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Non-Arc Welding Processes

Introduction. Non-Arc Welding Processes. Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials Resistance welding Oxy-Fuel Welding Friction welding (&Solid State) Laser and electron beam welding

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Non-Arc Welding Processes

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  1. Introduction Non-Arc Welding Processes • Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials • Resistance welding • Oxy-Fuel Welding • Friction welding (&Solid State) • Laser and electron beam welding • Brazing and soldering • Plastics joining • Adhesive bonding

  2. Adhesives • Thermosets form long polymer chains by chemical reaction (curing) • Heat is the most common means of curing • Ultraviolet light, oxygen - acrylics • Moisture - cyanoacrylates • Thermoplastics (hotmelts) • Adhesive is heated until it softens, then hardens on cooling -Polyethylene, PVC 0.1.1.2.6.T26.95.12

  3. Adhesive Bonding Curing of Adhesives • Thermosets form long polymer chains by chemical reaction (curing) • Heat (epoxy) • Ultraviolet light, oxygen (acrylics) • Moisture (superglue)

  4. Stress Modes - Best to Worst 1. Compression 2. Shear 3. Tension 5. Cleavage 4. Peel 0.1.1.2.6.T29.95.12

  5. Adhesive Bonding Why Adhesive Bonding? • Dissimilar materials • Plastic to metal • Materials that can be damaged by mechanical attachments • Shock absorption or mechanical dampening • Laminate structures • Skin to honeycomb structure

  6. Adhesive Bonding Adhesive Selection • Adhesive selection is based primarily on • Type of substrate • Strength requirements, type of loading, impact requirements • Temperature resistance, if required • Epoxy • Cyanoacrylates • Anaerobics - metals • Urethanes • Silicones • Pressure sensitive adhesives (PSAs)

  7. Advantages • Joining dissimilar materials - plastic to metal • Materials that can be damaged by mechanical attachments • Blind joints • Shock absorption or mechanical dampening • Temporary alignment • Laminated structures • Thin substrates - skin-to-honeycomb construction • Stress distribution 0.1.1.2.6.T27.95.12

  8. Adhesive Bonding Limitations • Adhesives don’t do work, they distribute work; they are not structural materials • Environmental degradation • Temperature • Oxidation • Difficult to repair • Curing or setting time • Surface preparation

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