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NCSX Modular Coil Insulation Concerns

NCSX Modular Coil Insulation Concerns. NCSX Project Meeting December 18, 2002 J. H. Chrzanowski. NCSX -Modular Coil Insulation. Insulation Requirements Provide dielectric standoff for operating voltages (3 kV to ground) Provide mechanical support- holds the turns together

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NCSX Modular Coil Insulation Concerns

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  1. NCSX Modular Coil Insulation Concerns NCSX Project Meeting December 18, 2002 J. H. Chrzanowski

  2. NCSX-Modular Coil Insulation • Insulation Requirements • Provide dielectric standoff for operating voltages (3 kV to ground) • Provide mechanical support- holds the turns together • Allow heat transfer between turns and chill plates • Provide a pathway for epoxy flow during VPI of conductor bundle

  3. NCSX-Modular Coil Insulation • Concerns • Nominal insulation thickness to light • Additional glass needed to improve VPI • Additional dielectric standoff- higher test voltages • Durability of outer ground wall during assembly • Maintenance concerns

  4. NCSX-Modular Coil Insulation • Recommendations • Increase the number of layers of turn insulation • Add additional glass insulation to improve VPI • Allow outer mold to remain following VPI process

  5. NCSX-Modular Coil Insulation • Insulation Build • Original Insulation scheme • (1) butt lapped layer glass tape (0.008 in. thick tape) • (1) ½ lapped layers • Kapton (0.003 in. thick) • Glass insulation (0.008 in. thick ) Original turn insulation 0.022 in. 0.030 in. 0.008 in. • Proposed Insulation scheme • (1) ½ lapped layer glass tape • (0.007 in. thick tape) • (2) ½ lapped layers • Kapton (0.003 in. thick) • Glass insulation (0.007 in. thick ) Proposed turn insulation 0.040 in. 0.054 in. 0.014 in.

  6. 0.608” 0.007” thick 0.054” 0.733” NCSX-Modular Coil Insulation • Conductor Envelope Original Proposed

  7. NCSX-Modular Coil Insulation • VPI Mold-Construction • Silicone rubber insulation & covers • 2-part RTV overcoat • Epoxy Impregnated Felt • Mold • Provides additional dielectric standoff • Provides buffer during assembly operation

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