Atotech’s Solutions for MLB Production using Advanced Basematerials

1. Atotech’s Solutions for MLB Production using Advanced Basematerials Speaker: Jaime PerazaOrdaz PMM Atotech Europe mobile: +34 606 372 364 email: jaime.peraza@atotech.com Tobias Sponholz Global Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80 Email: tobias.sponholz@atotech.com

2. Agenda Application Guide Vertical Electroless Copper Printoganth PV (E) Direct Plating Neopact Seleo CP Plus Horizontal Electroless Copper Printoganth P Plus 1 3 4 2 Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

3. Application Guide

4. PTH Process Overview Application and Pricing Guide

5. Horizontal Electroless CopperPrintoganth P Plus

6. Printoganth P Plus enables highest flexibility in production mix Printoganth P PlusFeatures & Benefits • Market Introduction in Sept. 2009 • Target Application • Any production with advanced materials where adhesion or blistering is an issue e.g. flex, rigid-flex, PTFE, BT, PI, etc. • HDI and AMSAP technology • Technical Benefits • Extremely good non-blister behavior and coverage performance • Very good reliability • Easily adjustable deposit rate 0.35 – 0.5µm / 4 min • Enhanced bath stability

7. Printoganth P Plus is Atotech’s most capable process for HDI manufacturing Horizontal MLB and HDI ProcessesComparison CN- , JPO

8. Horizontal DesmearUniplate P Sweller Permanganate Etch Reducer • SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing. • Optimal desmear attack on a wide variety of base materials.

9. Horizontal Activation & E’less CuUniplate LB Cleaning Etch Cleaning Pre Dip Neoganth 800 Activator Reducer E’less Copper

10. Economic Activator Neoganth 800Features & Benefits • New Ionic activator system for horizontal application running at only 75ppm Pd • Activator U = 225 ppm • Enables significant savings in running costs by less consumed Pd • Fully compatible to established Atotech conditioning system • easy drop in solution • Perfect coverage on a wide range of relevant base materials • Same excellent reliability results as Activator U • Robust & easy process • Wide working window Activator 800 during Alpha site test

11. Printoganth P series X relative strain Z Non-Blistering PerformanceTheoretical Explanation • Non-blistering performance is related to internal stress within deposited e’less Cu layer • Relevant factors for Cu deposit behavior • Stabilizer type & concentration • Stabilizer Co-deposits (e.g. Ni) • Deposition temperature • Baking after electroless Cu deposition • X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering!

12. Printoganth P PlusApplications FR4 Production Board Flex-Rigid Board • No Blistering due to excellent stress characteristics • Bright deposition color

13. Printoganth P Plus fulfills all reliability requirements for high-end HDI production. ReliabilitySummary • Quick Via Pull test, 3-6 mil – all passed. • Solder Shock Test (6x 288°C, 10s floating) – No ICDs, passed.with THs and BMVs • Solder Shock Test (9x 326°C, 10s), THs & BMVs – few ICDs, ok.with THs and BMVs • IST (+150°C / RT @ 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed. • Various E-tests (daisy chains) – all passed.

14. Printoganth P PlusCustomer References

15. Vertical Electroless CopperPrintoganth PV (E)

16. Process SequenceActivation & E‘less Cu Desmear Cleaning Etch Cleaning Pre Dip Neoganth V8 (60 ppm) 50 Activator Reducer E’less Copper

17. Activation Series Neoganth LS PlusFeatures & Benefits • Ionic Activator for vertical application • Optimal coverage at low running cost (75ppm Pd) • Fine & homogeneous distribution of Pd particles • No tooling hole issues • Not corrosive • Improved robustness, no precipitations during manual replenishment • Easy handling, no premixing • 100% compatible to established conditioning concept Pre Dip Activator Reducer

18. Activator Neoganth V8 – full power ionic activation at low cost Economic Activator EXPT Neoganth V8Features & Benefits • New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd • Enables significant savings in running costs by less consumed Pd • Modified complexing agents • Ensures good coverage despite low palladium content • ‘Locking’ copper ions in a stable complex enhances bath lifetime • Less alkaline • Improved bath stability by reduced carbonate formation • Perfect coverage on a wide range of relevant base materials • Fully compatible to established Atotech conditioning system • Easy drop in solution • Robust & easy process • No additional NaOH dosing required by optimized replenishment concept • Wide working window

19. Printoganth PV vs PV EComparison … Cleaning Etch Cleaning Pre Dip • Identical stabilizer system • Same bath performance • Different Cu source (CuSO4, CuCl) to be more flexible in supply chain • PV E potentially more cost-effective due to higher concentrated Cu additive Activator Reducer E’less Copper

20. Printoganth PV (E)Features and Benefits • Versatile vertical e’less Cu process for advanced MLB/HDI applications • Superior adhesion on most materials including PI, PTFE, BT... due to optimal internal stress characteristics of the copper deposit: • No blistering • No pull away • Highly reliable process • Fulfills all standard reliability requirements such as SST, IST, TCT • No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as 9x 326ºC • Low to high build deposit possible • Deposition speed 0.3 - 0.6µm in 10 min • Environmentally friendly • Tartrate based • Cyanide free

21. Printoganth PV ECoverage in Through Holes Pos.1 Pos.6 Pos.7 Pos.2 Pos.3 Pos.8 Pos.4 Pos.9 Pos.10 Pos.5

22. Excellent BMV coverage despite strong glass fiber protrusion! Printoganth PV ECoverage in Blind Micro Via SEM picture

23. Printoganth PV ECoverage standard pth process without 902 Flex Cleaner or Reduction Conditioner

24. Outstanding adhesion with Printoganth PV E ! Printoganth PV ESurface Adhesion Excellent adhesion on exposed polyimide

25. Printoganth PV EProduction Example – Exotic Materials • Korean Customer for military application Final Product Fe oxide powder EPDM Rubber

26. Printoganth PV E fulfills highest reliability requirements Printoganth PV ESolder Shock Results Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)

27. Printoganth PV ESolder Shock Results • 6x IR reflow + 1x solder shock • no pull away • no ICD customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC) • Solder shock tests Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)

28. Printoganth PV E and PVReferences Printoganth PV Printoganth PV E status 2012-10

29. Printoganth PV (E) vertical e’less Cu process for MLB/HDI applications outstanding non-blistering performanceon any kind of base materials highly reliable Optimal performance in conjunction with Securiganth BLG desmear Neoganth LS Plus activation Outlook Neoganth V8 Activator for lower running cost Printoganth PV (E)Summary Deposit structure of Printoganth PV E Plated BMV with Printoganth PV E