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Fides and RAMS training Km3Net

Fides and RAMS training Km3Net. S.Colonges APC Quality division. Agenda. Fides training Functional / product level – infrastructure definition Tools HALT/HASS Conclusion. Fides training. -May 2 to 5, 2017 -APC – Paris

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Fides and RAMS training Km3Net

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  1. Fides and RAMS trainingKm3Net S.Colonges APC Quality division

  2. Agenda • Fides training • Functional / product level – infrastructure definition • Tools • HALT/HASS • Conclusion

  3. Fides training -May 2 to 5, 2017 -APC – Paris Participants on the workshop (Stephane, Pietro, David, Diego, Luigi, Giuliano, remotely Fabio and Riccardo – also Pietro the last day) Main idea: Stephane support / help designers to perform the FIDES analysis and FMECA. But: in order to be useful designers should be actors! Prepare production, tests and ESS procedures

  4. Fides training Configuration management: Item Data List is mandatory for success (Very important item for KM3NeT) Reference for all the documents. (Also important for KM3NeT) Especial file for Data List -> for each group -Define asap same deliverable for each product -Use same templates for documents

  5. Example of deliverables proposal Product specifications CIDL (Configuration item data list) User manual Technical report Design files ICD: Interface Control Document Manufacturing Test benches Test Reports Records and logbook (Assembly reports) Reliability analysis If available: Public tenders, purchase order, Certificate Of Conformity, Video meeting to continue with the FIDES analysis. Lead free or led -> To be check

  6. Fides training • -Fides presentation (Refers to KM3NET FMECA_reliabilitytraining_2to5may2017 – google doc) • -RAMS tool presentation (developped @APC) and FIDES tool • -Functional analysis: • -Definition of products level • -DOM functional analysis • Goal : describe functions and quantity of each item (the risk is strongly dependant to item quantity) • Practical analysis: • - Compass V1 and V2 analysis (to be completed) – FIT and FMECA • -FMC V2 analysis (FIT and FMECA) • -DOM • -HALT / HASS procedure

  7. Functional analysis Definition Architecture for Functional Analysis: Name - (Example) Level 1: Infrastructure – (KM3NeT) Level 2: Structure - (ARCA-ORCA) Level 3: Equipment – (Link – Onshore- offshore) Level 4: System (offshore: Building block – link: General JB) Level 5: Subsystem (Secondary JB – DU) Level 6: Module (BOB – DOM – DU Base) Level 7: Assembly (Boards: PB, CLB, etc) Level 8: Subassembly (functions – PB rails, etc)

  8. Objectives Our Goal? Reach the highest reliability and safety possible level. Define maintenance and recovery plan Activities name (work package): RAMS: Reliability Availability Maintainability and Safety How? Performing a reliability Engineering Reliability is a continuous improvement (Deming wheel) All the people should be involved : Brainstorming Then the main support tool is FMECA

  9. Priorities • FMC finish • Laser beacon • Power System (Rosanna) • DOM FMECA Update of the DOM • BPS protection version circuit • CLBV3 • WRS

  10. RAMS ANALYSIS METHODOLOGY

  11. RAMS Tool Define maintenance resources Components BILL of material import Generic components FIDES data / Reliability models data (from Fides analysis) Reliability factors audit Graphical functions display Failures modes analysis Sort components failure rates Tools (for analysis) Failures rates summary / function Functional analysis (input for FMECA and failure rate analysis) Component rating / reliability models selection. Individual FIT display Process factor audit tool Configuration management

  12. FMECA form example

  13. INPUTS • Necessary inputs for analysis: • Latest design files (Bill of material and related schematics, drawing, firmware, software, gerbers…) • Design changes tracking: please don’t changes all the reference designators from one version to the other • Technical report and functional analysis • Tests reports (including current, power measurement, thermal analysis when available, EMC…)

