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2014 Thunderball RFQ EE Proposal. JeffYC Lin, Kenny Lu | HW9 Dept. Content. Hardware Functional Block Diagram Key Component List System Connection MB placement MB PCB routing proposal Daughter board routing proposal PCB stack up PCB impedance control. NVIDIA Tegra 4 T40S.
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2014 Thunderball RFQ EE Proposal JeffYC Lin, Kenny Lu | HW9 Dept.
Content • Hardware Functional Block Diagram • Key Component List • System Connection • MB placement • MB PCB routing proposal • Daughter board routing proposal • PCB stack up • PCB impedance control Version
NVIDIA Tegra 4 T40S • Thunderball 11.6” block diagram eDP DSI eDP bridge Toshiba TC358770 32 bits DDR3L 2GB (512MB x 16 x 4 pcs) System Storage eMMC MMC Flash (16/32/64GB) SDIO NGFF WLAN 802.11agn/ BT CSI_0 UART Front Camera I2S CSI_1 Rear Camera I2S/I2C Audio Codec IDT ACS422D68 DMIC USB2.0 HSIC NGFF WWAN 3G Module HSIC Bridge Beats AMP TPA6130A2YZHR Combo Jack SIMM Slot I2S/I2C Speaker AMP TFA9890 USB1 Speaker x2 Card reader RTS5141 MUX USB3 GNE_I2C USB 3.0 HUB 1x4 Accelerometer + E-compass + GYRO MPU-9250 Micro SD socket Ambient Light sensor CM32181A3 P sensor IQS1280000EBTSR Touch Screen Docking connector to Base/Soft KB cover USB3.0*1/USB3.0 PD port/USB2.0 Card reader/I2C EC/I2C/HDMI UART GPS Broadcom4752 PWR_I2C PMIC TPS658621 Version 3
NVIDIA Tegra 4 T40S • Thunderball 13.3” block diagram eDP DSI eDP bridge Toshiba TC358770 32 bits DDR3L 2GB (512MB x 16 x 4 pcs) System Storage eMMC MMC Flash ( 32/64GB) SDIO NGFF WLAN 802.11agn/ BT CSI_0 UART Front Camera I2S I2S/I2C Audio Codec IDT ACS422D68 DMIC NGFF WWAN 3G Module HSIC Bridge Beats AMP TPA6130A2YZHR Combo Jack SIMM Slot I2S/I2C Speaker AMP TFA9890 USB1 Speaker x2 Card reader RTS5141 MUX USB3 GNE_I2C USB 3.0 HUB 1x4 Accelerometer + E-compass + GYRO MPU-9250 Micro SD socket Ambient Light sensor CM32181A3 P sensor IQS1280000EBTSR Touch Screen Docking connector to Base/Soft KB cover USB3.0*1/USB3.0 PD port/USB2.0 Card reader/I2C EC/I2C/HDMI UART GPS Broadcom4752 PWR_I2C PMIC TPS658621 Version 4
Key Component list Version 5
System Connection – Cable List (11.6”) Update For Scenario(add audio jack on Base) Change FPC to 70pin Version 7
System Connection – Cable List (13.3”) Update For Scenario(add audio jack on Base) Change FPC to 70pin Version 8
MB placement – Bottom(Baseline) Front Camera WLAN WWAN DDR3L Tegra T40S eMMC PMIC Version 9
MB placement – Top(baseline) Light sensor DB Connector Rear Camera Volume DB Connector Power DB Connector Audio DB Connector Battery Connector G sensor GYRO e-compass Codec SIM DCIN Connector Touch Connector eDP translator USB3.0 HUB eDP Connector Docking Connector Version 10
MB placement – Bottom(GPS) GPS Front Camera GPS ANT WLAN WWAN DDR3L Tegra T40S eMMC PMIC Version 11
MB placement – Top(GPS) Light sensor DB Connector Rear Camera Volume DB Connector Power DB Connector Audio DB Connector Battery Connector G sensor GYRO e-compass Codec SIM DCIN Connector Touch Connector eDP translator USB3.0 HUB eDP Connector Docking Connector Version 12
MB routing proposal IN4 Version 13
MB routing proposal IN3 Version 14
MB routing proposal IN2 Version 15
MB routing proposal IN1 Due to SVTP 5.06 RF critical issue for DDR trace routing and limit TOP/BOT cannot route DDR trace. Need use 4 inner layers to routing all DDR trace. Version 16
Daughter Board – Touch Control Board TOP Low-speed VCC IN1 Low-speed IN2 Low-speed GND BOT Low-speed Version 17 Version 17
Daughter Board – Docking Board Version Version
M/B PCB Stack up PCB: 10 layers HDI board (2-6-2+), Thickness: 0.9mm DDR, CSI DDR, I2S DDR, MIPI, SDIO, eMMC, eDP DDR, HDMI, USB Version 19
PCB Stack up – Sub-board Touch Screen Board PCB: HDI (1-4-1) , Thickness: 1mm Sub-Board PCB: 6L, Thickness: 1mm Version 20
PCB impedance control Version 21
Thanks Version