Advancing Giga-Scale System-On-A-Chip Solutions

1. Giga-Scale System-On-A-ChipInternational Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email: cong@cs.ucla.edu (Other participants are listed inside)

2. Background: “Double Exponential” Growth of Design Complexity • C1: complexity due to exponential increase of chip capacity • More devices • More power • Heterogeneous integration, …… • C2: complexity due to exponential decrease of feature size • Interconnect delay • Coupling noise • EMI, …… • Design Complexity  C1 x C2

3. Motivation: Productivity Gap 10,000,000 100,000,000 1,000,000 10,000,000 58%/Yr. Complexity growth rate 100,000 1,000,000 Logic Transistors/Chip (K) Transistor/Staff-Month 10,000 100,000 1,000 10,000 21%/Yr. Productivity growth rate x x 100 1,000 x x x x x x 10 100 1 10 1998 2003 Chip Capacity and Designer Productivity Source: NTRS’97

4. Project Summary • Develop new design methodology to enable efficient giga-scale integration for system-on-a-chip (SOC) designs • Project includes three major components • SOC synthesis tools and methodologies • SOC verification, test, and diagnosis • SOC design driver – network processor

5. Current Research Team • US • UCLA: Jason Cong • UC Santa Barbara: Tim Cheng • Taiwan • NTHU: Shi-Yu Huang, Tingting Hwang, J. K. Lee, Youn-Long Lin, C. L. Liu, Cheng-Wen Wu, Allen Wu • NCTU: Jing-Yang Jou • China • Tsinghua Univ.: Jinian Bian, Xianlong Hong, Zeyi Wang, Hongxi Xue • Peking Univ.: Xu Cheng • Zhejiang Univ.: Xiaolang Yan • Several new faculty members in the 7 institutions • Guest members from National University of Singapore, Purdue Univ., UCLA (EE Dept), and UT Austin

6. Thrust 1 -- SOC Synthesis Environment/Methodology(Led by Jason Cong) Design Spec VHDL/C VHDL/C Co-Simulation Design Partitioning ASIC Synthesis Interconnect-Driven High-level Synthesis Code Generation for Retargetable Compiler and Assembler Generator DSP Synthesis and Optimization FPGA Synthesis and Technology Mapping Synthesis for IP Reuse Physical Synthesis for Full-Chip Assembly DSPs Embedded FPGAs Customized Logic Embedded Processors

7. Highlights of Accomplishments • Novel microarchitecture and system methodology for multi-cycle on-chip communication • ISPD’03, ICCAD’03, DAC’04, T-CAD • Optimality study of large-scale circuit placement • ASPDAC’03, ISPD’03, ICCAD’03, T-CAD • Floorplanning with interconnect planning • About 30 papers published in DAC, ICCAD, ISPD, ASPDAC, ISCAS and Transactions • P/G Network Analysis & Optimization • ICCAD’01, T-CAD, ASPDAC’04 • Parasitic R/L/C extraction • ASPDAC, ASICON and IEEE Transaction on MTT

8. Thrust 2 -- SOC Verification, Test, and Diagnosis(Led by Tim Cheng) Verification and Testing Enabling techniques for semi-formal functional verification Testing and diagnosis for heterogeneous SOC Self-testing using on-chip programmable components Self-testing for on-chip analog/mixed-signal components Automatic/semi-automatic functional vector generation from HDL code Scalable constraint-solving techniques Integrated framework for simulation, vector generation and model checking New test techniques for deep-submicron embedded memories

9. Highlight of Accomplishments • Developed and released ATPG-based SAT solvers for circuits • DATE2003, DAC2003, ICCAD2003, HLDVT2003 and ASPDAC2004 • A new Statistical Delay Testing and Diagnosis framework consisting of five major components • DAC’02, ICCAD’02, DATE’03, DAC’03 • On-Chip Jitter Extraction for Bit-Error-Rate (BER) Testing of Multi-GHz Signal • ASPDAC2004 and DATE2004

10. Thrust 3 – Design Driver: Network Security Processor (Led by Prof. C. W. Wu & Xu Cheng) • Applications: IPSec, SSL, VPN, etc. • Functionalities: • Public key: RSA, ECC • Secret key: AES • Hashing (Message authentication): HMAC (SHA-1/MD5) • Truly random number generator (FIPS 140-1,140-2 compliant) • Target technology: 0.18m or below • Clock rate: 200MHz or higher (internal) • 32-bit data and instruction word • 10Gbps (OC192) • Power: 1 to 10mW/MHz at 3V (LP to HP) • Die size: 50mm2 • On-chip bus: AMBA (Advanced Microcontroller Bus Architecture)

11. Highlights of Accomplishments • Security processor – encryption module • Secret key encryption module • Operations: • Matrix operations, manipulation • AES cryptography • 32-bit external interface • 58K gates • Over 200MHz clock • Throughput: 2Gbps • Support key length of 128/192/256 bits • Microprocessor -- Unity Processor • Used in over 7,000 NetPCs

12. International Collaborations • Joint NSF/NSC workshop in Aug. 1999 on SOC (Hsin-Chu, Taiwan) • 1st team preparation meeting for the proposed center in Jan. 2000 (Yokohama, Japan) • 2nd planning meeting held in April 2000 (Hawaii, US) • 3rd planning meeting in Aug. 2000 (Chengde, China) • Proposal submitted to NSF in Aug. 2000 and funded in Dec. 2000 • Workshops • March 30-31, 2001 in Taipei, Taiwan. • June 23-24, 2001 in Los Angeles, USA • August 31-September 1, 2001 in HangZhou, China • March 28-29, 2002, National Tsing Hua University, Hsinchu, Taiwan • August 20-21, 2002, Peking University, Beijing, China • November 15-16, 2002, University of California, Santa Barbara • March 27-29, 2003, National Taiwan University, Taipei, Taiwan • December 19-21, 2003, Yunnan University, Kunming, China

13. Publications • 220 research publications up to this point • 67 in top conferences/journals in the field (DAC, ICCAD, DATE, ASPDAC, ITC, FPGA, ISLEPD, T-CAD, TODAES, etc.)

14. People & Education • Many interactions among participants from different institutes • Two new IEEE fellows: • Prof. Xiaolang Hong, Tsinghua Univ. • Prof. Cheng-Wen Wu, National Tsing Hua Univ. • Involved many young faculty members and researchers • Trained an army of graduate students

15. Complexity Management for Future Micro and Nano Systems • Higher level of abstraction (without losing physical reality) • Reliability and reconfigurability • Fundamental algorithms for future design automation tools of micro and nano systems • Education

16. Participants • US • UCLA and UCSB • Taiwan • National Tsing Hua Univ. • National Taiwan Univ. ?? • China • Tsinghua Univ. • ?? • Japan ??