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MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green. Jeffrey Logsdon John Ly Daniel Henderson Nataly Sumarriva. Project Objectives. Develop team-oriented skills Interpret printed circuit board layout Make ultra-fine solder connections Compile programs and files to run software

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MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

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  1. MSP430 Group ProjectECE 300Spring 2007Dr. Walter Green Jeffrey Logsdon John Ly Daniel Henderson Nataly Sumarriva

  2. Project Objectives • Develop team-oriented skills • Interpret printed circuit board layout • Make ultra-fine solder connections • Compile programs and files to run software • Be introduced to C-Spy debugging tool of IAR Software • Flash software to microprocessor board • Select and learn the characteristics of sensors • Troubleshoot a circuit board

  3. Overview of Project Stages • Stage 1 • Soldering practice and familiarity with the circuit components on the practice circuit boards • Stage 2 • Soldering circuit components and microchip to board • Stage 3 • Flashing “Hello” message to LCD screen by programming MSP430 chip • Stage 4 • Selecting and studying various sensors • Stage 5 • Adjusting computer codes to show sensor output on LCD screen • Stage 6 • Demonstration of sensor and data collection • Stage 7 • Project team presentation

  4. Stage 1 - Practice • After years of no soldering, the team members obtained practice soldering components onto the practice circuit board • Each team member soldered one side of the microchip to the circuit board, a task which was tedious but useful

  5. Stage 2 – The Real Deal • The microchip and the circuit components were soldered in the following order: • Surface-mounted capacitors and resistors • Push-button switch, voltage regulator, 5 volt input plus, slider switch • MSP430 microchip • LCD pins • JTAG Connector

  6. Stage 3 – Flashing “Hello” • The files lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c. were downloaded from the class website • New project was created under IAR Embedded Workbench • Flashed “Hello” and “88880888” by adjusting code in the demo file

  7. Stage 4 – Sensors, Sensors, Everywhere • Various sensors were investigated from Analog Devices • AD 590 – Temperature Sensor • AD 22103 – Temperature Sensor • TMP04F5 – Temperature Sensor • AD 22151G – Magnetic Field Strength Sensor • Ultimately, the AD 590 and AD 22103 were selected to allow for most efficient temperature output, considering the necessary components and the accuracy of the sensor

  8. Spotlight on…the AD22103K • Features • 3.3 voltage input from circuit board itself • 0 to 100º C temperature span • Minimal self-heating • Cost-effective: uses the same voltage that the analog-to-digital converter uses as a reference, eliminating the need for a precision reference • Requires no calibration • Less expensive than the AD590 and no need for extra reference or calibration components • By using voltage output instead of current output, there is a minimization of leakage errors, such as those caused by condensation at low temperatures

  9. AD22103K’s Theory of Operation • Output voltage is proportional to power supply voltage • Sensor contains temperature-dependent resistor, RT, whose resistance changes linearly with temperature • Op amp in sensor takes the voltage across RT and applies appropriate gain and offset to achieve the output voltage function • At the nominal supply voltage of 3.3 V, the output voltage is 0.25 V at 0º C and 3.05 V at 100º C

  10. Connecting the AD22103K to Circuit Board • Pin 1 - Voltage Input • Connection to voltage output terminal on circuit board • Pin 2 - Voltage Output • Connection to input terminal on board • Pin 3 - Ground

  11. Spotlight on…the AD590JH • Features • Produces output current proportional to temperature: 1 microAmp per Kelvin • -55º C to 150º C temperature range • Wide power supply range: 4V to 30V • Electrically durable – withstands a voltage as high as 44V and a reverse voltage of 20V, so pin reversal does not damage sensor • High output impedance (over 10MOhms) allows for minimum changes in output current despite large changes in input voltage • Low cost

  12. Stage 5 – Sensor Ouput • Previously-made codes were obtained from class file • These new files were integrated into the circuit board with the IAR Embedded Workbench and the C-Spy Debugger • Many trials were needed to obtain the correct sensor output

  13. Stage 6 – Demonstration and Data Completed Circuit Board

  14. Stage 6 – Demonstration and Data Our breadboard with sensors Their breadboard with sensors

  15. Stage 6 – Demonstration and Data • Data of Temperature Rising 75 to 90º F • Theoretically, the time and temperature relationship should be linear and equal for both sensors. Since the AD22103 reaches 90 degrees faster, this may indicate either less accuracy or greater efficiency of the sensor. Thus, the 590JH may be a more accurate yet less efficient sensor • Less efficiency at the temperature extremes

  16. Stage 6 – Demonstration and Data • Data of temperature falling from 90 to 75º C • For decreasing temperature, the 590JH sensor demonstrates a more linear relationship between time and temperature, again demonstrating the slightly finer quality than the 22103K

  17. Stage 7 – The Fruits of Hard Work • A Happy Dr. Green

  18. Stage 7 – The Fruits of Hard Work • An Enlightened Group of Students

  19. Stage 7 – The Fruits of Hard Work • Reduced risk of future injury from circuit boards and electrical devices

  20. Conclusion • This project allowed the team members to learn to work together, to become familiar with basic circuit board design, and to combine various aspects of previous engineering education to output a real product

  21. Thank you Are there any questions?

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