Joint Research Activity JRA 4 Multi-coincidence detectors for low-energy particles

1. Joint Research Activity JRA 4 Multi-coincidence detectors for low-energy particles Participating countries France, Germany, Israel Tasks A)           Multi-pixel detectors for low-energy particles B)           CCD-camera based multifragment-detector development C)           Optimization of the delay line technique D)           Crossed wire detector Coordinators: Joachim Ullrich, Alexander Dorn Max Planck Institut für Kernphysik, Heidelberg, Germany

2. Joint Research Activity JRA 4: Develop new, more risky technologies Optimize the most promising and complementary concepts on the market Well-adapted selection of solutions • Interaction of energetic ions with matter: • At least a few but usually many tens of electrons and ions are freed • on a fs-time scale. • Many-particle imaging and detection systems become indispensable. • Present day detectors in many aspects do not fulfill the required • specifications.

3. Ion cluster collisions Université Lyon SergeMartin et al. C60 Observation of fragmentation and capture dynamics Xe25+

4. Sophisticated imaging techniques: target „Reaction Microscope“ projectile Frankfurt, Heidelberg electrons E-field Complete views of atomic reactions. recoil-ions Collisions with ions, electrons, laser and FEL pulses ~~~~~~~~~~~~> ~~~~~~~~~~~~> ne ~ 40 ~~~~~~~~~~~~> ~~~~~~~~~~~~> ~~~~~~~~~~~~> ~~~~~~~~~~~~>

5. 59 – 64 53 – 59 48 – 53 43 – 48 37 – 43 32 – 37 27 – 32 21 – 27 16 – 21 10 – 16 5 – 10 0 – 5 q q q E q Electron impact double ionization (e,3e) E0 = 2000 eV |q| = 0.5 a.u. Eb = Ec = 5 eV

6. Coulomb explosion imaging Max-Planck-Institut für Kernphysik Heidelberg, Weizmann Institut, Rehovot D. Zajfman et al. Direct experimental determination of the molecular structure

7. Tomographic Atom Probe (TAP) Université de ROUEN B. Deconihout et al. Three-dimensional element mapping with a subnanometer spatialresolution. HV pulse Field ion microscope

8. Ion surface collisions Institut für Kernphysik, Frankfurt Horst Schmidt-Böcking, T. Jahnke

9. Key role: The particle detector Potentially hundreds of simultaneously hitting particles can be detected with a 20-30 position resolution and sub-ns time resolution Presently there is no ideal read-out and electronic processing concept being able to fully exploit the MCP specifications.

10. Task A    Multi-pixel detectors A. Dorn, MPIK, Heidelberg Task B    CCD-camera based detectors D. Zajfmann, WIS, Rehovot Task C  Optimization of the delay line technique O. Jagutzki, ROE, Kelkheim Task D    Crossed wire detector H. Rothard, CEA, CIRIL/Caen

11. NewLEIF • - up to 8192 pixels • simultaneous time and amplitude • processing • - semiconductor pixel detector Existing versions 256 (16x16) pixels at most Workpackage 1 Workpackage 2 Workpackage 3 64 pixel MCP detector with parallel TDC and ADC readout CNRS-IPNO, Orsay 256 pixel semi-conductor detector CNRS-LASIM Lyon 8196 pixel detector MPIK Heidelberg Task A: Multi-pixel detectors Independent readout of a large number of anode-pixels +direct approach + good multi-hit capability, (parallel processing) - costly, large number of electronic processing channels

12. Specifications: • 150 ps timing resolution • 2 to 4% energy resolution (analysis of the • pulse hight distribution allows to determine • the number of ions hitting one pixel) • dead time < 20 ns • time range 10 to 2 ms (heavy ions) • read-out rate up to 100 kHz • PCI,USB2 standard CNRS-IPNO, Institut de Physique Nucléaire, Orsay S. DellaNegra R. Selem A detector for mass spectroscopy purposes for processes with high ion yields (many simultaneously hitting ions) 64 pixels, each with TDC and ADC channels • Realization: • Fast charge preamp. on board • Usage of ASICs (TDC) developed • by CERN Excellent time resolution and signal processing rate at relaxed multi-hit capacity and low position resolution

