1 / 18

RoHS Compliant & Green Components

RoHS Compliant & Green Components. Content. Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction

suchin
Download Presentation

RoHS Compliant & Green Components

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. RoHS Compliant &Green Components

  2. Content • Environmentally Friendly Materials Drivers • Legislation • AMIS RoHS & Green Component Definition • Hazardous Substances in Current Components • Re-Flow Profile for Moisture Sensitivity Assessment • Impact Pb-Free Solder on Package Construction • AMIS Changes in Bill of Assembly Materials • Qualification Stress Test Conditions • Product Marking and Labeling • AMIS RoHS-Green Qualification Status

  3. Environmentally Friendly Materials Drivers • RoHS Directive 2002/95/EC Effective July, 2006 • Lead Pb < 1000 ppm • Mercury Hg < 1000 ppm • Cadmium Cd < 100 ppm • Hexavalent Chromium Cr+6 < 1000 ppm • Polybrominated Biphenyl PBB < 1000 ppm • Polybrominated Diphenyl Ether PBDE < 1000 ppm • Market Pressure • Japanese Consumers Demand Green Components • New Designs for Consumer Products are all Green • High Temperature Applications • Solders Required for Harsh Environments • Automotive • Avionics • High Ambient Temperature Applications for well Defined Duration

  4. Worldwide Legislation RoHS(Restriction of Hazardous Substances) Pb, Hg, Cd, Cr+6 PBB & PBDE JGPSSI (Japan Green Procurement Survey Standard Initiative) Pb, Hg, Cd, Cr+6 PBB, PBDE, TBBP-A-bis Chlorinated Organic Compound PCB, PCN, CP, Mirex Organic Sn Compound Asbestos Azo Formaldehyde PVC & PVC Blends Situation of Banned Substances in the World • Different Definitions & Thresholds arebeing Debated in EU, Japan & US • Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear

  5. Japanese Legislation • Japanese • The Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001 • This Suggests but does not Include Lead Phase-out Timetable • OEM's are Removing Lead from Electronics Mainly due to Market Pressures • The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEM’s

  6. EU Legislation Applicable for: Large Household Appliances Small Household Appliances IT & Telecom Equipment Consumer Equipment Lighting Equipment Electrical & Electronic Tools Toys, Leisure & Sports Equipment Medical Equipment Systems Monitoring & Control Instruments Automatic Dispensers Who is Exempt: Medical Implanted &Injected Products Pb in Servers, Storage & Storage Systems until 2010 Large Stationary Industrial Tools Pb in High-End Manufacturing & Telecommunications Products Automotive, Aerospace, Military • Directive 2002/95/EC (RoHS) • Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will havesome Regard to Hazardous Materials in Equipment

  7. United States Legislation • United States • Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position • In September 2003 California Enacted an E-Waste Recycling Bill • The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry

  8. AMIS RoHS & Green Definition • RoHS Compliant = AMIS Pb-Free • Pb < 1000 ppm • Hg < 1000 ppm • Cd < 100 ppm • Cr+6 < 1000 ppm • Polybrominated Biphenyl < 1000 ppm • Polybrominated Diphenyl Ether < 1000 ppm • Full Green = AMIS Green • All of the Above Requirements Plus • Bromine < 900 ppm • Chlorine < 900 ppm • Antimony < 900 ppm • Tributyltin Oxide Not Used • Phosphorus Not Used

  9. Hazardous Substances inCurrent Compounds DIE DIE DIE Laminated Package Leaded Package • Pb as Solder Plated Leads or Balls of Packages • Pb Content Solder Plated Leads: 0.1 – 0.3% by Weight • Pb Content Solder Balls of BGA Packages: 4.9% by Weight • Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound • Bromide Content: 0.2 – 1.8% by Weight • Antimony Content: 0.3 – 0.7% by Weight Solder Balls Solder Lead Finish

