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FEE Electronics progress. Mezzanine manufacture progress FEE64 testing and VHDL progress Test mezzanine. Trial mechanical assembly. Mezzanine manufacture Progress. PCB design sent to manufacturer Order for assembly placed and parts purchase started.
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FEE Electronics progress Mezzanine manufacture progress FEE64 testing and VHDL progress Test mezzanine. Trial mechanical assembly
Mezzanine manufacture Progress • PCB design sent to manufacturer • Order for assembly placed and parts purchase started. • PCB manufacture error requires restarting the build. • Expect PCB this week. • Assembler planning sequence broken – hard to predict delivery until pcb arrives. • Two of the failed pcbs delivered to use for mechanical checks. • ERNI connector mounted – pcb too large – manufacturer will change by 1mm overall • Plan to send one pcb to wirebond engineers.
FEE64 testing and VHDL progress • Assembled boards delivered. • Power supplies tested and found to be working OK after a couple of wire mods. • FPGA programmed through JTAG port. • Two misplaced devices removed and re-fitted • Flash memory programmed and used to program the FPGA.
FEE64 testing and VHDL progress • 128MB SDRAM operating successfully • Gbit ethernet functions at 10/100/1000 Mbits/s • Linux loaded over the network after the core loaded by JTAG. Loading from Flash memory not functioning yet. • Some ethernet problems solved by damping capacitor. • Ethernet rate tests => 10MB/sec Started testing the multiplex readout ADC. First results using MIDAS and TCL scripts. 100mV input via the test mezzanine. VHDL for timestamped ASIC driven operation in progress.
FEE64 testing and VHDL progressTest system DC source Test mezzanine Power supplies ( +30v , -5v)
Clock distribution • Schematics for four way clock distribution box entered. • Pcb layout to proceed after VHDL for acquisition complete. • Designed for manufacture locally. Master SYNC to clock box FEE64 (sync master) Clock box FEE64 FEE64 FEE64 200Mhz clock and SYNC distribution
Test mezzanine • Two assembled boards delivered 4th November. • In use in T9 to exercise the multiplex readout ADC.
Trial mechanical assembly Plastic versions of the FEE mechanics created by a ‘Z’ printer. Two FEE64 cards and two mezzanine scrap boards assembled. Some alterations to the spacer required.