1 / 40

The STAR Pixel Upgrade

The STAR Pixel Upgrade. H. Wieman Heavy Quark Workshop LBNL 1-Nov-2007. topics. Pixel silicon Readout STAR telescope tests Mechanical Integration in STAR Pixel mechanical. Some pixel features. Silicon program. IReS/LEPSI  IPHC (Strasburg). M. Winter C. Hu C. Colledani

mliss
Download Presentation

The STAR Pixel Upgrade

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. The STAR Pixel Upgrade H. Wieman Heavy Quark Workshop LBNL 1-Nov-2007

  2. topics • Pixel silicon • Readout • STAR telescope tests • Mechanical Integration in STAR • Pixel mechanical

  3. Some pixel features

  4. Silicon program IReS/LEPSI  IPHC (Strasburg) M. Winter C. Hu C. Colledani W. Dulinski A. Himmi A. Shabetai M. Szelezniak I. Valin

  5. MIMOSTAR 2/3 technology Grzegorz Deptuch

  6. IPHC Functional Sensor Development All sensor families: • 30 x 30 µm pixels • CMOS technology • Full Reticule = 640 x 640 pixel array Mimostar 2 => full functionality 1/25 reticule, 1.7 µs integration time (1 frame@50 MHz clk), analog output. (in hand and tested) Phase-1 and Ultimate sensors => digital output (in development) Data Processing in RDO and on chip by generation of sensor. The RDO system design evolves with the sensor generation. Leo Greiner

  7. Phase 1 / Ultimate technology (MIMOSA8/16/22) forward bias diode Discriminator

  8. IHCP Marc Winter et al

  9. IHCP Marc Winter et al

  10. IHCP Marc Winter et al

  11. IHCP Marc Winter et al

  12. Silicon summary, development of STAR pixels • Understand MIMOSTAR 3 yield issues • Fab Phase 1 based on MIMOSA16/22 technology (digital output, no zero suppression) • Fab Ulitimate based on MIMOSA16/22 and SUZE technology (digital with zero suppression) • Issues • Dead center MIMOSTAR 3 • Pursue large area gate oxide hypotheses, change layout • Radiation hardness (bulk damage) • Reduce temperature • Investigate silicon improvements

  13. Readout program LBNL Leo Greiner Xiangming Sun Michal Szelezniak Thorsten Stezelberger Chinh Vu Howard Matis

  14. Stack of 3 MIMOSTAR2 pixel chips, Chip dimension: 4 mm X 4mm, 128 X 128 pixels Prototype 3 Sensor Telescope Our goal was to test functionality of a prototype MIMOSTAR2 detector in the environment at STAR in the 2006-2007 run at STAR. We obtained information on: • Charged particle environment near the interaction region in STAR. • Performance of our cluster finding algorithm. • Performance of the MIMOSTAR2 sensors. • Functionality of our tested interfaces to the other STAR subsystems. • Performance of our hardware / firmware as a system. • The noise environment in the area in which we expect to put the final PIXEL detector.

  15. Telescope Infrastructure at STAR Magnet Pole Tip Electronics Box Beam Pipe Insertion tube

  16. On the fly cluster finding first used with MIMOSTAR analog chips

  17. Telescope DAQ

  18. Distribution of track angles in Mimostar2 telescope Xiangming Sun MichalSzelezniak

  19. RDO Board(s) Two board System – Virtex-5 Development board mated to a new HFT motherboard Xilinx Virtex-5 Development Board New motherboard • Digital I/O LVDS Drivers • 4 X >80 MHz ADCs • PMC connectors for SIU • Cypress USB chipset • SODIMM Memory slot • Serial interface • Trigger / Control input Note – This board is designed for development and testing. Not all features will be loaded for production. • FF1760 Package • 800 – 1200 I/O pins • 4.6 – 10.4 Mb block RAM • 550 MHz internal clock Leo Greiner

