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Explore the innovative use of diamond-based composites in collimators for EuCard, fabricated through a liquid metal infiltration process with key considerations including thermal conductivity and net-shape solutions.
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Diamond based Composites for Collimators Contribution to EuCard L. Weber Laboratory for Mechanical MetallurgyEcole Polytechnique Fédérale de Lausanne (EPFL) CH-1015, Lausanne, Switzerland
Liquid metal infiltration process • Alternative routes: • hot pressing of powder mixtures • hot pressing of coated particles
Pressure infiltration apparatus • Cold wall vessel (250 bar, 200°C) Inner side of the wall in contact with a water cooled heat shield • Induction heating (using a graphite susceptor) • primary vacuum pump (0.1 mbar) • Crucible can be lowered on quench (directional solidification) 100 mm
Mono-crystalline diamond • Low nitrogen level • Relatively large size (>100µm) Selected diamond grit
Diamond particle size: the larger the better the TC • Limited machinability => Need for net-shape solutions • Size of the net-shape parts • Radiation damage in Diamonds • CTE varies strongly with temperature • Electrical conductivity rather low (5-10 MS/m) Critical issues
Diamond composites: 60-75 vol-% diamond + Al, Ag, Cu • Parts: fabrication capacity established for plates in Ag-Si diamond and Al-diamond • size: 80*300*10 mm3 • Expected thermal conductivity (@RT): • >800 W/mK for Ag-Si composites • >600 W/mK for Al based composites Materials & parts
Cu-B composites: First results: CTE
Ag-3Si composites: First results: CTE
Brazing of SiC on diamond composites • Thermal fatigue of SiC brazed on substrate • Mechanical tests • Thermal conductivity measurement: • 3 setups: 0-40°C, 4-300 K, 100-500 K Other tasks