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Mass A ssembly

Mass A ssembly. 10.9.13 – Calice Collaboration Meeting LAPP Annecy JGU Mainz - Phi Chau Bruno Bauss , Volker Büscher, Julien Caudron , Reinhold Degele , Karl Heinz Geib , Sascha Krause, Yong Liu, Lucia Masetti , Uli Schäfer, Rouven Spreckels , Stefan Tapprogge , Rainer Wanke.

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Mass A ssembly

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  1. MassAssembly 10.9.13 – CaliceCollaboration Meeting LAPP Annecy JGU Mainz - Phi Chau Bruno Bauss, Volker Büscher, Julien Caudron, Reinhold Degele, Karl Heinz Geib, Sascha Krause, Yong Liu, Lucia Masetti, Uli Schäfer, Rouven Spreckels, Stefan Tapprogge, Rainer Wanke

  2. Wing LDA/CCC Status • AHCAL wing data aggregator has been built • Initial power-up tests successful • System integration started (André, Rouven,…), but further effort required • Firmware for Kintex FPGAs • Firmware / Software for Zynq processor (“MARS ZX3”) • VME-sized clock/control unit acting as MARS test bench • Issues in firmware load stage observed on engineering sample • Further effort required to debug on production silicon available now • For the time being cover all immediate needs (AHCAL LDA/CCC) with adapter modules on “Zedboard” • Clock/control adapters available • Data aggregator adapter ready for production • New batch of clock fan-out units in production • Julien working on software integration

  3. Need for an automaticproduction • AHCAL (final design) • About 8.000.000 tileshavetobeplaced on HBU boards • With an effortof 10 s per tile ~ 8 yearsarenecessaryfortheassembling • Weneed an automaticplacement • With 1 second per placementweneed 1 year MassAssembly

  4. Massproduction • DESY: Productionof HBU boards • ITEP: Productionofthetiles • Heidelberg University: Characterisationoftiles/SiPM • Wuppertal: LEDs • Mainz University: Placement ofthetiles on the HBU board, functionalitytestsoftheassembledboards MassAssembly

  5. Automaticplacement • Pick-and-place machine • Cameradetectstiles/SiPMsandsuctioncupplacesthem on the HBU (SiPMpinsthroughthepinholes) • Vision systemdetectstilesandtheSiPMpinsqualityassurance • Problem: Reflectivesurfaceofthetiles • Pick-and-place maschineswith Vision systems workswithlight todetectthepins Pick-and-place machine MassAssembly

  6. Cameratests • Wehaveproduceddummytilesforcameratestsatmachinemanufactors • 3 companieshaveconfirmed, thatvisionsystemcan handle thetiles MassAssembly

  7. Current design • Mountingoftile on HBU board: • Tileshavetobeenpushedintothealignmentpinholes • Verysmalltolerancesareneededto fit • With 4 pins (2 SiPMpins, 2 allignmentpins), toleranceshavetobequitebig Original design: Alignmentpins HBU Pin (SiPM) SiPM Reflectorfoil Absorption layer MassAssembly

  8. Modified design: Option 1 – Not wrappedtile • Mountingofmodifiedtile on HBU board: • Plane tileswithoutalignmentpins • Requires: Fixation ofthetilewithgluepointbetweentileandreflectorfoil • Just 2 pins(fromSiPM)  tolerancesarelessdemanding Original design: Gluepoint HBU Pin (SiPM) SiPM Reflectorfoil Absorption layer MassAssembly

  9. Modified design: Option 2 – wrappedtile (Uni Hamburg) • Mountingofmodifiedwrappedtileon HBU board: • Tileiswrappedwithreflectorfoilandflexpinconnector • Fixation ofthetilewithgluepointbetweenHBU andreflectorfoil Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM Absorption layer MassAssembly

  10. Automaticplacement • Screen printer • Sets gluepoints on thesurfaceofthe HBU • High adhesiveglueisneeded, becausewedon‘twantany time fordrying-out theglue • Silicone • Potential issue: DoesGluepointreduce light yield?  Tests Pick-and-place machine Screen printer MassAssembly

  11. Measurement Set-up • Measurement oftheinfluence on theopticalpropertieswithcosmics Amplifier Trigger scintillator MassAssembly

  12. Measurement Set-up • Measurement oftheinfluence on theopticalpropertieswithcosmics Trigger scintillator Amplifier Tilebetweentwolayersofreflectorfoil SiPM MassAssembly

  13. First measurement • The firstmeasurementsarefinished • 2 ITEP tileswith 2 Hamamatsu MPPC S10943-8584(X) aremeasuredwithcosmics • Unmodifiedwithoutgluepoints • Withoutallignmentpinswithgluepoints (allignmentpinsareremoved, << 1 ml siliconeisplacedon tile) Tileglued on reflectorfoil Gluepoints MassAssembly