13. Specifications: • ns timing resolution • Position resolution few 100 • Energy resolution sufficient to identify the number • of electrons impinging on one pixel • 16 hits per pixel in a 100 ns time window • Relaxed vacuum requirements compared to MCP CNRS-LASIM, University Lyon Serge Martin et al. surface barrier silicon detector Passivated Implanted Planar Silicon (PIPS) Detector • Detection of electrons accellerated to 20 keV • Signal amplification and serial data transfer • with ASICs • Up to 256 individual elements Canberra Inc. ? Heigh threshold: tens of keV ? Large integration time: microssec. ? Low position resolution Multi-pixel semiconductor detector with moderate position and good time-resolution at potentially high data-processing rates

14. MPIK –Heidelberg pulse shaping preamplifier multiplexer 4x 32 to 1 analog pipeline pixel to vacuum- feedthrough, ADC 1 of 160 cells write read 1 of 128 channels 10 ns 100 MHz sampling of 25 ns wide preamp pulse Up to 8192 pixels individually read-out in time and amplitude by ASICs with 128 channels each. A. Dorn, J. Ullrich Germanium layer induced charge ceramics vacuum separation

15. 1 ns timing resolution • < 0.2 mm position res. (0.8 mm pixel size) • No dead-time for > 3 mm, 20 ns for smaller distances • 5 hits per pixel Beetle chip, developed by MPIK and Kirchhoff institute Heidelberg for LHCb at CERN -> Improved version of the Beetle chip First detector version with 80 mm diameter and 2048 pixels (16 chips) anode. Second version 8192 pixels (64 chips). (CERN LHCb: 450 000 channels) Optimum multi-hit capacity at good signal processing rate and moderate time and position resolution

16. One workpackage: Optimization of the delay-line concept ROE, Roentdek company Task C: Optimization of the delay-line technique +simple concept, low complexity and costs +high data processing rates + good time and position resolution - restricted multi-hit cabability

17. ROE, Roentdek company Ottmar Jagutzki et al. y z x • NewLEIF developements: • improved delay-lines • faster electronics, flash ADCs/faster • multi-hit TDCs Good signal processing rate, good position and time resolution at relaxed multi-hit capacity.

18. timing resolution < 1ns for all events on different positions NewLEIF Timing with segmented anode Workpackage 1 Workpackage 2 Purely CCD based concept WIS, Weizmann Institute Rehovot CCD readout combined with delay-line technique CNRS – GPM Université de Rouen Task B: CCD-camera based multifragment-detectors MCP stack + good position resolution -timing has to be performed separately - noise - slow data readout (frame rate < 100 Hz) Phosphor screen CCD-camera computer

19. WIS –Rehovot A purely CCD based concept Oded Heber, Daniel Zajfmann P1 MCP + Phosphor screen Shutter P2 P1 P2 P1 P1 P2 P2

20. Envisaged specifications: • + timing resolution down to 0.2 ns • + position resolution down to < 0.05 mm • + no dead time for different positions • - no multi hit detection for the same position • - low signal processing rate < 100 1/s close far Example: Letters illuminated by a single ns laser pulse Optimum time-, position and multi-hit capacity at low signal processing rates

21. CNRS – GPM, Université de ROUEN: CCD readout combined with the delay-line technique B. Deconihout et al. Phosphor screen • + timing resolution down to 0.07 ns • + position resolution down to < 0.1 mm • + no dead time for different positions • - low signal processing rate < 100/s Delay-line 2 GHz digitalisation Optimum time-, position and multi-hit capacity at low signal processing rates 2 ns

22. One workpackage Improved crossed wire detector CEA, CIRIL, Caen UBI, University Bielefeld Task D: Crossed wire detector +simple concept + moderate number of signal lines / electronic units +no dead time for different x,y positions - restricted multi-hit cabability

23. CEA, CIRIL UBI, University Bielefeld Improved crossed wire detector H. Rothard, U. Werner et al. Present specifications: timing resolution down to 0.2 ns position resolution 2.5 mm printed circuit board 16x16 „wires“ y • NewLEIF developments: • UHV compatibel anode • improvement of the electronics to • achieve higher count rates 2.5 mm x Cost effective readout scheme with good timing resolution, low position and moderate multi-hit resolution

24. Management Structure

25. Monitoring and reporting progress • Annual progress reports are given by the task managers • Monitoring of delivery of milestones • Evaluation after 18 month • NewLEIF newsletter • Monthly updates of the JRA4 part of the NewLEIF homepage Communication • Two JRA4 meetings will be held per annum as part of a larger • I3 meeting • Progress reports • Working visits • Website as a subsection of the proposed I3 website