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From Nanoscience to Nanomanufacturing

From Nanoscience to Nanomanufacturing. Biosensor. Molecular logic gate 2002. STM manipulation of atoms 1989. AFM 1986. AFM manipulation of a SWNT 1999. Memory device. Informed public and workforce. Environmentally benign processes. Source: IBM. Past and present:.

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From Nanoscience to Nanomanufacturing

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  1. From Nanoscience to Nanomanufacturing Biosensor Molecular logic gate 2002 STM manipulation of atoms 1989 AFM 1986 AFM manipulation of a SWNT 1999 Memory device Informed public and workforce Environmentally benign processes Source: IBM Past and present: Manipulation of few atoms and SWNTs STM 1981 Future: Manipulation of billions of atoms and SWNTs Templates High rate High volume Reliability and Accelerated Test 2004 2006 2007

  2. Reliability, Accelerated Test, Properties • Monitor reliability of materials, interfaces, and systems to ensure manufacturing readiness. • Changes in material or contact properties with environmental exposure, stress, temperature … • Accelerated testing for reduced manufacturing risk. • Rapid mechanical, electrical, and thermal cycling with measurement capability. • Example: MEMS devices to rapidly cycle strain or temperature while measuring resistance and imaging in SEM or STM. UHV compatible. • Nanoscale material and interface property monitoring. • Example: Measure adherance force and friction between functionalized nanoelements and functionalized substrates. • Example: Measure Young’s modulus and yield strength of nanoelements. MEMS Device for Accelerated Test Interaction of AFM Cantilever with Suspended Nanotube

  3. MEMS Testbed for Accelerated Testand Properties Measurement Innovative MEMS devices characterize nanowires (also nanotubes, nanorods and nanofibers) and conduct accelerated lifetime testing allowing rapid mechanical, electrical, and thermal cycling during AFM/SEM/UHV SPM observation.

  4. MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire Au, Ru, and RuO2 nanowires tested.

  5. MEMS Nanoscale Accelerated Testing, Hot Plate with Nanowire Ru, before testing. Ru, after testing. RuOx, after testing. • Ru lasts longer in N2. • RuOx fails more quickly than Ru. • RuOx shows more pronounced surface diffusion.

  6. MEMS Nanoscale Material Properties Measurements, Nanoscale Pull Test

  7. Process Test Mask for Characterization of Reliability and Interface Properties Purpose: Monitoring of nanoelement assembly processes.

  8. Type II CHN Nanotube Switch for Non-Volatile Memory Schematic of state I and II. • Type II Switch has two symmetric non-volatile states. • Simple process. • CNTs assembled directly on chip using dielectrophoresis or using template transfer. • Measurements in progress. • CNT/Surface interaction critical, measurements in progress.

  9. Directed Assembly of a Single SWCNT by Dielectrophoresis

  10. AFM Measurement of CNT-Surface Interaction • What: Development of technique for measurement of interactions between functionalized nanotubes and functionalized surfaces. • Purpose: Process control for single nanotube switch process. F/d On neighboring Substrate F/d On Suspended CNT RMS and A-B Data Plotted for a 100 nm Z-Piezo Displacement Below the Substrate

  11. Goal and Desired Outcome • Develop Generally Applicable Tools and Testbeds for: • Accelerated test of Nanoelements, Interfaces, and Systems. • Measurements of Reliability of Nanoelements, Interfaces, and Systems. • Measurements of properties of nanoscale elements. • These tools will help to ensure manufacturing readiness and will help to reduce the time for technology transition to manufacturing.

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