  14. Failure rate analysis Failure rate repartition: Bathtub curve shape: -Infant mortality: conception or manufacturing defects -Usefull life / Maturity: Constant/ random failure -Wear out: Failure rate increasing (not for electronic components) Weibull law for mechanic (No normal life : only wear out)

  15. Reliability data • 2 main sources: • Manufacturer data (@ a given environment  acceleration law should be applied in order to calculate the value for the product application) • Handbooks (Fides is strongly recommanded for KM3NET) • Define life profile (phase duration and constraints in term of temperature, humidity, vibrating…)

  16. Failure rate data (Fides) FIT data: Failure In Time

  17. APC RAMS Tools -This excel is the main tool for RAMS analysis to collect all data and analyse reliability -Developed by Stéphane Colonges @ APC -Allow to define all functions and assembly levels -Allow to import bill of material -Allow import FIT data (from Fides analysis “Excel_file_fides_result”, manufacturer, field data, or other handbooks) -Audit process tool : to determine Pi Process (impact directly FIT data calculated with Pi Process = 1) -Allow simplifying and accelerate failure rate calculation using reliability models (generic components failure rate data calculated for the application life cycle): Example: Ceramic capacitor 10 µF – 10V for decoupling, rating 50% and not placed in interface could be selected as CAPA_CER_HCV_0,5_Typ2_NIP reliability model -Analyse failure rate / function / assembly / equipment… -FMECA analysis (with automatic failure occurrence and function relation import) -Maintenance table -Tools available in support of Fides analysis

  18. RAMS Tool Components BILL of material import Generic components FIDES data / Reliability models data (from Fides analysis) Graphical functions display Customized results display Sort components failure rates Tools (for analysis) Failures rates summary / function Functional analysis (input for FMECA and failure rate analysis) Component rating / reliability models selection. Individual FIT display Process factor audit tool Configuration management

  19. RAMS Tool Define maintenance resources Reliability factors audit Failures modes analysis

  20. System qualification • Qualification: Check components maximum rating (HALT: Highly Accelerated Life Test) • - Electrical constraints: Voltages, ESD (design/fmeca/procedures), current, breakdown voltage, EMC • Facilities: Signal generators power supply. Oscilloscope, multimeters, test benches • - Environmental and mechanical constraints: • -Temperature, humidity, vibration, shocks, pressure, chemical pollution, salt, radiations (cumulated dose, transcients…), vaccum, UV… • Facilities: Climatic chambers, Hyperbar chamber, vaccum chamber, vibrating bench, colbalt60 source, particle accelerator Salt

  21. ESS HASS: High Accelerated stress screening (youth failure removing) Cause: bad soldering, bounding defect, low component quality… But: Remove or reveal defect due production (bad soldering, bounding defects, low component quality) or conception (too small pad or bad component placement. Component rating margin too short) … Or problem with the manufacturing procedure (example: humidity catch up during board cleaning). Simulate an initial board aging (burnin) and perform thermal constraints (stress screening)

  22. Burnin and ESS Failures Operation (field data) Experiment feedback ESS procedure Production 0 failures Failures 2nd power off/on Switch Voies Séries des 20 UB t° Control box 1rst power off/on 20 boardssupply Climaticchamber control Climaticchamber control PC

  23. Prressure test Pressure chamber: maximum pressure (certified): 400 bar real-time electronic pressure control available: +-5 barpressure rump up/down: from 1 bar/sec up to 20/bar secpressure cycling possible

  24. Actions: Reliability factors Identify reliability improvement factors: • Design: ESD protection, HiRel and critical components, derating, components placement, thermal dissipation, monitoring parameters, environmental protections, ROHS VsWiskers, components obsolescence • Manufacturing: HASS, assembly process, production strategy (batches), visual inspection, manufacturing and functional tests, IPC class, cleanliness, cabling, repairing actions • Quality factors: documentation, configuration management • Failure mode analysis: failure rate analysis, FMECA Output: Reliability level rating  impact the failure probability

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