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SGH-E850 SERVICE TRAINING MANUAL. Sei Neu Park H/W Lab 3 SAMSUNG Electronics. Contents. Features Block Diagram --------------- 4 PCB Diagram ----------------- 8 Trouble Shooting ------------- 12 Test Equipment Setting ------ 30. Features. Intenna Phone/ 2Band(GSM900/1800)
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SGH-E850 SERVICE TRAINING MANUAL Sei Neu Park H/W Lab 3 SAMSUNG Electronics
Contents • Features • Block Diagram --------------- 4 • PCB Diagram ----------------- 8 • Trouble Shooting ------------- 12 • Test Equipment Setting ------ 30
Features • Intenna Phone/ 2Band(GSM900/1800) • Mini-Slide type • 0.3 MEGA Pixel Pop-up Camera • 64 Poly Melody • WAP 2.0 / IrDA • MMS, JAVA, SMS
Schematic Diagram (RF Part) PAM: BGY284E RFIC: UAA3587
MAIN PCB Diagram (Top) IRDA CONNECTOR FEM(switch duplexer) PAM RF MODULE(SI4205) YAMAHA BACKEND IC (MULTIMEDIA CHIP) BB(TRIDENT 2 +CSP2200B1) CHARGER IC MEMORY EL CONNECTOR
MAIN PCB Diagram (Bottom) HALL IC
LCD PCB Diagram (top) Camera Sensor
Trouble Shooting (Initial) #1 PWR_KEEP:from TR PWR ON CASE 1.LAB:JIG_ON 2.REAL:USE BAT
Trouble Shooting (Charging) CN300:IF CON
Trouble Shooting (Audio Part, MIC) R426:MIC BIAS
Trouble Shooting (Pop-up sensor) U101:Pop-up sensor
Test Equipment Setting • JIG: Download, Trace, Calibration, etc • RF test cable: RF test • Test cable: PC to phone • Serial cable: PC to JIG • Power supply cable • TA (Travel Adaptor) • Data Cable : USB cable • (mostly for customers)