply of BS, MS, and Ph.D

  5. Who are chip makers? Intel, IBM, Motorola, AMD, DEC, LSI Logic, National Semiconductor, Lucent, TI, HP….. DELL, Compaq, Gateway…don’t make chips!

  6. History • Invention of solid state electronics (40’s) --------The transistors • Then IC • Then Mainframe (60’s)----execution and storage • Then PC (70’s)----execution and storage • Then PC plus internet plus WWW -----execution, storage, and transmission

  7. Why so exciting? • Intellectually stimulating • Impact: changes the society in major way • Business: creates enormous wealth • Education: fundamentally change the way we learn • Medicine:will change the way we treat diseases

  8. “Turmoil and opportunities at the dawn of the 21st Century ---the road of an academic department in higher education” (Toh-Ming Lu, amazon.com, 2000)

  9. Computer logic---a series of on and off operation (clicks) • Imaging a super fast telegraph! (1GHz: 1000 million clicks per second; 1THz = 1000GHz) • “Fast” means: more clicks per second • The narrower the “click” the faster you get • The shorter the device the narrower the click time

  10. MOSFET Transistor

  11. Key questions in the industry Technical: ---Is there an end to increase IC speed? Business: ---Is there a market for super fast ICs?

  12. Some key technological challenges ---Limit on device dimension ---Limit on interconnect speed

  13. Recent news: • Intel: 1 THz FET, 25nm channel length • IBM: 210 GHz HBT, base 100 atoms

  14. Limits on patterning: diffraction resist metal

  15. Limit on RC delay Chip cross section

  16. Interconnect (RC) delay Through wires time time To avoid overlapping Reduce the number of “clicks” per second ---separate the “clicks” apart Therefore reduce the speed

  17. “Terascale electronics---endless quest for IC speed” Toh-Ming Lu lut@rpi.edu; www.rpi.edu/~lut Director Center for Advanced Interconnect Science and Technology (RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland) Outline End of scaling Systems technologies: on-chip/off-chip interconnect Nanoelectronics

  18. 3D heterogeneous systems: bonding, alignment, via etching/filling High bandwidth: to optoelectronics systems (THz) ? GaAs/Si? --killer tech A/D, sensors, IP cores Mitsubishi Electronics America: ADVANCED PACKAGINGJune/July 2000 issue. memory Logic layers PC, communications, internect… I/O, passives, power Heat extractors --Shorter wires, higher density, more functionalility— Beyond Roadmap

  19. Opportunities for more Si mainstream technologies: ---Decades beyond the Roadmap • Stacked chip assemblies (logic, memories, interposer for passives); • Heterogeneous systems for sensors and MEMS; • Hard IP core-based SOC designs (including mixed signal); • High speed processors; • LAN architectures (for wireless applications and/or for multiplexed interconnects). Gutmann et al (2001)

  20. J. Lu et al Pictorial Representation of 3D Integration Conceptusing Wafer Bonding, * Figure adapted from IBM Corporation and used with permission.

  21. Processing issues: • bonding-alignment • through wafer via etching • barrier and metallization • Reliability: • thermo and mechanical stability • electromigration • heat extraction

  22. Broad band interconnect technology • ---high speed data transfer • Replacing electrical connection by optics: • Modulators/switches: electro-optic, optic-optic • Optical waveguides • Data compression (software) Or:wireless! switches Modulators guide light fiber Chip stack

  23. Nonlinear EO Modulated light light Electrical signal Electro-optic modulator R. Kersting, G. Stasser, and K. Unterrainer, Terahertz phase modulator, Electr. Lett., 36, 1156 (2000)

  24. Optical switches: • MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent) • Nanotube switches: Zao et al (2001)---THz speed • Quantum dots switches: Dutta et al (2001)---THz speed MEMS

