2014 Thunderball RFQ Thermal Simulation

1. 2014 Thunderball RFQ Thermal Simulation Kenson Hung | Thermal Dept.

2. Panel control board skin suggest Update Target To improve panel skin temperature of control board area. Suggest: 1. Enlarge Panel PCB size. PCB_200x10 mm change to 190x16mm, improve~2.0’C 2. Change Panel B/L structure materials to Al metal. SUS metal to Al, improve~1.5’C 3. Attach high thermal conductivity materials on Panel control board area. attach Cu foil, improve~3’C 4. Changing switching Freq. of LED Driver Freq. From 1MHz to 0.44MHz, improve~1.0’C

3. Thunderball 11.6” Swap air gap Skin temperature of Glass surface is helpless if gap from 0.1 change to 0.15. Original solution Swap air gap 0.10.15mm CPU area_41.4’C CPU area_41.5’C Glass skin A cover skin CPU area_44.7’C CPU area_44.7’C Version

4. Thunderball 11.6” Summary table Skin temperature of SOC area is over 5.8’C if SOC+DDR power =2.5W. ＊ Skin temp. better than other machine meet spec +6.0’C (spec △T=9’C) +5.8’C (spec △T=9’C) meet spec +6.9’C (spec △T=9’C) Note. Due to Android OS can’t running 3DMark so use play gaming and 1080P movie to estimate. Version

5. T40S - Skin Solution for 2.5W Attach CU foil on panel & A cover. Attach Cu foil on between SOC and Shield Can. Glass View A cover View * Skin solution on panel side (for SOC area hot spot) Cu foil: 100 x 60 x 0.1 mm * SOC solution on shield Can pad : 14 x 14 x 0.5 mm 0809 Update: * SOC solution on shield Can Cu foil : 50 x 50 x 0.05 mm (For T40S 2.5W) * Skin solution on panel side (for panel control board hot spot) Cu foil : 150 x 50 x 0.1 mm-convertor * Skin solution on bottom door (for SOC area hot spot) Cu foil : 150 x 90 x 0.1 mm Version

6. Detail Power Consumption Simulation Model SOC WIFI eMMC 3G SOC+DDR Power data is refer Nvidia Tegra 4 DA_06681-R17 PMIC Scenario 1 – play “Riptide” game mode: SOC+DDR 2.50w+0.35W=2.85 / Total System Power 8.38W Scenario 2 – 1080P movie mode : SOC+DDR 0.65W / Total System Power 6.15 W Battery DDR Version

7. Thunderball 11.6” Stack-Up Analysis Add Cu foil on between CPU and Shield Can for 2.5W require. (Detail stack-up please refer to ME proposal) Version

8. Thunderball 11.6” Skin temperature for 2.5W Scenario 1_play game mode: T-ambient 30’C Glass View A cover View SOC area_47.6’C SOC area_44.8’C Glass surface Spec=39’C Class 2 surface Spec=54C Class 1 surface Spec=39C Panel convertor_45.9’C Control board_38.8’C • Based on simulation: • Glass skin of SOCarea is over 5.8’C • Glass skin of panel converter is over 6.9’C • A cover skin is under spec. Version

9. Thermal Skin suggest Target: All skin temperature under SVTP spec Suggest: 1. For SOC area, increase the gap between M/B and Panel to 3.5mm (original gap=1.5mm) 2. For Panel control board area, need Panel vendor to add solution or reduce power consumption of Panel.

10. Thunderball 11.6” Compare other machine • Result: • Thunderball skin temperature is better than other machine w/ FHD panel. • Panel control board will impact skin temperature, need co-work with panel vendor to reduce control board temperature.

11. Thunderball 11.6” Skin temperature with skin solution Scenario 2_1080P movie mode: T-ambient 30’C Glass View A cover View SOC area_38.3’C Glass surface Spec=39’C Class 2 surface Spec=54C Class 1 surface Spec=39C Panel convertor_45.0C SOC area_40.5’C • Based on simulation: • Glass skin of panel converter is over 6.0’C • A cover skin is under spec. Version

12. Thunderball 11.6”T50 Thermal design 1. IF T50 power consumption & behavior ～T40S (thermal design Target 2.5W) T40 thermal solution can leverage to T50 2. IF T50 power consumption & behavior > T40S Solution a : attach Cu foil on Shielding case to improve thermal capacity. Solution b : attach thermal pad that transfer M/B heat to Mid frame

13. Thanks Version