1 / 14

Package EBD/EMD

Package EBD/EMD. Walter Katz IBIS Interconnect 11/13/12. Overview. Multi Chip Module (MCM) is a Package with Multiple Die Example MCM as an EBD EBD Electronic Board Description Example as an EMD EMD Electronic Module Description A Nose by Any Other Name Still Smells

makaio
Download Presentation

Package EBD/EMD

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Package EBD/EMD Walter Katz IBIS Interconnect 11/13/12

  2. Overview • Multi Chip Module (MCM) is a Package with Multiple Die • Example MCM as an EBD • EBD Electronic Board Description • Example as an EMD • EMD Electronic Module Description • A Nose by Any Other Name Still Smells • Example.ipkg • EMD using Parameter Tree Format • Modeling Connectors Using EMD • Wire Bond Models • Proposed Package Modeling Path

  3. MCM is a Package with Multiple Die Pins Components U1.7 U1.8 A1 U2.7 U2.8 A2 U3.7 U3.8

  4. Example EBD [IBIS Ver] 6.0 [File name] Example.ebd [Begin Board Description] Example [Manufacturer] SiSoft [Number Of Pins] 2 [Pin List] signal_name A1 XYZ A2 DEF [Extended Nets] XYZ A1 U1.7 U2.7 U3.7 DEF A2 U1.8 U2.8 U3.8 [End Extended Nets] [IBIS-ISS Package] Example.ipkg [Reference Designator Map] | Ref Des File name Component name U1 memory.ibsmemory U2 memory.ibs memory U3 memory.ibsmemory [End Board Description] [End]

  5. Example as an EMDA Nose by Any Other Name Still Smells [IBIS Ver] 6.0 [File name] Example.emd [Begin Module Description] Example [Manufacturer] SiSoft [Number Of Pins] 2 [Pin List] signal_name A1 XYZ A2 DEF [Extended Nets] XYZ A1 U1.7 U2.7 U3.7 DEF A2 U1.8 U2.8 U3.8 [End Extended Nets] [IBIS-ISS Package] Example.ipkg [Reference Designator Map] | Ref Des File name Component name U1 memory.ibsmemory U2 memory.ibs memory U3 memory.ibsmemory [End Module Description] [End]

  6. Example.ipkg (XYZ (File Example.iss) (Subckt XYZ) (Model_Ports (1 (Pin_nameA1)) (2 (Pin_name 7) (Ref_des U1)) (3 (Pin_name 7) (Ref_des U2)) (4 (Pin_name 7) (Ref_des U3)) ) ) (DEF (File Example.iss) (SubcktDEF) (Model_Ports (1 (Pin_nameA2)) (2 (Pin_name 8) (Ref_des U1)) (3 (Pin_name 8) (Ref_des U2)) (4 (Pin_name 8) (Ref_des U3)) ) )

  7. EMD using Parameter Tree Format (Example (IBIS_Ver 6.0) (File_nameExample.emd) (Module (Name Example) (Manufacturer SiSoft) (Number_Of_Pins 2) (Pins (A1 XYZ) (A2 DEF)) (Extended_Nets (XYZ A1 U1.7 U2.7 U3.7) (DEF A2 U1.8 U2.8 U3.8)) (IBIS-ISS_PackageExample.ipkg) (Reference_Designator_Map (U1 memory.ibsmemory) (U2 memory.ibsmemory) (U3 memory.ibsmemory)) ))

  8. Connector is an EMD Side B Pins Side A Pins A.A1 B.A1 A.A2 B.A2

  9. Connector EMD [IBIS Ver] 6.0 [File name] Connector.ebd [Begin Module Description] Connector [Manufacturer] SiSoft [Number Of Pins] 4 [Pin List] signal_name A.A1 A1 A.A2 A2 B.A1 A1 B.A2 A2 [Extended Nets] A1 A.A1 B.A1 A2 A.A2 B.A2 [End Extended Nets] [IBIS-ISS Package] Connector.ipkg [End]

  10. Connector.ipkg (A1 (File Connector.iss) (Subckt Simple) (Model_Ports (1 (Pin_nameA.A1)) (2 (Pin_nameB.A1)) )) (A2 (File Connector.iss) (Subckt Simple) (Model_Ports (1 (Pin_nameA.A2)) (2 (Pin_nameB.A2)) )) (Full (Tstonefile Connector.s4p) (Model_Ports (1 (Pin_nameA.A1)) (2 (Pin_nameB.A1)) (3 (Pin_name A.A2)) (4 (Pin_name B.A2)) ))

  11. Connector EMD Parameter Tree (Connector (IBIS_Ver 6.0)(File_nameConnector.emd) (Module Connector (Number_Of_Pins 4) (Pin List (A.A1 A1)(A.A2 A2)(B.A1 A1)(B.A2 (Extended_Nets(A1 A.A1 B.A1)(A2 A.A2 B.A2)) (Package (Full (Tstonefile Corner(typ.s4p min.s4p max.s4p)) (Model_Ports (1 (Pin_name A.A1)) (2 (Pin_name B.A1)) (3 (Pin_name A.A2)) (4 (Pin_name B.A2)) ) ) ) ) )

  12. Wire Bond Models • Bump pads are easy • Package “Pads” mate directly to Die Bump Pads • Wire Bonds can be handled multiple ways • Included in package model • Wire bond lengths can be parameterized • Can be handled as separate interposer EMD • Package EMD has connections between • Package Pins • Package wire bond pads • Wire Bond interposer EMD has connections between • Package wire bond pads • Die wire bond pads

  13. Proposed Package Modeling Path • Define new EMD standard to describe Module Interconnect of • MCM • Connector • Cable • Single Die Package • Enhance .ibs to handle • IBIS-ISS on-die interconnect • IBIS-ISS package interconnect

  14. Conclusions • EBD can be easily extended to support MCM • Can define new standard EMD if we get hung up by the word “Board” in EMD • EMD can either be Legacy IBIS format or Parameter Tree • EMD supports Connector Models • We should start by creating new EMD standard, then adding on-die and package modeling to .ibs

More Related