Mobile Component Forum 2004

1. “Fundamental mobile component for Ubiquitous society” This event focus on exchange of technology about the electric component of mobile product. Mobile Component Forum 2004 July 21-23, 2004 / Tokyo Big Sight Co-held with EXPO COMM WIRELESS JAPAN Organized by E.J. Krause & Associates, Inc. & RIC Telecom, Co., Ltd. Cooperated by KOGYO CHOSAKAI PUBLISHING CO., LTD.

2. Outline ■Exhibition name: Mobile Component Forum 2004. （Co-held with EXPO COMM WIRELESS JAPAN 2004.） ■Organized by E.J. Krause & Associates, Inc. / RIC Telecom Co., Ltd. ■Supported by KOGYO CHOSAKAI Publishing Co., Ltd. ■Date：July 21 to 23, 2004 ■Venue: Tokyo Big Sight – Tokyo International Exhibition Center- ■Attendee: 6,000 from Mobile equipment technology field. ■The number of exhibitors: 40 companies and 600sqm expected ■The event consists of exhibition, Symposium and commercial presentation. Application layer EXPO COMM WIRELESS JAPAN Network layer Mobile Component Forum 2004 Component layer

3. What is Mobile Component Forum? 3.5G/4G mobile phone, High-speed wireless communication, Mobile TV to receive Grand digital wave, Telematice and car navigation on board and many other mobile products are fundamental for Ubiquitous society and the usage of the mobile products have been expanding throughout the mobility society. The event “Mobile Component Forum 2004” just only focus on components for mobile products. The event is place where advanced mobile component technologies and engineers of mobile set maker exchange technical information for further business development. This technical exchanging is surely effective matchmaking. Because Communication between them can make possible to catch set makers needs and propose solutions to set makers. Companies who want to have develop business on Japan’s mobile component market should be at Mobile Component Forum 2004.

4. What is the problem for Japan’s existing exhibition ? Why is Mobile Component Forum born? Noisy Stage Big Sound Model Performance “Can’t talk business…anymore !” said by engineers & exhibitors

5. What is the problem for Japan’s existing exhibition ? Q. What kind of function will you want at event? Miss the business chance! Q. Improvement you expect for events？ First :More rest space Second :Should be more quiet : fifth :Want to talk with educated staff ・・ From visitor survey of EXPO COMM WIRELESS JAPAN 2003

6. So Mobile Component Forum is planned The most important on limited market is not visual performance but deep communication. Real Trade Exchange in Quiet Environment Matchmaking with hearing and proposal. Less Sound No Model performance STRUCTURES for trade meeting through the event. 1, Package demonstration salon for targeted visitor’s communication. 2, Speaking chance at the symposium. “hearing” “communicating” “proposal” “Opportunity for Pre-sales Activity”

7. Strategy of the Mobile Component Forum Unilateral solution proposal ended. Now it is time to built up relationship through communication with potential customers. plus Business cards collection first sales stage Second sales Final sales Close a deal ＝ This is style of Mobile Component Forum This is function of normal event 6000 targeted visitor come together!

8. Attendee Target Engineers of Circuit design, R&D, Electronics packing technology, SE, Programmer for mobile products ++ Mobile Carrier: R&D leader ++ Mobile set maker : Circuit design, R&D, Electronics packing technology, SE, Programmer ++ Wireless System/Terminal Manufacturer: R&D and Engineering leader ++ Electronics Manufacturer: R&D leader ++ Car & Car electronics company : R&D leader, Management ++ Broadcast : R&D leader, Management Over6,000 engineers come and communicate -expected-

9. Exhibit Category Exchange technical information with engineers of mobile equipment maker. <<Parts>> IC tag, Tip, Connector, Switch, Terminal, Speaker, Microphone, heat countermeasure, CCD, Noise countermeasure, Memory IC, Memory stick, circuit, electrode, antenna, condenser, quartz, vibration, others <<Board & material>> Printed wiring board, Flexible circuit, Integral substrates, Bonding material, Solder, Flat panel, touch panel, plastic, rubber, cable, Magnet disc, Ceramic material, key-board, Magnet, Insulation material, others <<Display>> Liquid crystal display, Organic EL display, PDP、and other display instruments <<Power>> Fuel Cell, Secondary cell, Power supply equipment, Battery charger and others <<Measurement>> Sensor, Analyzer, Tester and others <<Related material>> Electric packaging technology, Plating equipment, edging equipment and others

10. Demonstration salon and Speaking chance detail Company can have demonstration and technical discussion with visitors with drinking. Following is included in fee. ** space ** wall ** carpet ** meeting table and chair ** demonstration table ** registration counter ** company sign board Speaking Chance at symposium **Company can present and explain about technology details. **One slot is 60 min. long. **Audience require pre-registration. **Audience data is given to speaking company. **Room capacity is about 100seats.

11. Exhibit fee Platina Sponsor : \5,000,0000- **Demonstration Salon 54sqm (decoration, meeting set incl.) **Speaking chance -Key-note speech:50min. long and one slot of Symposium:60 min. long **Company Logo posted on the forum Web **Printing promotion Material Gold Sponsor : \4,500,000- **Demonstration Salon 36sqm (decoration, meeting set incl.) **Speaking chance : two slots of symposium -60 min. long per a slot **Company Logo appeared on Web **Printing Promotion Material Silver Sponsor : \2,000,000- **Demonstration Salon 18sqm(decoration, meeting set incl.) **Speaking chance : one slot of symposium -60min. Long. **Printing Promotion Material Bronze Sponsor : \1,200,000- **Demonstration Salon 18sqm(decoration, meeting set incl.) **Printing Promotion Material

12. Co-held with Mobile Component Forum 2004 about WIRELESS JAPAN 2004 Wireless Japan is the only one trade event focused on mobile & wireless network in Japan Wireless Japan 2003 Profile The number of attendee : 36,851 people Who visited?: Engineers of Circuit designer, R&D, Electronic packing technology in Mobile Telecom carrier, Mobile set maker, Automotive, Electronics maker and other field. >>>>10,424 engineers 10,424 engineers came to the show and communicated with exhibitors Mobile Component Forum visitor target Who were exhibitors? : NTT DoCoMo, KDDI, Vodafone, NEC, Panasonic, SANYO, KYOCERA, TOSHIBA, Wi-Fi alliance, Intel, RENESAS Technology and other 170 exhibitors