High-Quality, Low-Cost IC Fabrication with MOSIS

1. High-Quality, Low-Cost IC Fabrication with MOSIS

2. What is MOSIS ? • An organization dedicated to offering: • High-quality access to the latest production-provensemiconductor technologies. • Low-cost engineering samples of IC designs. • Small-volume production services. • Single-point of interface for additional services or products offered by partners. • Support for questions on design rules, SPICE models and design kits.

3. What does MOSIS do? • Multi-Project Wafer (MPW) Runs. • Dedicated (DED) Runs. • 1/3 of the 100+ runs per year are Dedicated Runs. • Taxi-Runs (for IBM only). • Mid-way between a DED and a MPW run.

4. How does MOSIS do MPWs?

5. Who Uses the MOSIS Service? • Companies with pilot-projects that require engineering samples for proof-of-concept. • Organizations with small-volume production. • Industrial firms. • Governmental agencies. • Academic institutions.

6. MOSIS – Chronology • Phase I : 1981-1985 • DARPA direct funded era: 100% DARPA. • Phase II : 1985-1994 • Multi-agency direct funding • DARPA : ~80% +DoD, NSF : ~15% (1985). • Commercial customers: ~5% (1985). • Phase III : 1994-present • Self-sustaining operations. • Commercial customers provide 100% of income.

7. Why Customers Come to MOSIS? • Quality and low cost + fast turn-around time. • Access to leading technologies. • Multiple processes - multiproject, dedicated runs. • Die size, quantity flexibility. • Examples: 2 x 2, 3 x 6, 7 x 6 mm; 40, 500, 2000 parts (die and/or packaged). • Design rules, spice parameters. • Technology files, design kits. • Includes standard cells, pads, others.

8. MOSIS Capabilities (1/2) • Organizes Multiproject, Dedicated, and Taxi runs. • Gathers designs, handles purchase orders, etc. • Supports users. • Performs design-kit distribution. • Handles questions. • Design rules, modeling, etc. • Mpw runs include functional reference designs. • Works closely with design service providers.

9. MOSIS Capabilities (2/2) • Orders masks, wafers. • Fully-checked, -merged reticle compatible with production fabrication process. • Performs packaging/test. • Plastic, ceramic, flip-chip, etc. • Functional testingavailable. • Allows for die size, quantity flexibility. • Die cut into desired size, provides larger quantities (e.g. 500, 2000) within runs (for MPW, Dedicated and Taxi).

10. AMIS Processes

11. AMS Processes

12. IBM CMOS Processes

13. IBM SiGe Processes

14. TSMC Processes

15. MEP-Research Requires a proposal by the PI + Dean’s letter. Processes available: AMIS ABN and AMIS C5F/N. IBM BiCMOS SiGe (7WL) and CMOS (8RF-LM/8RF-DM, 7RF) processes TSMC 0.35 and 0.25 mmCMOS processes. MOSIS Education Program • MEP-Instructional • Enrollment forms to MOSIS at the beginning of each semester or quarter. • Processes available: • AMIS ABN, and • AMIS C5F/N. • Reporting requirements (INS vs RES) • Academic NDA every year.

16. MOSIS Web Site

17. MOSIS Web Forms For Project Submission, Tracking, etc. Secure or Non-secure

18. Summary • High-quality, low-cost, fast prototyping. • Regularly scheduled prototype runs + dedicated runs based on customer’s schedule needs. • Low volume production. • Access to latest production technologies. • Access to important 3rd-party resources for design tools and packaging. • Reference designs on MPW runs. • Acting as the interface, MOSIS greatly increases chances for first-pass success.

19. Contact Information • César Pina — Director. — cpina@mosis.com, tel. +1 310 448-9400 • Wes Hansford — Deputy-Director. — hansford@mosis.com, tel. +1 310 448-9199 • Customer Support Line. — support@mosis.com, tel. +1 310 448-9400 • Hudson J. Mota de Alcântara — Customer Support — hjma@mosis.com, tel +1 310 448-8351. MOSIS Fax: (310) 823-5624