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This document outlines the insulation requirements, concerns, recommendations, and build details for NCSX modular coil insulation, focusing on dielectric standoff, mechanical support, heat transfer, and epoxy flow during VPI. It addresses concerns such as insulation thickness, additional layers, glass insulation, and durability during assembly. Recommendations include increasing layers of turn insulation, adding glass insulation, and mold construction details for VPI.
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NCSX Modular Coil Insulation Concerns NCSX Project Meeting December 18, 2002 J. H. Chrzanowski
NCSX-Modular Coil Insulation • Insulation Requirements • Provide dielectric standoff for operating voltages (3 kV to ground) • Provide mechanical support- holds the turns together • Allow heat transfer between turns and chill plates • Provide a pathway for epoxy flow during VPI of conductor bundle
NCSX-Modular Coil Insulation • Concerns • Nominal insulation thickness to light • Additional glass needed to improve VPI • Additional dielectric standoff- higher test voltages • Durability of outer ground wall during assembly • Maintenance concerns
NCSX-Modular Coil Insulation • Recommendations • Increase the number of layers of turn insulation • Add additional glass insulation to improve VPI • Allow outer mold to remain following VPI process
NCSX-Modular Coil Insulation • Insulation Build • Original Insulation scheme • (1) butt lapped layer glass tape (0.008 in. thick tape) • (1) ½ lapped layers • Kapton (0.003 in. thick) • Glass insulation (0.008 in. thick ) Original turn insulation 0.022 in. 0.030 in. 0.008 in. • Proposed Insulation scheme • (1) ½ lapped layer glass tape • (0.007 in. thick tape) • (2) ½ lapped layers • Kapton (0.003 in. thick) • Glass insulation (0.007 in. thick ) Proposed turn insulation 0.040 in. 0.054 in. 0.014 in.
0.608” 0.007” thick 0.054” 0.733” NCSX-Modular Coil Insulation • Conductor Envelope Original Proposed
NCSX-Modular Coil Insulation • VPI Mold-Construction • Silicone rubber insulation & covers • 2-part RTV overcoat • Epoxy Impregnated Felt • Mold • Provides additional dielectric standoff • Provides buffer during assembly operation