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Learn about the CPMT Chapter in Austin's leadership team, past meetings with expert speakers, and successful 3D packaging workshops. Stay updated on upcoming events and opportunities for involvement.
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CPMT-Chapter in Austin(Components, Packaging and Manufacturing Technology) IEEE Central Texas SectionFall Planning MeetingFebruary 6, 2010San Marcos, TX
CPMT-Chapter in Austin Leadership Team • Chair– Om P. Mandhana Email: Om.Mandhana@freescale.com, Ph# (512)-944-3372 • Secratary– Bhyrav Mutnury Email: bmutnury@us.ibm.com, Ph# (512)823-6918 • Technical Program Chair– Rohan Mandrekar Email: @us.ibm.com, Ph# • Technical Program Co-Chair– Paul M. Harvey pmharvey@us.ibm.com, Ph#: (512) 838-8654 • Treasurer - Jonathan Burnett Email: Jon.Burnett@freescale.com, Ph# (512)996-5140 • Webmaster – Daniel N de Araujo Email: ddearaujo@ansoft.com, Ph# (512)340-0700
CPMT-Chapter in Austin Election of New-Leadership Team • Chair and Treasurer of the Chapter completed 2 year term • The election committee members sent an email to invite names for the post of Chair, Treasurer and other posts also. • The deadline for filing the names was January 29, 2010 • Therefore, the election of new leadership team is not yet completed
CPMT-Chapter in Austin • Five meetings with invited Speakers were held in 2009 • 10th Meeting: February 12, 2009 Invited Speaker:Dr. Paul Ho, Director of the Laboratory for Interconnects and Packaging at The University of Texas at Austin Topic: Packaging Effects on Mechanical Reliability of Cu/low k Interconnects • 11th Meeting: June 4, 2009: Invited Speaker:Glenn G. Daves,Director of Packaging Solutions Development at Freescale Semiconductor, Austin, TX Topic: Packaging Development and Market Alignment • 12th Meeting: August 6, 2009 Invited Speaker:Dr. M. Baris Dogruoz, Senior Product Specialist, ANSYS Inc Topic: Advances in Thermal Modeling of Electronic Packages and Printed Circuit Boards
CPMT-Chapter in Austin • 13th Meeting: September 3, 2009: Invited Speaker:Sam Chitwood,Manager, Field Applications Engineering, Sigrity Inc., CA Topic: S-parameter Modeling for Signal and Power Distribution System Analysis • 14th Meeting: October 1, 2009 Invited Speaker:Dr. Ali Akbar Merrikh, Senior System Designer, Thermo-Mechanical Engineering Team, AMD-Austin, TX Topic: LOW-PROFILE CHIPSET MICROPROCESSOR HEATSINK OPTIMIZATION FOR SERVER FORM FACTORS
CPMT-Chapter in Austin 2009 Meeting Attendance Members Non MembersTotal Feb 12 08 12 = 20 June 4 09 10 = 19 August 6 05 07 = 12 September 3 07 10 = 17 October 1 06 10 = 16
3D Packaging Workshop from IEEE’s CPMT- Chapter in AustinMarch 27, 2009, at Freescale Semiconductor Parmer Lane Auditorium in Bldg A 7700 W. Parmer Lane Austin, TX 78729 Registered Participants = 37 (@ $75.00 Guest = 3 (Free) Invited Speakers = 13 (Free) Organizers = 06 (Free) Net Income = $ 2492.51
CPMT-Chapter in AustinOverview 2008 Meeting Location:Freescale Semiconductor, Austin, TX Meeting Time:1st Thursday of month No charge Don’t see this as a problem as long as small expenses (~$55-60) per meeting are supported by CTS-section Attendance: Good (Average ~ ) Speakers: Experts from Industries and Academia 3D Packaging Workshop: Very successful
Issues (if any) • We need to attract students to our Chapter meetings • We need financial support for Sponsoring Speakers