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X-ray summary of 1 module and 6 SC: Assy are identified by their sensor PDB number, electronics all coming from wafer SXB0LT. Assy always observed through the FEI (i.e. FEI on top of the assy) 20210120310702 (module, see drawing for FEI numbers) 20210110142304 + 0608B (9 columns)
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X-ray summary of 1 module and 6 SC: Assy are identified by their sensor PDB number, electronics all coming from wafer SXB0LT. Assy always observed through the FEI (i.e. FEI on top of the assy) 20210120310702 (module, see drawing for FEI numbers) 20210110142304 + 0608B (9 columns) 20210110142305 + 0712B (9 columns) 20210110142306 + 0711B (9 columns) 20210110142307 + 0708B (9 columns) 20210110142308 + 0707B (9 columns) 20210110142309 + 0706B (9 columns) Summary: bumping/flipping good and uniform, minor defects spotted. Chip cutting still quite bad. P. Netchaeva, L.Rossi, F. Vernocchi 8/5/02
If not specified= 9 good columns 0606A 0506A 0106A 0105A 0712A 0711A 0911A 0708A HV pad 0707A 0706A 1104A 1003A 0902A 0612B 8 columns 0411B 8 columns 0702B 8 columns We look through the backside of the FEI
Some shorts possible 5 missing Bumps (FEI Chipped) X-ray view Maybe few shorts
Microscope view of FEI cutting edges, quite some chipping and unequal cutting sizes. In on sensor?