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SGH-Q200 Service Training

SGH-Q200 Service Training. Kyoungin Kim. R&D Group 3, Mobile Comm. Div. Samsung Electronics. CONTENTS. General Information How to assemble the SGH-Q200 Block Diagram and Schematics Circuit Description Phone test Download, Autocal, IMEI , Repair PGM.. Power Levels and Waveforms on PBA

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SGH-Q200 Service Training

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  1. SGH-Q200 Service Training Kyoungin Kim R&D Group 3, Mobile Comm. Div. Samsung Electronics

  2. CONTENTS • General Information • How to assemble the SGH-Q200 • Block Diagram and Schematics • Circuit Description • Phone test • Download, Autocal, IMEI , Repair PGM.. • Power Levels and Waveforms on PBA • Troubleshooting Guide (Refer to SVC Manual)

  3. General Information Frequency range: Channel bandwidth: 200kHz Fundamental frequency:13MHz Intermediate frequencies Tx IF: 270MHz(G), 135MHz(D) Rx IF: 1’st IF ->225Hz, 2’nd IF -> 45MHz

  4. General Information Solution : Agere system(Lucent technology) Design : Dual folder LCD : 128 x 128 Memory : 48M/4M Size and Weight :85(H)x47(W)x19.8(D), 90g Funtion : GPRS Class 8, EFR/FR, WAP, GAME ..etc Operating Time

  5. General Information • The chipset for SGH-Q200 • Trident : Baseband processor • CSP : conversion signal processor • PSC2005 : Power Management IC • LRS1337 : Flash Memory(SRAM) • Atmel : Flash Memory • APCIC : Auto Power Control IC • BRIGHT3 : Dual band Tranceiver

  6. Exploded View of SGH-Q200

  7. Top View of SGH-Q200

  8. Bottom View of SGH-Q200

  9. Block Diagram (Radio Part)

  10. Block Diagram (Baseband Part)

  11. Circuit Description: Front-End • Antenna (ANT1002) • Transmitting and Receiving the information desired from air interface. • RF Test Switch (CN1001) • This is for adjusting and testing the handset in conjunction with the test equipment such as HP8922M or HP8960. • Diplexer (U1006) • It operates such like a combination of Rx filter and Tx filter, and provides agreeable isolation between Tx and Rx.

  12. Circuit Description: Rx • LNA • It amplifies weak signal by 14~20dB without increasing the noise significantly. This provides “Step Gain AGC” of ~35dB so that it supplements narrow dynamic range of Rx AGC. • RF Rx SAW Filter (F901:GSM , F903:DCS) • It has the bandwidth of Rx frequencies, and suppresses interferers which can do affect the IF signal • 1st Down-conversion Mixer • Received RF carrier is converted to 1st IF (225MHz). Local signal is needed for frequency mixing. It has ~9dB conversion gain, in general.

  13. Circuit Description: Rx • IF SAW Filter (F902) • Center frequency is 225MHz. It suppresses unwanted image signals made in the 1st mixer • 2nd Down-conversion Mixer • 1st IF is converted to 2nd IF of 45MHz.. • 2nd IF LC Filter • It has 200kHz bandwidth with 45MHz center frequency. It attenuates images from the 2nd mixer • RSSI • It produces DC voltage according to the received signal strength.

  14. Circuit Description: Rx • PGA • Sets the programmable gain array to one of 50 values separated by 2dB • [000000] ~[110001]

  15. Circuit Description: Rx - Digital • Rx AGC • The purpose of Rx AGC is to maintain the Rx I/Q voltage level, regardless of the received signal strength. In general, Rx AGC has the dynamic range of around 70dB.. • Rx I/Q Demodulator • It generates both in-phase (I) and quadrature (Q) components of the signal while translating the IF signal to baseband.

  16. Circuit Description: Local • VC-TCXO (OSC801) • 13MHz fundamental frequency for PLLs and Baseband chipset (U601). • RF VCO (OSC901) • It supplies Local source frequency higher than RF carrier by 225MHz in conjunction with PLL(GSM) • Lower than RF carrier by 225MHz in conjuntion with PLL(DCS) • Higher than Tx RF carrier by 270MHz in conjuntion with PLL • IF VCO (OSC902) • It generates 1080MHz frequency for up-converting Tx I/Q signal to Tx IF and Rx signal to RxIF • TX VCO (OSC903) • Frequency : 880~915MHz(G), 1710~1785MHz(D)

  17. Circuit Description: Tx 1.Tx I/Q modulator • Tx I and Q signals are combined and up-converted to 270(G),135(D)MHz frequency. I, Q voltage levels are 1Vp-p, respectively. 2.PAM (U1002) • It increases Tx power level so that PA is capable of transmitting the maximum power up to 35dBm • High gain 3stage amplifier: 0dBm input Typ • 2in/2out dual band amplifier • One power control pin with one band switch

  18. Circuit Description: Tx • APCIC (U1001) • Dual Band Power control IC for TX power Amp • has ~55 dB dynamic range, • Contains power detector and operantional Amp • converts RF power into DC level. 2. Coupler :F1001(G), F1002(D) • The coupling factor is 14dB,20dB. That is, “P(PA output) – 14dB,-20dB” is transmitted to the power detector circuitry