  20. Sensors, Ladders, Carriers (interaction point) LU Protected Regulators, Mass cable termination RDO Boards DAQ PCs System Design – Physical Layout 1 m – Low mass twisted pair 30 m Power Supplies Platform 3 m - twisted pair 100 m - Fiber optic cables Magnet Pole Face (Low Rad Area ?) DAQ Room Leo Greiner

  21. Data Rates - Parameters Radius • Rates as per Jim Thomas, L = 3 x 1027 for Phase-1, L = 8 x 1027 for Ultimate. • 2.5 hits / cluster. • 1 kHz average event rate. • 10 inner ladders, 30 outer ladders. • Factor of 1.6 for event format overhead (can be lowered). • No run length encoding. R = 8.0 R = 2.5 200 us Hits / Sensor at L = 8 x 1027. Integration Time 640 us Leo Greiner

  22. Data Rates • Ultimate => 49.7 MB / s raw addresses. => 79.5 MB / s data rate. • Phase–1 => 59.6 MB / s raw addresses => 95.4 MB / s data rate. The dead-time is primarily limited by the number of externally allocated readout buffers! Leo Greiner

  23. Mechanical Program • Eric Anderssen, LBNL engineer working on ATLAS pixels is phasing into our pixel program – full time in January 2008 (carbon composite expert) • Contracted ARES company for analysis on cooling, precision mount design and refinement of ladder stability. • Phone meetings weekly • First results – • we will need a sub ambient cooling system • simplified precision mount • First stage report due in January • Addressing two items: • Cylinder modifications for integration of GEMS, IST and Pixels • Pixel mechanical design

  24. Cut Apart Current Cones August 2009 Keep at Brookhaven Send to Berkeley Eric Anderssen Old East Cone and most of Beams to be reused to support New West Cone Old West cone refurbished into New East Cone in Berkeley Cut Carbon Elliptical Beams avoiding Al Insert 25

  25. Modified East Cone and Install with New West Cylinder ~1.5m Some Tooling Required… Buck Plate aimed for Easy Swap of replacement Eric Anderssen • View as Temporary Fix—Should be ACAP (as cheap as possible) • Supports end of New West Cone/FGT • Replicates Old Beam Pipe Interfaces • Includes SSD if required • Only for summer ’09 to ‘10 • Wholly Machined/Bonded Solution • Tooling to locate Buck Plate while bonding is required…

  26. Goal—Swap-in Replacement and Install pixels – summer 2010 New East Cone with Cylindrical Shell made from Old West Cone Swap in by matching Bolted Interface to New West Cone… Include SSD interface On Shell Modification Will Take Up Length… Should Be Same Length Eric Anderssen

  27. Inner Support Cylinder (ISC) ISC fits inside and is supported by the cone ISC supports IST on outside ISC supports pixel and beam pipe inside ISC

  28. Pixel support structure – changes and progress End view 8 cm radius 2.5 cm radius Inner layer Outer layer ALICE style carbon support beams (green)

  29. cable bundle

  30. Conceptual mechanical design

  31. Pixel placement concept • Detector assembly slides in on rails • Parallelogram hinges support the two detector halves while sliding • Cam and follower controls the opening of the hinges during insertion and extraction • Detector support transfers to kinematic dock when positioned at the operating location pixel support hinges sliding carriage slide rails spring loaded cam followers and linear cam

  32. Hinge analysis

  33. Two sector patch installation – summer 2010

  34. Final installation, complete cylinders Aug 2011 End

  35. yearly dose numbers • Au + Au • RHIC II luminosity: 7X1027 1/(cm2 sec) • Weeks per year operation: 25 • Fraction of up time: 60% • radius: 2.5 cm • pion dose: 73 kRad • UPC electron dose: 82 kRad • Total dose: 155 kRad • TLD measured projection: 300 kRad • radius: 8 cm • pion dose: 7 kRad • UPC electron dose: 2 kRad • Total dose: 9 kRad • TLD measured projection: 29 kRad

  36. Grzegorz Deptuch

  37. MIMOSA8, Yavuz Degerli et al IRes/LEPSI DAPNIA/SEDI

More Related