  25. Potentially viable optical interconnect schemes—Dr. Persans waveguide CMOS circuits and metallization optoelectronic transceivers • Bump-bond optoelectronic chip on top of complete CMOS package • Grow optoelectronic components monolithically; local microphotonic waveguides grown and patterned; polymer waveguide layers for off-chip and longer distance • Monolithic optoelectronic components; incorporate longer waveguides into metal interconnect package • Use waveguides within sensor-chip or system-on-a-chip paradigm metal or multilayer dielectric mirror cladding waveguide via receiver Agarwal, Ponoth, Plawsky, Persans: Appl. Phys. Lett. 78, 2294 (2001)

  26. Mainstream computer/communication technology: • Strong industrial/State/Federal partner support • Enormous employment opportunities • Decades of growth---expected more growth in decades • End of device scaling does not • imply end of Si technologies!

  27. Emerging technologies • Nano-scale electronics: very rich and unexplored science • Strong Government support • Long term benefits (not likely mainstream computing • in at least 20 years) • ---The greatest and immediate impact may not be in electronics, • but in biomedical applications

  28. “Terascale electronics---endless quest for IC speed” Toh-Ming Lu lut@rpi.edu; www.rpi.edu/~lut Director Center for Advanced Interconnect Science and Technology (RPI, SUNY-Albany, MIT, UT-Austin, N. Texas, Texas Tech., Cornell, UC Berkeley, Columbia, Georgia Tech, Rochester, U. of Maryland) Outline End of scaling Systems technologies: on-chip/off-chip interconnect Nanoelectronics

  29. Deep sub-0.1 U g 2D Gate Gate electron Insulator fl u id Drain Source Plasma wave Interconnects via Terahertz Receiver-transmitter pairs • ULSI chip divided in tiles • Communicate via plasma wave electronics receiver-transmitter pairs Michael S. Shur http://nina.ecse.rpi.edu/shur/

  30. Room temperature single electron transistor using nanotube Smalley group (2001)

  31. Oriented & interconnected nanotube networks—Ajayan et al Focused Ions • Local modification and Junction formation • Termination (cutting of structures)

  32. Fantastic opportunities in applied and basic science research • Examples: • New materials synthesis: polymers; nitrides, carbides • Novel polymer-metal, polymer-cermic, polymer-polymer composites: • Novel phase separation, crystallization, dynamic growth phenomena • Novel interfacial diffusion, reactions, and transformations • Novel nano-structure science; light emitting nano semiconductors • Novel non-linear thin film materials; high electro-optic coefficient materials • Novel opto-electronics materials, layered structures • Quantum effect on narrow lines • Materials response under extreme speed and frequency • Real time atomic scale microscopies

  33. THzBio-Chip for Sensitive Detection Nano-Si or nano-C layer glass plate reference chip sample chip THz grating helps coupling THz wave THz signature or fingerprint of genetic materials: DNA, RNA or Protein attach to nano-layer in sample chip, from 10 GHz to 10 THz frequency range. (Zhang, Kersting)

  34. Yesterday On-Chip Interconnect Today 3-Dimensional Interconnect “Norton” Facility (IC Laboratory) Tomorrow 3D Chips • Microsystems • Non-Electronic Chips • Scalable Systems 5”-8” 2µ CMOS MCR (Wafer Processing R&D) Terascale electronics? Bio-devices? 8” State-of-the-Art Wafer Fab • Welcome students doing PhD at Rensselaer • Welcome visiting scholars and collaboration

  35. Electrical Storages • Memory:Trenches/Stacked capacitors • Passives capacitors

  36. Magnetic storage • ---towards terabits/in2 • C. Ross, Annu. Rev. Mater. • Res. 2001. 31:203-235. • Three strategies: • exchange-decoupled grains • (conventional) • In-plane patterned media • Perpendicular patterned media

  37. Limits on magnetization: ---Nayak/Wang/Korniss (Physics) P ? H P H

  38. Molecular memories: Materials Today (Feb 2002)

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