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LL/MIT REXIS/OBF Telecon

LL/MIT REXIS/OBF Telecon. 12/13/12. Agenda (MIT Action Items). Packaging schedule Epoxies to be used in CCD packaging Conformal coating of flexprints Materials information for NASA CCD characterization data. Packaging Schedule. Still on schedule for 1/21/13 delivery of parts

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LL/MIT REXIS/OBF Telecon

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  1. LL/MIT REXIS/OBF Telecon 12/13/12

  2. Agenda (MIT Action Items) • Packaging schedule • Epoxies to be used in CCD packaging • Conformal coating of flexprints • Materials information for NASA • CCD characterization data

  3. Packaging Schedule • Still on schedule for 1/21/13 delivery of parts • Flexprints, alumina substrates, and circuit components ordered (thanks Keith!) • Next is aluminum pieces, transport box after that

  4. Epoxies for CCD Packaging • Is the current spec or the ACIS spec correct? • Is Crest 3135 RTV or epoxy? • Does thermal data exist for Epotek 377?

  5. Conformal Coating of Flexprints • Flexprint active circuitry area requires some kind of coating for ESD protection • Is solder mask enough? • All vias on the board are tented • If solder mask is not enough, what is recommended? • Where should coating be done?LL or Kavli or by the vendor?

  6. Material Information for NASA • NASA needs exact specifications on materials we are using in the package • Need the following info (see attached spreadsheet) • Assembly processes • Materials used • Standards/specifications for materials used • Organics only: Amount used and outgassing data • Need to file preliminary spreadsheet by 1/4/13

  7. CCD Characterization Data • What is currently available or can be available soon? • Harvard can plug in any available data to their simulations • Is anything needed from MIT besides the wish list that was already sent over? • I owe Keith a metrology wish list

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