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Assembly and Packaging 13 participants (Taiwan and Korea not represented). Reviewed assignments and progress to date Participated in Cross TWG with ERM/ERD to identify future A&P requirements Resolved TSV and 3D stacking treatment with Interconnect Reviewed tables and worked on revisions
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Assembly and Packaging13 participants (Taiwan and Korea not represented) • Reviewed assignments and progress to date • Participated in Cross TWG with ERM/ERD to identify future A&P requirements • Resolved TSV and 3D stacking treatment with Interconnect • Reviewed tables and worked on revisions • Added power device treatment as part of MtM treatment • Working session on Tera-scale computing SiP • Review and revision of chapter outline • Wireless TWG and A&P would like to request formation of a MEMS TWG and we are both prepared to assign our MEMS sub-goups to work on setting up this TWG. Thank You