  10. Re-Flow Profile for Moisture Sensitivity Assessment IPC/JEDEC J-STD-020B AMIS Sn-Pb Eutectic Assembly Pb-Free Assembly Sn-Pb Eutectic Assembly Pb-Free Assembly Profile Feature Large Body Small Body Large Body Small Body Large Body Small Body Large Body Small Body Average ramp-up rate(TL to Tp) 3ºC/second Max. 3ºC/second Max. 3ºC/second Max. 3ºC/second Max. 100ºC150ºC60-120 Seconds 150ºC200ºC60-180 Seconds 100ºC150ºC60-120 Seconds 150ºC200ºC60-120 Seconds Preheat • Temperature Min. (Tsmin) • Temperature Max. (Tsmax) • Time (Min. to Max.)(ts) Tsmax to TL 3ºC/second Max. 1-2ºC/second Max. 1.5-2.5ºC/second Max. • Ramp-up Rate • Time Maintained Above: • Temperature (TL) • Time (tL) 183ºC60-150 Seconds 217ºC60-150 Seconds 183ºC60-150 Seconds 217ºC60-150 Seconds 225 +0/-5ºC 240 +0/-5ºC 245 +0/-5ºC 250 +0/-5ºC 225 +0/-5ºC 240 +0/-5ºC 260 +0/-5ºC 260 +0/-5ºC Peak Temperature (Tp) Time Within 5ºC of Actual Peak Temp. (tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds Ramp-down Rate 6ºC/second Max. 6ºC/second Max. 6ºC/second Max. 6ºC/second Max. Time 25ºC to Peak Temp. 6 Minutes Max. 8 Minutes Max. 6 Minutes Max. 8 Minutes Max. AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

  11. Re-Flow Profile for Moisture Sensitivity Assessment AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

  12. Impact Pb-Free Solder onPackage Construction Laminated Package Leaded Package DIE DIE DIE Solder Lead Finish Solder Balls • Exposure to Higher Solder Temperatures • The Impact from 220 to 240 or260°C Solder Temperatures • Solderability • The Interaction Between the Pb-free Component Finish & Solder Paste • Interface Adhesion Between Materials • The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature • Thermal Stability in Compound/Die Attach/Substrate • Electrical Contact Resistance

  13. Changes in Bill of Assembly Materials • Lead Frame Packages = AMIS goes Green • New Materials for Die Attach & Mold • Materials that Withstand 260°C • Halogen Free Materials • Lead Finish • Pure Sn Plating is Selected as Solution • Pure Sn is the most Mainstream Solution • Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process • NiPdAu is available as an alterative finish option

  14. Changes in Bill of Assembly Materials • Laminate Packages = AMIS goes RoHS Compliant • Existing Substrates are RoHS Compliant & Qualified • Green Substrates are Available but more Expensive & not yet Qualified • New Materials for Die Attach & Mold • Materials that Withstand 260°C • Halogen Free Materials • Lead Finish • Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)

  15. Qualified Stress Test Conditions AEC – Q100 REV-F AMIS Part OperatingTemperature Grades Grade 0 (- 40 / 150°C) Grade 1 (- 40 / 125°C) Grade 2 (- 40 / 105°C) Grade 0 (- 40 / 150°C) Grade 1 (- 40 / 125°C) Per J-STD-020 Minimum Level 2260ºC max. Re-Flow Temperature Preconditioning Per J-STD-020 for SMD components HAST 130°C / 85% / Bias – 96 hrsFor Product Qualifications THB or HAST 85°C / 85% / Bias – 1000 hrs Autoclave or unbiased HAST 121°C / 100% – 96 hrsFor Package Qualifications 121°C / 100% – 96 hrs HAST 130°C / 85% – 96 hrs - 65/175°C, 500x - 65/175°C, 1000x - 65/150°C, 500x - 65/150°C, 1000x Temp Cycle - 65/175°C, 500x - 50/175°C, 1000x - 50/150°C, 2000x - 65/150°C, 500x - 50/150°C, 1000x - 50/150°C, 500x - 50/125°C, 1000x - 40/150°C, 1000x - 40/125°C, 1000x - 40/105°C, 1000x - 40/150°C, 1000x - 40/125°C, 1000x Power Temp Cycle 175°C, 1000 hrs 175°C, 2000 hrs 150°C, 1000 hrs 150°C, 2000 hrs High Temp Storage Life (plastic pkg) 175°C, 1000 hrs 150°C, 2000 hrs 150°C, 1000 hrs 175°C, 500 hrs 125°C, 1000 hrs 150°C, 500 hrs

  16. AMIS RoHS-GreenQualification Status

  17. Product Marking & Labeling • In Alignment with JESD97 • Components Contain Pb-Free Category Code • Labels Contain • Pb Free Category Code • Safe Maximum Temperature • Moisture Sensitivity Level

  18. AMIS RoHS-Green Project Status • The Majority of the Packages Offered by AMIS are Green or RoHS Qualified • AMIS will Continue to Provide Non-RoHS & Non-Green Products unless Requested Differently • Green & RoHS Compliant Product is Available Upon Request • Contact AMIS Sales for more Information • AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production

More Related