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We are Back -- BL8x0c i4. November 2012 Helen Li. 仅供内部使 用 , 请勿外传. The information contained in this presentation is proprietary to Hewlett-Packard Company and is offered in confidence, subject to the terms and conditions of a binding Confidential Disclosure Agreement (CDA)
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We are Back --BL8x0c i4 November 2012 Helen Li
仅供内部使用, 请勿外传 • The information contained in this presentation is proprietary to Hewlett-Packard Company and is offered in confidence, subject to the terms and conditions of a binding Confidential Disclosure Agreement (CDA) • HP requires customers and partners to have signed a CDA in order to view this training • The information contained in this training is HP confidential, but will become HP restricted after announcement • HP does not warrant or represent that it will introduce any product to which the information relates • The information contained herein is subject to change without notice • HP makes no warranties regarding the accuracy of this information • The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services • Nothing herein should be construed as constituting an additional warranty • HP shall not be liable for technical or editorial errors or omissions contained herein
Now We are back • 相关资料: • HP Integrity server blades family data sheet • HP Integrity Systems family guide • Customer deck and FAQ (internal only) will be on NPI SharePoint.
处理器 两倍核数, 三倍性能 兼容:同一机箱中可以混插i2 , i4 刀片 内存 支持低电压DIMM(4GB,8GB,16GB), 每片功耗降低30watt 分区 支持HP-UX Virtual Partitions (vPars) and Integrity VM v6.1 ( 不变) 支持nPar 电器隔离硬分区 ( 重要功能增强) 其它 嵌入式 Virtual Connect FlexFabric 512MBSAS Read-only cache Customers Now have a better choice更强功能, 更低功耗 HP Integrity server blades
BL8x0c i4 产品规格 Newfeatures
中国区配置选择(暂定) • 根据最终性能测试指标和成本变化, 可能会有所调整
BL860c i2 停产时间( 预计) • 以上为产品目前计划的 EOL 时间 • 根据公司业务和市场状况, 以上时间可能调整 • HP 提供EOL后至少5年的 产品支持服务 • 如果物料情况允许,EOL 后仍可通过特殊审批流程下单
Outstanding savings 38.7% on IT operation and administration* 36.3% on Server Hardware and support costs* 36.2% on Facilites costs* 33.0% on Server Software and support costs* 32.6% total IT cost savings over three years* HP Integrity server blades 升级方案 费用节省 > 32% 2x HP BL890c i2 (8 chips / 32 cores)8 x HP BL860c i2 (2 chips / 8 cores) running HP-UX 11i v3 2x HP BL870c i4 (3 chips / 24 cores)3 x HP BL860c i4 (2 chips / 16 cores) running HP-UX 11i v3 *Based on HP results using Alinean, Inc. TCO/ROI tools, Germany, October xx, 2012
全新竞争格局:i4Vs. IBM P7/P7+ Upgrade by Blade-Link Upgrade by Blade-Link Downgrade with nPar Blade Servers Downgrade with nPar Upgrade by Blade-Link Downgrade with nPar BL890c i4 BL870c i4 BL860c i4 Superdome 2 8s Rx9800 Poulson Rx9900 Up to 128 core 4-64 core 4~16 core up to 32 core1 4-8 core Up to64/128 core Up to 16 core Up to 48 core2 Only upgrade available POWER7+ BladeCenter PS700/PS701 BladeCenter PS702/PS703 POWER 730 (8231-E2C) POWER 710 (8231-E1C) POWER 750 (8233-E8B) POWER 770 (9117-MMD) POWER 780 (9179-MHD) POWER 740 (8205-E6C) POWER 720 (8202-E4C) 1 BladeCenter PS704 had been withdrawned from marketing on Oct 5, 2012. 2IBM has not announced the 4 cores processor on Power 770(9117-MMD) in china
全新竞争格局:i4 Vs. Oracle T4 & M Series Upgrade by Blade-Link Upgrade by Blade-Link Blade Servers Downgrade with nPar Downgrade with nPar Upgrade by Blade-Link Downgrade with nPar BL890c i4 BL870c i4 BL860c i4 Rx9800 Rx9900 Poulson Up to 128 core 4-64 core 4~16 core up to 32 core 4-8 core Up to 16 core Up to 64 core Up to 256 core SPARC T4-1B/ NetraSPARC T4-1B SPARC T3-1 SPARC T4-4 SPARC T4-1/ Netra SPARC T4-1 SPARC T3/T4 (CMT) SPARC T4-2 SPARC64 VII/VII+ M4000 M3000 M5000 M8000 M9000
HP Integrity server blades with VC FlexFabric Optimized for flexible connectivity to LAN & SAN Configurable LAN & SAN connections Adjust bandwidth to meet workload requirements Provides all your connectivity needs LAN SAN From 4 FlexNICs per blade To 12 FlexNICs & 4 FlexHBAsper blade 10 Gb 4.0 0.5 2.0 3.5 Virtual Connect FlexFabric Module 10Gb 10Gb 10Gb 10Gb 10Gb 10Gb 10Gb 10Gb
HP Integrity server blades competitive positioning (Power 7/7+) HP Integrity Blades IBM Power 7/7+ Compare Complex array of products that limit flexibility and have different management interfaces. Unified blade architecture from x86 to Superdome Patchwork of virtual network offerings with lack of consistency across products Virtual Connect FlexFabric Lacks key critical availability features including electrical isolation Always on resiliency Inability to provide integrated turn-key solutions and portfolio offerings CloudSystem Matrix with HP-UX