  19. Circuit Description: Logic TRIDENT (U601) • Baseband Engine • Includes the DSP16000 core,ARM7TDMI microcontroller core,and a standard sets of peripherals for the DSP and ARM • communicates with Memory, Keypad, LCD, and other peripherals • DSP RAM :20k x 16 • DSP ROM : 144k x 16 • ARM RAM : 2k x 32 RAM(byte writable) • ARM ROM : 4k x 32 ROM(mask-programmable) • Processor Interface memory : 512 x 16 shared RAM

  20. Circuit Description: Logic TRIDENT (U601) • ARM7TDMI 32-bit microprocessor : main call processing. • 32.768kHz X-tal Oscillator : the sleep mode • The interface circuitry : reset circuit, address bus (A0-A20), data bus (D0-D15), contrognals(CP_WEN,CP_OEN,EAR_EN,LED_CTL, etc), GPIOs, and the communication ports. • Communication ports : UART1 and 2, the JTAG etc. • UART1 supports HP equipment interface, down loading, and data service. • UART2 and the JTAG are used for the software debugging.

  21. Circuit Description: Logic CSP 1099 (U701) • Baseband radio and voiceband audio interfaces • Baseband receive path • Buffer, 10-bit ADC, PGA • Baseband transmit path • Transmit buffer, GMSK modulator, 9-bit DAC • ADC and DACs for Radio and Monitoring • 10-bit ADC for sampling RSSI, TXP, and etc • Voiceband Receive Path :speaker , mic • Event timing and control register • To control both B/B receive and B/B transmit activity • Power ramping control

  22. Circuit Description: Logic PMIC(PSC2005:U101) • Includes six low-dropout voltage regulator • LDO1-1.8v, LDO2:VCCD, LDO3:Vrf • LDO4-Vapc,LDO5:Vosc/syn,LDO6:VCCA • 250ms system reset generator • To ensure proper initialization of the system controller • 12bit monotonic DAC • Pwr_sw1,Pwr_sw2,CS => active low.

  23. Circuit Description: Logic Flash memory • Flash ROM:U501(32M x 1),U1010(16M x1) • The 48Mbit FLASH ROM is used to store code of the application program. Using the down-loader program, this application program can be changed even after the mobile is fully assembled. • SRAM • The 4Mbit SRAM is used to store the internal flag information, call processing data, and timer data.

  24. Circuit Description: Logic • Power On • Press of END key  BATT and POW_ON signals are connected  Q204 turn-on  Q102 turn-on, that is, BATT is connected to VBAT  VBAT is supplied to U101  VCCD and VCCA are applied to U101, U601  VCTCXO signal is enabled  VC-TCXO (OSC801) is operating  Once U601 runs without error, U601 enables POWER_KEEP signal • Power Off • Press of END key  Q204 turn-on  U601 checks  BB_PWR turns logic high to low  Main application program enter to Power Off mode

  25. Circuit Description: Logic Key Pad • The Key Pad is belong to main board. For key-press recognition, the structure of key is consisted of 5 x 5 matrix, which is used input signal key_col(0-4) and output signal key_row(0-4) of Trident. LCD MODULE • LCD module is connected to main board by FPCB. This contains an LCD controller. An LCD controller controls the information of displaying from the Trident (parallel 8-bit data) to the LCD.

  26. Test Interface Jig Data cable Test cable

  27. Downloading Setup

  28. Auto calibration Program Setting GPIB CABLE E3632A HP GPIB CARD

  29. Auto calibration Processing

  30. Auto calibration Processing click click click

  31. Auto calibration Processing click

  32. Auto calibration Processing click

  33. IMEI Processing 1.execute winl108tQ200.exe file 2. Select country 3. Click Change H/W ver click

  34. IMEI Processing 1.write H/W ver 2.click write IMEI

  35. IMEI Processing 2.write imei 1.click 3.click 4.click

  36. Repair program Processing

  37. Repair program Processing click click

  38. Repair program Processing

  39. Repair program Processing click

  40. HP8960 Power Supply SDS - + POWER ON S/W DC 4.0V SAMSUNG DEBUG TEST PACK GPRS TEST JIG SDS D/L DEBUG DSP S/W JTAG Phone Test Setup GPIB CABLE Gpib cardt RF Test Cable PC Com1 port

  41. Test Information • Test Equipment is HP8960 or CMD55. • Mode : Test mode • (Tx : BCH+TCH, Rx : CW generator) • Tx power level pass/fail limit have to be modified to allow calibrated Tx power levels of SGH-Q200

  42. Power Level & Voltage Waveform Rx Chain – Analog: Measurement Environment Test Mode Cont Rx on HP Setup: RF Generator Screen RF input = -50dBm, RF Gen Freq = 947MHz, (Channel is 60) RF Gen Band =GSM

  43. Power Level & Voltage Waveform Rx Chain Ant s/w In LNA In LNA out

  44. Power Level & Voltage Waveform Rx Chain Mixer out IF SAW Out Mixer In

  45. Power Level & Voltage Waveform Rx Chain 2’nd mixer out

  46. Power Level & Voltage Waveform Tx Chain • Active Cell mode • HP Setup RF input = -50dBm, TCH Channel = 60CH RF Gen Band = GSM

  47. Power Level & Voltage Waveform Tx Chain Tx locking 0.8~2.5V TxIP TXEN1

  48. Voltage Waveforms: Local OSC901 RF Local @ 62CH OSC902 IF Local

  49. Voltage Waveforms: Logic OSC801.4 13MHz TCXO Out osc601 32.768kHz clock

  50. Repair Examples

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