  14. First results MassAssembly

  15. Result • Light yieldofthemodified design isbetterthan light yieldofcurrent design • Latertestscandeterminatetheconfigurationwiththebestopticalproperties. Wewanttotest different settingswith • Different glue • Glueshapes • Quantityofglue • Position oftheglue MassAssembly

  16. Automaticplacement • Conveyor • Transports theboardsfrom Pick-and-place machinetosolderingmaschine • Problem: Board iscompletelyfilledwithtiles  Transportation is not possible Pick-and-place machine Screen printer MassAssembly

  17. 5 mm Perforation • Solution: theexistingperforatedframeshouldstayuntilthewholeplacementprocessisfinished • After thatitcanberemoved Proposalformodificationsofmassproduction

  18. Automaticplacement selectivesolderingwouldtake 3-8s per solderingposition (x144 solderingpositions per board)  Wave solderingmachine • Fastest solderingtechnique Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  19. Wave solderingmachine https://www.youtube.com/watch?v=inHzaJIE7-4 MassAssembly

  20. Automaticplacement • Wave solderingmachine • Problem: Board isallreadyassembled  Weneed a solderingmask Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  21. Solderingmask Solderingpositions Protectivebagfor SMD components MassAssembly

  22. Automaticplacement • Wave solderingmachine • Solderingprocessdefines (andlimits) the design ofthe HBU boardandthestructureoftheSiPMpins: • thediameteroftheSiPMpinsandboreholes • positionofcomponents • SiPMpin hole position  Modificationsofthe HBU boardisneeded Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  23. SiPMpin-, boreholediameterandshape • pinholesshouldbe 3 mm larger thanthepins • We also wantmaximally robust pins • Pins couldbepushedawayfromthesolder Pins with ~ 0,5 mm diameterare optimal • The pinlengthshouldbearound1 mm outside thehole 3 mm Pin Pin hole 1 mm MassAssembly

  24. SiPMpin-, boreholediameterandshape • Recommended Area aroundtheSiPMholeswithoutany SMD components: 3 mm radius • Asymmetric Area aroundtheSiPMholeswithout SMD componentsarepossiblewith a minimumradiusof 1 mm and 3 mm on theotherside 3 mm Pin hole 1 mm Area without SMD components MassAssembly

  25. Additional advice: • Components neartheSiPMconnectorsshouldbeplacedwiththeshortsidetotheholes • The componentsstayfixed on oneside, evenifone pad isheatedup • componentsnearthepinholescan‘tbesoldered out good bad

  26. Bridge effect In thisorientation problematicforsomewavesolderingmachines 2 1 3 Soldering Wave pins Solderingbridge pinholes Withthisorientation, thebridgeeffectcanoccur The pinholesarefilledwithsolder The HBU boardistransportedfromrighttoleft (In thecoordinatesystemoftheboard Wave movedfromlefttoright) MassAssembly

  27. Solderingdirection Forexample: atthisposition a rotationis not possible • Ideal conditions: Pin holeshavepreferreddirections • Newerwavesolderingmachinescan handle thiswithoutdesign changes • SolderingmaskcanberotatedEffectivesizeoftheboardin transportationdirectionisbigger (just withbigsolderingmachines)

  28. Additional testsforsoldering • Temperaturetestsforeverycomponent (simulationofSolderingwave) • If HBU boardcouldbechange Create a solderingmaskandsolderingtests MassAssembly

  29. SMD SiPMs • With SMD SiPMstheassemblingwouldbeeasier • Wewon‘tneed a solderingmachineandthe THT optimization • More s. nextpresentationfrom Yong Liu MassAssembly

  30. Automaticplacement • Functionalitytests • Fullyassembled HBU testset-up (with LEDs on the Board) • Currentlysettingup AHCAL DAQ for fast testing Pick-and-place machine Wave solderingmachine Screen printer Functionalitytests MassAssembly

  31. Conclusion • Procedurefor fast massassemblyhasbeendefined • Massassemblyrequiresnumerous design modifications • Initial testssucessful • Fullproductionline will besetup in Mainz fordemonstratingmassassemblywiththe large prototype MassAssembly

  32. Thankyouforyourattention!

  33. Backup

  34. Reference labels • Finetuningadvice: More referencelabels on theperforatedframe (Mydata) • Existinglabelscan‘tberecognized after assembling • Reference labelsshouldbe on thesideofthetilesandtheyshouldbe on theframe MassAssembly

  35. Tiles/SiPM • Mountingof Hamburg tileon HBU board: • Black surfaceofthewrappedtile opticalcapturewithcamerasiseasiertorealize Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM PborFeabsorptionlayer MassAssembly

  36. Tiles/SiPM • MountingofHamburg tileon HBU board: • Noteststillnowforwrappedsurface (testsofsuctioncupof pick-and-place machine) Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM PborFeabsorptionlayer MassAssembly

  37. SiPMpinshape • Round pinsare easy, rectangularpinsaremoredifficulttosolder ( distances in the hole aren‘tconstant) MassAssembly

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