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Pixel vertex detector upgrade at STAR

Pixel vertex detector upgrade at STAR. PIXEL detector status at the HFT CD1 review (12, 13 Nov 2009) Mechanics (Howard Wieman) Silicon sensors (Leo Greiner/Marc Winter) Readout electronics (Leo Greiner) Michal Szelezniak NSD M 3 meeting, January 25, 2010. TPC – time projection chamber

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Pixel vertex detector upgrade at STAR

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  1. Pixel vertex detector upgrade at STAR PIXEL detector status at the HFT CD1 review (12, 13 Nov 2009) Mechanics (Howard Wieman) Silicon sensors (Leo Greiner/Marc Winter) Readout electronics (Leo Greiner) Michal Szelezniak NSD M3meeting, January 25, 2010

  2. TPC – time projection chamber HFT – heavy flavor tracker SSD – silicon strip detector IST – inner silicon tracker PXL – pixel detector (PIXEL) Graded resolution: TPC→SSD → IST → PXL ~1mm ↘ ~300µm ↘ ~250µm ↘ <30µm

  3. PIXEL Mechanics

  4. Silicon sensors for PIXEL

  5. PIXEL detector readout

  6. Summary • Development of the detector’s mechanical support is well advanced • Very low mass detector support designs have passed multiple analysis tests and prototype tests addressing cooling and position stability. • Prototype tooling is in place and tested for sector/ladder production • Concept designs for installation and insertion are well advanced • MAPS technology development at IPHC is going well • Analog output sensors have been used successfully in beam at STAR. The noise environment and interfaces to STAR infrastructure seem to be understood. • First generation digital output sensors (Phase-1) have been fabricated and are currently under test. Initial results look promising. • The RDO data path architecture has been validated and hardware prototypes have been produced • Interfaces to STAR infrastructure seem to be understood • Testing of individual sensors works well • We will now extend the firmware and software to reading out 10 sensor ladders. • Ready for CD 2/3 Q3FY10

  7. Unused slides

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