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2014 Skyfall AMD RFQ EE Proposal

2014 Skyfall AMD RFQ EE Proposal. JeffYC Lin, Kenny Lu | HW9 Dept. Content. Content: Hardware Functional Block Diagram Key Component List System Connection MB Placement MB PCB Routing Proposal Daughter Board Placement PCB stack up PCB Impedance Control.

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2014 Skyfall AMD RFQ EE Proposal

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  1. 2014 Skyfall AMD RFQ EE Proposal JeffYC Lin, Kenny Lu | HW9 Dept.

  2. Content Content: • Hardware Functional Block Diagram • Key Component List • System Connection • MB Placement • MB PCB Routing Proposal • Daughter Board Placement • PCB stack up • PCB Impedance Control Version

  3. Skyfall Slate 11.6” AMD Mullins Block Diagram Update DDR3L 1333MHz 1CH eDP 11.6” eDP Panel 4GbX16 PCIE USB30 RTS5825 Port2 Port1 Front Camera Card reader RTS5239 WLAN (MiniPCIe slot) USB30 RTS5880 Rear Camera SPI Flash ROM (8MB) HDA Audio codec IDT 92HD95 Int. SPK LPC Bus EC ITE IT8380 SATA 2.5” HDD HP AMP HPA00929 • ALS • CM32181 I2C DMIC USB20 Accelerometer +e-Com+Gyro MPU-9250 Combo jack PCIE TPM 2.0 SLB9656TT12 STM32F103CBU6 Fresco Logic FL1100 Follow mini spec V1.5 USB2.0 WWAN HDMI I2C USB30 USB30 Touch screen Re-driver Re-driver Re-driver USB2.0 Docking connector to Base USB3.0*1/USB3.0 PD port/USB2.0 Card reader, T/P/I2C EC/I2C/HDMI Version 3

  4. Skyfall Slate 13.3” AMD Mullins Block Diagram Update DDR3L 1333MHz 1CH eDP 11.6” eDP Panel 4GbX16 PCIE USB30 RTS5825 Port2 Port1 Front Camera Card reader RTS5239 WLAN (MiniPCIe slot) SPI Flash ROM (8MB) HDA Audio codec IDT 92HD95 Int. SPK LPC Bus EC ITE IT8380 SATA 2.5” HDD HP AMP HPA00929 • ALS • CM32181 I2C DMIC USB20 Accelerometer +e-Com+Gyro MPU-9250 Combo jack PCIE TPM 2.0 SLB9656TT12 STM32F103CBU6 Fresco Logic FL1100 Follow mini spec V1.5 USB2.0 WWAN HDMI USB30 USB30 I2C Touch screen Re-driver Re-driver Re-driver USB2.0 Docking connector to Base USB3.0*1/USB3.0 PD port/USB2.0 Card reader, T/P/I2C EC/I2C/HDMI Version 4

  5. Update Key component list Version

  6. Skyfall 11.6”/13.3” System Connection Version

  7. System Connection – Cable List(11.6”) Update For Scenario(add audio jack on Base) Change FFC to 14pin Change FPC to 70pin Version

  8. System Connection – Cable List(13.3”) Update For Scenario(add audio jack on Base) Change FFC to 14pin Change FPC to 70pin Version

  9. Main board placement Bottom Audio Power BTN Volume WLAN WWAN Front Camera Sensor 0.9V 3V/5V Charge 1x2 USB30 Bridge V Core Mullins ROM 1.35V Battery Touch CTRL DB SIM DC-IN eDP Connector DockingConnector HDD 9

  10. Main board placement Top 11” Rear Camera KBC TPM 10

  11. MB PCB Routing Proposal – High Speed IN1 DDR3L DATA DDR3L Add/CMD Version 11

  12. MB PCB Routing Proposal – High Speed IN2 DDR3L Add/CMD Version 12

  13. MB PCB Routing Proposal – High Speed IN4 DDR3L Add/CMD Version 13

  14. Daughter Board – Touch Control Board TOP Low-speed VCC IN1 Low-speed IN2 Low-speed GND BOT Low-speed Version Version

  15. Daughter Board – Docking Board Version Version

  16. PCB Stack up PCB: 10 layers, Thickness: 1mm DDR,SATA,MiPi,eDP DDR,USB2.0,Pci-e,USB3.0 DDR,HDMI,USB2.0,PCI-e Version 16

  17. PCB Stack up – Sub-board Touch Screen Board PCB: HDI (1-4-1) , Thickness: 1mm Sub-Board PCB: 6L, Thickness: 1mm Version 17

  18. PCB Impedance Control Version 18

  19. Thank you Version 19

  20. Back-up Home Key HW study Version

  21. Home Key scenario 1 : ENE Cap. sensor solution Update X length > 30mm Home key Pad Pad Pad Y length >9mm Currently ME drawing Y-axial = 7mm. Need extend 2mm. Version 21

  22. Home Key scenario 2: P sensor solution Update Sensor pad Center of home key 5 mm X 5 mm P sensor solution can meet current ME X/Y axial dimension Version 22

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